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Metalor - Premier Sponsor, Silver

IMAPS 2012 - San Diego
45th International Symposium on Microelectronics
Bringing Together The Entire Microelectronics Supply Chain!

September 9 - 13, 2012
San Diego Town & Country Convention Center
San Diego, California, USA

IMAPS 2012 - San Diego

Conference and Exhibition:
September 11-13, 2012
Professional Development Courses:
September 9 - 10, 2012

Interactive Forum - University Poster Session

University Poster Session - Interactive Forum
Tuesday, September 11, 2012
Session 2:30 pm - 4:30 pm

Chairs: Venky Sundaram, Georgia Tech

One-on-One Interactive Forum. This is your chance for detailed interaction with authors whose work is too good to miss.

Evaluating the Impact of Dwell Time on Solder Interconnect Durability under Bending Loads
Sandeep Menon, CALCE, University of Maryland (Michael Osterman, Michael Pecht)

Impact of etch factor on characteristic impedance, crosstalk and board density
Abdelghani Renbi, Lulea University of Technology (Arash Risseh, Rikard Qvarnstrom, Jerker Delsing)

Comparison of Silver vs. Gold Systems in High-Q FTTF LTCC Inductors
Matthew Clewell, Kansas State University (William B Kuhn)

Manual Assembly of 400um Bumped-Die GaN Power Semiconductor Devices
Sidni Hale, Auburn University (Stephan W. Henning, Luke Jenkins, Christopher G. Wilson, John Tennant, Justin Moses, Mike Palmer and Robert N. Dean)

Design, Optimization and Robustness of Quilt Packaging Superconnect
M. Ashraf Khan, Department of Electrical Engineering, University of Notre Dame (Jason M. Kulick, Alfred M. Kriman, and Gary H. Bernstein)

BGA Life Prediction under Combined Temperature and Power Cycling
Fei Chai, CALCE, University of Maryland (Michael Osterman)

Underfill Dispensing for 3D Die Stacking with Through Silicon Vias
Fred Fuliang Le, HKUST (Ricky Lee, Jingshen Wu, Matthew Yuen)

The application of PEEK to implantable electronic devices packaging: water permeation calculation method and maximum lifetime with desiccant
Nathaniel Dahan, University College London

ACES characterization of damping in micro-beam resonators
Jason Parker, Worcester Polytechnic Institute (Xiuping Chen, Vu Nguyen, Ryszard Pryputniewicz)

Design Optimization of Micro-channel Heat Exchanger embedded in LTCC
Aparna Aravelli, University of Miami, FL (Singiresu S Rao, Hari K Adluru)

Thin-Film Signal and Power Redistribution Layers Based on AL-X and Cu
John Bailey, Auburn University ECE Department (Alexander Pfeiffenberger)




Event Sponsors

Logo Bags, Final Program, Internet Cafe and Convention Hall Signs:
NATEL - Platinum Sponsor

Logo Bags, Final Program, International Reception, Hotel Key Cards and Note Pads/Pens for Technical Sessions:
Heraeus Materials Technology - Premier Sponsor, Gold
Logo Bags, Final Program, and Lanyards :
Metalor - Premier Sponsor, Silver
Proceedings USB Drives:
ALLVIA - USB Proceedings Sponsor
LORD - IMAPS Cafe Sponsor
Keynote Presentations:
Xradia - Keynote Sponsor
Keynote Presentations:
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GBC Forum/Reception:
Kyocera America - GBC Forum/Reception Sponsor

GBC Forum/Reception:
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Bag Insert:
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OEM Supporting Sponsor:
Qualcomm - OEM Sponsor
OEM Supporting Sponsor:
IBM - OEM Sponsor
Golf Sponsors
Golf "Birdie" Sponsor &
Hole #13 (Closest to Pin):

LORD - Golf "Birdie" Sponsor
Golf Ball Markers:
Circuit Solutions, Inc. - Golf Ball Markers Sponsor
Golf Hole Sponsor:
Technic - Golf Hole Sponsor
Golf Hole Sponsor: Golf Hole Sponsor: Coining Inc/Ametek
Golf Hole #11 (Closest to Pin):
Golf Hole Sponsor: AGC Electronics America

Golf Hole #2 (Closest to Pin):
Hole Sponsor: NAMICS

Golf Hole Sponsor:

DPC/GBC Premier Sponsor: ASE US, Inc.

Golf Hole #4 (Closest to Pin):
Golf Hole Sponsor: Infinite Graphics
Golf Hole #18:
Golf Hole Sponsor: Quik-Pak
Golf Hole Sponsor:
Golf Hole Sponsor: Dixon Golf
Media Sponsors
MEPTEC - Media Sponsor
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3D Incites - Media Sponsor
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LED Journal - Media Sponsor
Thermal News - Media Sponsor


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