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   Gold Premier Sponsor:
   Silver Premier Sponsor:
Natel - Premier Sponsor, Platinum
Heraeus Materials Technology - Premier Sponsor, Gold
Metalor - Premier Sponsor, Silver

IMAPS 2012 - San Diego
45th International Symposium on Microelectronics
Bringing Together The Entire Microelectronics Supply Chain!

September 9 - 13, 2012
San Diego Town & Country Convention Center
San Diego, California, USA

IMAPS 2012 - San Diego

Conference and Exhibition:
September 11-13, 2012
Professional Development Courses:
September 9 - 10, 2012

Message From The General Chair

Rick Sigliano, General Chair

Greetings IMAPS members and the worldwide microelectronics community!

I am honored to be this year’s General Chair for the IMAPS 45th Annual International Symposium on Microelectronics. I hope you can join us September 9-13, 2012 and I welcome your participation. IMAPS 2012 promises to be a special event with a strong technical program, and a large array of technology and manufacturing Suppliers in the main exhibition hall of the Town and Country Convention Center. Please note that our IMAPS team and its many dedicated volunteers have also enhanced the 2012 program with some exciting new features that provide an added International flavor comprising of several exciting sessions from our friends in Europe, Japan and Southeast Asia. New on the 2012 program are a couple of key note addresses highlighting microwave mobile electronics and a key note on an emerging industry addressing wireless medical healthcare for the home. We will also have 19 Professional Development Courses, multiple OEM booths participation on the exhibition show floor, and an expanded roster of market presentations at the Global Business Council Forum.

Held this year in sunny San Diego, California at the Town and Country, where IMAPs will showcase a vast array of technical information and products from many of our high technology company members serving all segments of the microelectronic industry, markets and technology that defines crucial products for the Industrial, Military, Aerospace, Radar, Medical and Semiconductor Industries. Our members serve an essential place in this Supply Chain.

The highlights for this year’s event include:

  • A tremendous technical program with 30 sessions, including excellent coverage on 2.5/3-D Packaging, TSV, Glass Interposers, Electrical Modeling, Signal/Power Integrity, Thermal Management, Pb-Free Processing, Wire Bonding, Medical Device Packaging, Advance Materials, Ceramics/LTCC, Printed Electronics, and of course, the aforementioned special International Track - Packaging and System Integration: A Global Perspective featuring the latest microelectronics packaging developments from Europe Taiwan, and Japan.
  • Four keynote presentations: one on Tuesday, September 11 by Matt Grob, CTO of Qualcomm; one on Wednesday, September 12 on Wireless Health: Remaking of Medicine by Pervasive Technologies by Mehran Mehregany of Case Western University; and new this year, two keynotes on Thursday, September 13 by Subu Iyer of IBM and Rao Tummala of Georgia Tech.
  • New this year! A panel discussion on Thursday morning, September 13: 3D Panel Discussion: Are Supply Chains Ready for 3D Integration Manufacturing?
  • An impressive line-up of 19 Professional Development Courses providing unique opportunities to brush up on your knowledge or move up the learning curve in a new area.
  • The IMAPS Global Business Council Marketing Forum.
  • Extensive student participation, with cash awards for the two best student papers.
  • Exhibitors providing updates on their products and services.
  • A career center for anyone in the market for a new opportunity.
  • A program for college students that includes a visit to Qualcomm Corporate Headquarters.
  • A program with local high schools, giving students a chance to see what the microelectronics industry is all about.
  • A great golf tournament at the Rancho Bernardo Inn, to help us on the “all work and no play” front.

It’s been a great pleasure serving as general chair of this event. I am honored to be surrounded by a diligent and steadfast organizing committee and IMAPS staff. In addition, an event like IMAPS 2012 would not be possible without the support of our sponsors, so I’d like to thank them and highlight our Premier Sponsors NATEL, Heraeus Thick Film Division and Metalor Technologies; along with LORD Corporation as a Corporate Sponsor.

I am also especially impressed and thank the technical team for putting together a very strong program pertinent to the technical demand and requirements of today’s interest.

In the face, of these challenging times, one constant remains in our affiliated array of work disciplines: Electronic technology developments continue to advance at an unprecedented pace on a worldwide scale. As such, it remains critical 4 to stay abreast of the latest new technology, technology applications, new research advances, and new microelectronics offerings to help sustain and grow our businesses. With a superb program that truly brings the entire electronics supply chain together, I can’t think of a better place to stay in tune than at the IMAPS 2012 Symposium in San Diego, CA.

I encourage you take some time from your busy schedule to attend IMAPS 2012, to learn about a diverse scope of technology advancements, meet and collaborate with your peers and create a network of new contacts from all over the world!

See you in San Diego!

Rick Sigliano
Kyocera America




Event Sponsors

Logo Bags, Final Program, Internet Cafe and Convention Hall Signs:
NATEL - Platinum Sponsor

Logo Bags, Final Program, International Reception, Hotel Key Cards and Note Pads/Pens for Technical Sessions:
Heraeus Materials Technology - Premier Sponsor, Gold
Logo Bags, Final Program, and Lanyards :
Metalor - Premier Sponsor, Silver
Proceedings USB Drives:
ALLVIA - USB Proceedings Sponsor
LORD - IMAPS Cafe Sponsor
Keynote Presentations:
Xradia - Keynote Sponsor
Keynote Presentations:
Indium Corp - Keynote Presentations Sponsor
GBC Forum/Reception:
Kyocera America - GBC Forum/Reception Sponsor

GBC Forum/Reception:
Sikama - GBC Forum/Reception Sponsor

Bag Insert:
Reldan Metals - Bag Insert Sponsor
Bag Insert:
Geib Refining - Bag Insert Sponsor
Bag Insert:
Riv, Inc. - Bag Insert Sponsor
Bag Insert:
Proton Onsite - Bag Insert Sponsor
Bag Insert:
Sekisui - Bag Insert Sponsor
OEM Supporting Sponsor:
Qualcomm - OEM Sponsor
OEM Supporting Sponsor:
IBM - OEM Sponsor
Golf Sponsors
Golf "Birdie" Sponsor &
Hole #13 (Closest to Pin):

LORD - Golf "Birdie" Sponsor
Golf Ball Markers:
Circuit Solutions, Inc. - Golf Ball Markers Sponsor
Golf Hole Sponsor:
Technic - Golf Hole Sponsor
Golf Hole Sponsor: Golf Hole Sponsor: Coining Inc/Ametek
Golf Hole #11 (Closest to Pin):
Golf Hole Sponsor: AGC Electronics America

Golf Hole #2 (Closest to Pin):
Hole Sponsor: NAMICS

Golf Hole Sponsor:

DPC/GBC Premier Sponsor: ASE US, Inc.

Golf Hole #4 (Closest to Pin):
Golf Hole Sponsor: Infinite Graphics
Media Sponsors
MEPTEC - Media Sponsor
US Tech - Media Sponsor
3D Incites - Media Sponsor
Antennas Online - Media Sponsor
Electronics Protection - Media Sponsor
LED Journal - Media Sponsor
Thermal News - Media Sponsor


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