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IMAPS 2012 - San Diego
45th International Symposium on Microelectronics
Bringing Together The Entire Microelectronics Supply Chain!

September 9 - 13, 2012
San Diego Town & Country Convention Center
San Diego, California, USA

IMAPS 2012 - San Diego

Conference and Exhibition:
September 11-13, 2012
Professional Development Courses:
September 9 - 10, 2012

Message From The Technical Chairs

Technical Chair, Matt Nowak
Matt Nowak, Qualcomm
Technical Chair
Technical Co-Chair, Martin Goetz
Martin Goetz, Northrop Grumman
Technical Co-Chair, USA
Technical Co-Chair, Ivan Ndip
Ivan Ndip, Fraunhofer
Technical Co-Chair, Europe
Technical Co-Chair, Ivan Ndip
Choon Lee, Amkor
Technical Co-Chair, Asia

Mark your calendars! We look forward to seeing you in beautiful San Diego, CA on September 9 – 13, 2012 for the 45th International Symposium on Microelectronics (IMAPS). The annual IMAPS Symposium is well recognized as one of the premiere international conferences for learning the latest advancements throughout the microelectronics packaging supply chain. This year, the Technical Program will include more than 30 technical sessions organized into 6 parallel tracks, plus keynote addresses, panels, and student activities. Just a sample of the highlights for this year’s symposium include:

  • Top Keynote speakers:
    • Matt Grob, Qualcomm CTO, who will present a vision of future wireless technologies including the Internet of Things;
    • Mehran Mehregany, Goodrich Professor of Engineering Innovation and Director of the Wireless Health Program at Case Western Reserve University, who will tell us what to expect in the exciting field of wireless healthcare;
    • Subramanian Iyer, IBM Fellow, who will present an enlightening perspective on the future of the rapidly emerging 3D TSV packaging technology; and
    • Rao Tummala, Director of Georgia Tech’s 3D Systems Packaging Research Center, will speak about Inorganic-organic Packaging as the Basis for Smart Systems Packaging Revolution.
  • Full 3-day international track presenting global perspectives of advanced packaging, including invited papers from Europe, Taiwan, and Japan.
  • Full 3-day track on 2.5D/3D packaging technology, including sessions on TSV process technology and materials, silicon and glass interposers, thermal/mechanical design, and applications.
  • New sessions on Medical device packaging and on “Think Thin” packaging.
  • New panel session with industry experts for hot topic discussions on 3D packaging.
  • Engaging student posters session and numerous other student activities.
  • Sessions to update us on the latest developments in package modelling, design, and reliability including design for reliability, testing techniques, reliability results, thermal management, signal integrity, and high performance interconnect.
  • Full 3-day track on advanced packaging materials including polymers, ceramics, encapsulants, and materials for harsh environment applications.
  • The latest advances in Pb-free solder, flip chip, wafer bumping, copper pillars, wirebonding, and printed electronics.
  • Practical insights on packaging applications including Microwave/RF, MEMS, optoelectronics, and LEDs.

We hope to see you in San Diego. For more information, please visit the symposium website at!


Matt Nowak


Martin Goetz
Northrop Grumman
Ivan Ndip
Fraunhofer IZM
Choon Lee
Amkor Technology





Event Sponsors

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Hole #13 (Closest to Pin):

LORD - Golf "Birdie" Sponsor
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