IMAPS 2013, Orlando - 46th International Symposium on Microelectronics

General Chair:
Matt Nowak
Qualcomm, Inc.
mnowak@qualcomm.com

Technical Chair:
Ivan Ndip
Fraunhofer IZM
Ivan.Ndip@izm.fraunhofer.de

Technical Co-Chair - USA:
Mark Hoffmeyer
Mark Hoffmeyer, IBM Corporation
hoffmeyr@us.ibm.com

Technical Co-Chair - Europe:
Andre Rouzaud
CEA LETI
andre.rouzaud@cea.fr

Technical Co-Chair - Asia:
Jin Yu
Korea Advanced Institute of Science and Technology (KAIST)
jinyu@kaist.ac.kr

The 46th International Symposium on Microelectronics will be held at the Rosen Centre Hotel in Orlando, Florida, USA, and is being organized by the International Microelectronics And Packaging Society (IMAPS). The IMAPS Technical Committee seeks original papers that present progress on technologies throughout the entire microelectronics/packaging supply chain. The 46th Symposium on Microelectronics will cover three tiers of electronics: Systems and Applications; Design and related measurements; and Materials, Process and Reliability. IMAPS 2013 will feature 5-6 technical tracks that span the two and a half days of sessions on: INTERPOSERS & 2.5/3D PACKAGING; MODELING, DESIGN, TEST & RELIABILITY; MATERIALS & PROCESSES; ADVANCED PACKAGING & ASSEMBLY; ADVANCED & EMERGING TECHNOLOGIES; and SPECIAL SESSIONS ON PACKAGING & SYSTEM-INTEGRATION, as well as an Interactive Student Poster Session.

Technical sessions are being planned for these tracks, and abstracts will be considered on the topics listed below. Abstracts are rated by the technical committee members and are selected into the sessions by the session chairs appointed by the technical committee. Authors should identify their preferred session (topical area) when submitting their abstracts. Abstracts should highlight the major contributions of the work in one or more of these areas. All abstracts submitted must represent original, previously unpublished work.

Track:	INTERPOSERS & 2.5/3D PACKAGING
Topics:	• TSV Materials & Processes • Silicon Interposers • Applications, Markets & Challenges for 2.5/3D Packaging & Integration • Glass Interposers • Technologies & Methods for 2.5/3D Packaging & Integration • Stacked Dies, Packages and Memories • 3D Simulation and Modeling • Advanced 3D Materials • PWB Embedded Device Technologies • High Density Interposers & Integrated Passives • Vertical Interconnects • Cost Considerations for 2.5/3D
Track:	MODELING, DESIGN, TEST & RELIABILITY
Topics:	• Design for Reliability • Modeling & Design for SI, PI and EMC • Thermal and Thermo-Mechanical Modeling • Testing Methods and Process • RF and Microwave Packaging • Mechanical Modeling and Related Metrology • Design for Manufacturing • Package Reliability Testing
Track:	MATERIALS & PROCESSES
Topics:	• Advanced Materials & Novel Assembly Processes • Polymers, Underfill/Encapsulants and Adhesives • Substrate Materials • Ceramic & LTCC Packaging • Bonding Materials and Processes • Embedded and Integrated Passives • Thick / Thin Films
Track:	ADVANCED PACKAGING & ASSEMBLY
Topics:	• Pb-Free Solder & ROHS • Wirebonding & Stud Bumping • Flip Chip Interconnects & Technologies • MEMS & Sensor Packaging • LED and Optoelectronics Packaging • Wafer Level Packaging • Chip Scale Packaging • Copper Pillar• Wafer Thinning • Wafer Bumping • Warpage Characterization and Mitigation • Integration, Mounting & Assembly of Packaged LEDs • Industry Trends & Market Drivers in Solid State Lighting • Optics & Lenses (including phosphor incorporation) • Gyros & Accelerometers • Sensors & RF Devices • Microfluidics & Bio-MEMS • Optical MEMS (MOEMS)
Track:	ADVANCED & EMERGING TECHNOLOGIES
Topics:	• Medical Device Packaging • Emerging Technologies • High Performance Interconnect & Boards • Printed Electronics & Additive Manufacturing • Novel Interconnections, Fabrication & Analysis Methods • Packaging for Class III Medical Implants • Human Portable Monitoring Devices • Patient Monitoring • Enabling Technologies for Power Management • Microfluidics, Bio-Sensors & Bio-Chips• Thin & Printed Battery Technology • Membrane & Capacitive Switches • Cyber Design/Cyberfacturing • Printable Display & Lighting
Track:	SPECIAL SESSIONS ON PACKAGING & SYSTEM-INTEGRATION
Topics:	• European Perspective • Asian Perspective • Southeast USA Perspective • Think Thin: Thin IC Packaging For Mobile Devices • Automotive, Industrial & Harsh Environment Electronics Applications • Packaging for Military Appilcations • Power Packaging

Industries Represented:
• Consumer, Portable and Wireless • Biomedical • Telecom • Defense and Security • Computing, and Gaming • Automotive Applications • Solar and Alternative Energy

Systems & Applications of these Technologies:
• Low Cost Electronics • Outsourcing and Supply Chain Management • Thermal Management • System Packaging • Power Management • Electromagnetic Interference (EMI) • Electrostatic Discharge (ESD) Protection • Wireless Sensors and Energy Harvesters • Nano-Integrated Packaging • Microwave & RF Applications • Photonic Packaging • Packaging for Harsh Environments • Packaging for Medical/Implantable Devices • Automotive Microelectronics • Thin Packaging for Mobile Devices • MEMS Packaging • Biological and Microfluidic Packaging • LED Packaging • Packaging of Compound Semiconductor Devices • Emerging Applications

Please send your 500 word abstract electronically only using the On-line submittal form at: www.imaps.org/abstracts.htm. All Speakers are required to pay a reduced registration fee. If you need assistance with the on-line submittal form, please email Brian Schieman at bschieman@imaps.org or call 202-548-8715.

Submit Abstract(s)

Student Presenters:

The Microelectronics Foundation sponsors Student Paper Competitions and Awards in conjunction with IMAPS 2013. Students submitting their work and identifying that "Yes, I'm a full-time student" on the abstract submission form, will automatically be considered for these awards. The review committee will evaluate all student papers/posters and award the following at the 2013 Symposium:

Three (3) "Outstanding Student Paper" Awards - $500 Each Award
One (1) "Best Student Paper of Symposium" Award - $1000 Award
One (1) "Best Student Poster Presentation" Award - $500 Award

The selected student must attend the event to present his or her work and receive the award.

IMAPS 2013 Student Poster Session:
Interactive Student Poster Session Student papers will be considered for this interactive session. Students submitting abstracts for the poster session will be required to submit a full paper which will be PEER-REVIEWED and considered for paper and poster awards noted above. If you are interested in presenting in the interactive session at IMAPS Symposium, select the "*Student Poster Session" option under the session field on the abstract submission form.

Hotel Reservations (Hotel Deadline: August 30, 2013)
Reservations must be made directly with the:

Phone Reservations: 1-800-204-7234 -- Mention IMAPS 46th Annual Symposium on Microelectronics when calling.

IMAPS cannot guarantee room availability and/or rates after the published hotel deadline. Book your rooms directly with the hotel before the deadline noted above.