Platinum Premier Sponsor:

   Gold Premier Sponsor:
   Silver Premier Sponsor:
Natel - Premier Sponsor, Platinum
Heraeus Materials Technology - Premier Sponsor, Gold
Metalor - Premier Sponsor, Silver

IMAPS 2013 - Orlando
46th International Symposium on Microelectronics
Bringing Together The Entire Microelectronics Supply Chain!

September 30 - October 3, 2013
Rosen Centre Hotel
Orlando, Florida, USA

October 1-3, 2013

October 1-2, 2013:
Professional Development Courses:
September 30, 2013 &
October 3, 2013
(Morning 1/2 Day Only)

IMAPS 2013 - Orlando

Thank you for attending IMAPS 2013!

Purchase the IMAPS 2013 Proceedings USB

Program Enhancements & New Activities at IMAPS 2013!

The most 2.5D & 3D Content Under One Roof:
5 sessions, 30+ presentations, 3 keynotes, 1 panel and more!

Monday & Thursday Professional Development Courses
GBC Market Forum Luncheon featuring keynote & market analysts
• NEW "Research Lab Corridor" on Exhibit Floor
• Expanded Exhibits Tuesday-Wed. ONLY (Thursday tear-down)
Dessert "Happy Hour" in the exhibit hall on Tuesday afternoon
Exhibit Hall Reception Wednesday evening
Exhibitor Slideshows & Advertisements outside the session rooms
• University Poster Session
Proceedings Manuscripts!
• 6 "Best of Track" Outstanding Paper Awards & 1 "Best of Symposium"


General Chair:
Matt Nowak
Qualcomm, Inc.


Technical Chair:
Ivan Ndip
Fraunhofer IZM


Technical Co-Chair - USA:
Mark Hoffmeyer
Mark Hoffmeyer, IBM Corporation
Technical Co-Chair - Europe:
Andre Rouzaud
Technical Co-Chair - Asia:
Jin Yu
Korea Advanced Institute of Science and Technology (KAIST)


The 46th International Symposium on Microelectronics will be held at the Rosen Centre Hotel in Orlando, Florida, USA, and is being organized by the International Microelectronics Assebmly and Packaging Society (IMAPS). The IMAPS Technical Committee seeks original papers that present progress on technologies throughout the entire microelectronics/packaging supply chain. The 46th Symposium on Microelectronics will cover three tiers of electronics: Systems and Applications; Design and related measurements; and Materials, Process and Reliability. IMAPS 2013 will feature 6 technical tracks that span the three days of sessions on: INTERPOSERS & 2.5/3D PACKAGING; MODELING, DESIGN, TEST & RELIABILITY; MATERIALS & PROCESSES; ADVANCED PACKAGING & ASSEMBLY; ADVANCED & EMERGING TECHNOLOGIES; and SPECIAL SESSIONS ON PACKAGING & SYSTEM-INTEGRATION, as well as an Interactive Student Poster Session.

IMAPS 2013 will feature...

Complimentary Exhibit Hall Passes

Exhibits Passes are complimentary this year for all attendees. This complimentary registration ("EXHIBITS ONLY") will allow participants to visit the exhibitors, the welcome reception, the keynote presentations, the GBC Market Forecasting talks (GBC lunch tickets for purchase). (PDCs, Sessions, Proceedings and Lunch are not included)

Download the exhibit directory to learn more about the companies on display

World-Renown Keynote Presentations
Keynote: Klaus-Dieter Lang
Tuesday, October 1 | 12:00 PM - 12:45 PM
Next Generation of Electronic Systems - Challenges and Solutions for System Integration Technologies

Prof. Dr. -Ing. Dr. sc. techn. Klaus-Dieter Lang - Director of the Fraunhofer Institute for Reliability and Microintegration, IZM, Berlin.
Keynote: David McCann
Wednesday, October 2 | 11:20 AM - 12:05 PM
Progress in Developing an Open Supply Chain for 2.5D/3D Market Enablement

David McCann - Vice President of Packaging at GLOBALFOUNDRIES in Malta, New York.
More 2.5D & 3D IC Content Under One Roof...
A Full 3-Day "Track" featuring five 3D Sessions and more than 30 speakers lecturing on the latest and greatest topics. Also an entire morning of the conference on Thursday dedicated to 2.5D & 3D IC with 3D keynotes from Micron, CNSE, and TEL NEXX. Following the keynotes, there will be a panel on What are preventing 3D IC integrations from High Volume Manufacturing? moderated by John Lau and featuring discussions from Fraunhofer, Qualcomm, Micron, ASE and more...

MONDAY PDCs: (9am-5pm)
- Plating Processes for High Rel Microelectronic Devices; (1/2 Day: 8am-12pm)
- Fundamentals of Glass Technology and Applications for Advanced Semiconductor Packaging; (1/2 Day: 1-5pm)
- Polymers in Electronic Packaging;
- Wire Bonding in Microelectronics...;
- Technology of Screen Printing;
- Recent Advances and New Trends in 3D IC Integration; (NEW)
- 2013 Packaging Advances, Updates and Trends; (NEW)
- Introduction to 3D Power Electronics & Post-Silicon Device Packaging; (NEW)
- Reliability Data Analysis; (NEW) and
- MEMS Reliability and Packaging

THURSDAY PDCs: (8am-12pm)
- Package on Package Technology...;
- Understanding the Common Failure Modes from a Physics of Failure Perspective;
- Embedded Chip Packaging Technologies;
- Practical Aspects of MEMS and Microsystem Packaging; (NEW)
- Signal/Power Integrity Design for Electronic Packaging and 3D System Integration;
- Managing the Effects of Mechanical Stress on Performance of Modern SOCS; (NEW) and
- Intro to the Design & Fabrication of RF, High Speed and Microwave Hybrids, MCM's and Modules (NEW)

30 Sessions, 225+ abstracts and a University nteractive Poster Session
6 Concurrent Technical Tracks
Interposers & 2.5D/3D Packaging; Modeling/Reliability; Materials & Processes; Advanced Packaging & Assembly; Advanced & Emerging Technologies; Special Sessions on Packaging & System-Integration

Dedicated exhibit hall displaying new products and concepts at 128 exhibit booths. IMAPS 2013 introduces the all new "Research Lab Corridor." Don't miss the new "Dessert Happy Hour" on Tuesday afternoon, lunch on Wednesday (for those registered with meal tickets), the exhibit hall reception Wednesday evening, and complimentary wireless internet throughout the hall during open hours.

Download the exhibit directory to learn more about the companies on display

This GBC Fall Luncheon & Market Forecasting Analyst Session is a business session that will provide industry insight to IMAPS 2013 participants. It will feature one keynote lunch presenter followed by two market forecasting presentations. A lively interactive audience question and answer session will follow.
A University Poster Session, a Student Industry Panel/Reception, Corporate Tour at Micross Components, Student Competitions and other programs are designed to provide students with technical information, industry insight, and valuable connections.

...and that's only the technical side of the Symposium! There are also a lot of other exciting activites planned -- the 19th Annual Golf Classic, the Welcome Reception and opening ceremonies, to name only a few.

We hope you enjoy the 46th International Symposium on Microelectronics - IMAPS 2013, Orlando!

Technical Program


Speaker/Author Information:

All Speakers are required to pay a reduced registration fee. If you need assistance with the speaker issues, please email Brian Schieman at or call 412-368-1621.

Abstracts Deadline: March 29, 2013
Notice of Acceptance: April 19, 2013
Manuscripts Due for Peer-Review: June 30, 2013
Peer-Review of Papers: July 1-30, 2013
Peer-Review Feedback to Authors: August 28, 2013
Final Papers Due To IMAPS: September 4, 2013
Early Registration / Hotel Deadline Extended: September 6, 2013
Speaker Bios
Due: September 25, 2013
Speaker Breakfast the Morning of your Session: 7:00-7:30am in SALON ROOM 11-12

IMAPS does not require you to use a conference powerpoint template.
You are able to use your regular company/preferred powerpoint templates.
Please include the IMAPS show name and dates on your template and/or an IMAPS logo.
You should bring your slides on USB and load the file to the session laptop before your session begins.
You may email with your slides if you file is ready before September 25.

Dress Code:
There is no officially "dress code" for IMAPS Conferences. We ask you to be BUSINESS CASUAL or whatever more you prefer. Most speakers tend to be in business pants and button down/company logo shirts (Women in dresses or the same). Suits, sport coats and ties are common as well. We do not recommend casual attire.

Session rooms will be equipped with:
Screen, projector, podium, IMAPS laptop (with Microsoft Windows and recent OFFICE suite), microphone, and slide remote/laser pointer.

All presentations are 20 minutes followed by 5 minutes for Questions
You are required to load your powerpoint/presentation onto the session laptop yourself using your USB drive.
Speak with your session chair if you need assistance.

About the Session:
Sessions begin with Session Chairs making general announcements. Session Chairs will then introduce speakers by reading BIOs. Speaker will present for 20 minutes, followed by 5 minutes for questions. Session Chairs will thank the speakers. This process is repeated for each speaker in the session. Many sessions will take refreshment breaks (see program).

Photography is not permitted in the session rooms.

Silence all mobile phones during session attendance.

Special Paper Recognition - Cash Awards Offered!

6 "Best of Track" Outstanding Papers - Six (6) $500 Cash Awards
Six "Best of Track" Winners will then be reviewed for...

1 Best Paper of the Symposium - One (1) additional $500 Cash Award for a "Best of Track" Winner

IMAPS Microelectronics Foundation Student Paper Awards
The Foundation is offering CASH AWARDS to the best papers submitted and presented by students at IMAPS 2013.

Accepted papers may be considered for publication in the IMAPS Journal of Microelectronics and Electronic Packaging.


Hotel Reservations (Hotel CLOSED)
Reservations must be made directly with the:

Rosen Centre Hotel
9840 International Dr
Orlando, FL 32819 USA

IMAPS cannot guarantee room availability and/or rates after the published hotel deadline. Book your rooms directly with the hotel before the deadline noted above.


PREMIER Sponsors:

   Platinum Premier Sponsor:

   Gold Premier Sponsor:
   Silver Premier Sponsor:
Natel - Premier Sponsor, Platinum
Heraeus Materials Technology - Premier Sponsor, Gold
Metalor - Premier Sponsor, Silver
Micross Components: CORPORATE Sponsor
Event Sponsors:

Logo Bags, Final Program, Internet Cafe and Convention Hall Signs:
NATEL - Platinum Sponsor

Logo Bags, Final Program, International Reception, and Note Pads/Pens for Technical Sessions:
Heraeus Materials Technology - Premier Sponsor, Gold
Logo Bags, Final Program, and Lanyards :
Metalor - Premier Sponsor, Silver
Exhibit Hall Reception:
Micross Components: CORPORATE Sponsor
Exhibit Hall Reception & Lunch:
Applied Materials: Exhibit Hall Lunch & Reception
IMAPS Cafés:
LORD - IMAPS Cafe Sponsor
GBC Forum & Keynote Lunch:
Sikama - GBC Forum/Reception Sponsor
Conference Proceeding USB Drives:
Indium Corp - Keynote Presentations Sponsor

"Dessert Station" Sponsor:
Palomar Technologies:  Dessert Station Sponsor

Bag Insert:
Plasma Therm: Bag Insert Sponsor

OEM Supporting Sponsor:
IBM - OEM Sponsor
Golf Sponsors
Golf "Birdie" Sponsor &
Hole Sponsor:

LORD - Golf "Birdie" Sponsor
Golf Hole Sponsor: Golf Hole Sponsor: Coining Inc/Ametek
Golf Hole Sponsor:
Golf Hole Sponsor: Infinite Graphics
Hole Sponsor:
Technic - Golf Hole Sponsor
Hole Sponsor:
Golf Hole Sponsor: AGC Electronics America
Hole Sponsor:
Golf Hole Sponsor: Micross Components
Media Sponsors
MEPTEC - Media Sponsor
US Tech - Media Sponsor
3D Incites - Media Sponsor
  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Rochester Electronics
  • Specialty Coating Systems
  • Spectrum Semiconductor Materials
  • Technic