Platinum Premier Sponsor:

   Gold Premier Sponsor:
   Silver Premier Sponsor:
Natel - Premier Sponsor, Platinum
Heraeus Materials Technology - Premier Sponsor, Gold
Metalor - Premier Sponsor, Silver

IMAPS 2014 - San Diego
The Future of Packaging!

IMAPS 2014 - San Diego

October 14-16, 2014
October 14-15, 2014
Professional Development Courses:
October 13 & 16, 2014

Early Registration and Hotel Deadline: September 12, 2014


The LARGEST Conference Program for Microelectronics,
Assembly, Interconnect & Packaging THIS FALL:
3 Days, 28 Sessions, 190 Speakers!!

The 47th International Symposium on Microelectronics is being organized by the International Microelectronics Assembly and Packaging Society (IMAPS). The 47th Symposium on Microelectronics will cover three tiers of electronics: Systems and Applications; Design and related measurements; and Materials, Process and Reliability. IMAPS 2014 will feature 6 technical tracks that span three days: INTERPOSERS & 3D PACKAGING; THE FUTURE OF PACKAGING; ADVANCED PACKAGING, INTERCONNECTS & ASSEMBLY; MATERIALS & PROCESSES; MODELING, DESIGN, & TEST; and SPECIAL SESSIONS ON 3D & Embedding and Reliability. The 2014 Symposium will also feature an Interactive Industry/Student Poster Session, the Panel Discussion Thursday morning on The Future of Packaging, as well as 6 keynotes from Qualcomm, IBM, IPDiA, Jawbone, and Micron, and much more!.



Thank you for participating in IMAPS 2014 - San Diego...

• IMAPS 2014 focuses on "The Future of Packaging"
The most Interposer & 3D Content Under One Roof:
6 sessions, 35+ presentations, and more!

• KEYNOTES from: Qualcomm, IBM, IPDiA, Jawbone, and Micron
Monday & Thursday: 15 Professional Development Courses
• "Future of Packaging" Panel Discussion
GBC Market Forum Luncheon on "Future of Packaging: Mobile & Solar PV"
• "Research Lab Corridor" returns to the Exhibit Floor
Dessert "Happy Hour" in the exhibit hall on Tuesday afternoon
132 Exhibit Booths - closes with Exhibit Hall Reception Wednesday evening
Exhibitor Slideshows & Advertisements outside the session rooms
• Industry & University Poster Session
Proceedings Manuscripts!
• 6 "Best of Track" Outstanding Paper Awards & 1 "Best of Symposium"
• the 20th Annual GOLF CLASSIC Monday to Benefit IMAPS Foundation!

Technical Program | PDCs (Short Courses)


...and that's only the technical side of the Symposium! There are also a lot of other exciting activites planned -- the 20th Annual Golf Classic, the Welcome Reception and opening ceremonies, to name only a few.

We hope you enjoyed the 47th International Symposium on Microelectronics - IMAPS 2014, San Diego!

Technical Program | PDCs (Short Courses)


Registration Information: (Early Registration Deadline: September 12, 2014)

Full attendee registrations (not exhibits only) includes the Opening Ceremonies, IMAPS Annual Business Meeting, IMAPS Awards Ceremony, Keynote Presentations, Welcome Reception, Technical Sessions, GBC-Marketing Forum, Panel Discussion, Exhibit attendance, Breaks, Exhibit Hall Reception on Wednesday, Exhibit Hall Lunch on Tuesday, one 2014 Proceedings USB and an automatic one-year IMAPS membership renewal for individual and student members in good standing at the time of registration. For an additional fee you can register for a Professional Development Course (PDC), the Golf Tournament, and other activities/purchases. All prices below are subject to change.

Full Symposium cancellations will be refunded (less a $100 processing fee) only if written notice is postmarked on or before Friday, September 12, 2014. No refunds will be issued after that date..

Early Fee
Through 9/12/2014
Advance/Onsite Fee
After 9/12/2014
IMAPS Member
Chapter Officer
Student (IMAPS Member)
Student (Non-Member)
Exhibits Only TUESDAY
Exhibits Only WEDNESDAY
1 PDC (Full-Day: Monday)
1 PDC (Half-Day: Monday or Thursday)
GBC Ticket (Forum & Lunch)
Golf (1 Golfer, Monday)


Hotel Reservations (Hotel Deadline: September 12, 2014)
Reservations must be made directly with the:

Town and Country Hotel
550 Hotel Circle North
San Diego, CA 92108 USA


IMAPS cannot guarantee room availability and/or rates after the published hotel deadline. Book your rooms directly with the hotel before the deadline noted above.


Hotel Scams Alert!
All reservations should be made directly with the hotel and within the IMAPS room block. We are not using a housing company. If any person or firm contacts you and offers to handle your reservations, please beware. They are completely unauthorized and possibly fraudulent. The convention industry is currently plagued by such groups. If you use one of them and experience any problems, including lost deposits and no reservation when you arrive, IMAPS may not be able to assist you. Please be aware in particular of the following unauthorized firms - Exhibition Housing Services or Convention Housing Planners Corp. - whose salespeople have falsely claimed to be calling from IMAPS.

The only way to book a room in the official IMAPS Housing Block using the reservations information above.


Speaker/Author Information:

Abstracts Deadline: May 1, 2014
Notice of Acceptance: June 15, 2014
Manuscripts Due for Peer-Review: July 23, 2014
Peer-Review of Papers: July 24-September 12, 2014
Peer Review Comments due to authors: September 22-23, 2014
Final Papers Due To IMAPS: September 28, 2014
Early Registration / Hotel Deadline: September 12, 2014

Questions about your abstract or paper? Please email Brian Schieman at or call 412-368-1621.

Special Paper Recognition - Cash Awards Offered!

6 "Best of Track" Outstanding Papers - Six (6) $500 Cash Awards
Six "Best of Track" Winners will then be reviewed for...

1 Best Paper of the Symposium - One (1) additional $500 Cash Award for a "Best of Track" Winner

IMAPS Microelectronics Foundation Student Paper Awards
The Foundation is offering CASH AWARDS to the best papers submitted and presented by students at IMAPS 2014.

Accepted papers may be considered for publication in the IMAPS Journal of Microelectronics and Electronic Packaging.


Student Presenters:

The Microelectronics Foundation sponsors Student Paper Competitions and Awards in conjunction with IMAPS 2014. Students submitting their work and identifying that "Yes, I'm a full-time student" on the abstract submission form, will automatically be considered for these awards. The review committee will evaluate all student papers/posters and award the following at the 2014 Symposium:

  • Three (3) "Outstanding Student Paper" Awards - $500 Each Award
  • One (1) "Best Student Paper of Symposium" Award - $2000 Award
  • One (1) "Best Student Poster Presentation" Award - $250 Award

The selected student must attend the event to present his or her work and receive the award.

The Microelectronics Foundation


IMAPS 2014 Poster Session:
Interactive Poster Session Student papers will be considered for this interactive session. Students submitting abstracts for the poster session will be required to submit a full paper which will be PEER-REVIEWED and considered for paper and poster awards noted above. If you are interested in presenting in the interactive session at IMAPS Symposium, select the "*Student Poster Session" option under the session field on the abstract submission form.


PREMIER Sponsors:

   Platinum Premier Sponsor:

   Gold Premier Sponsor:
   Silver Premier Sponsor:
Natel - Premier Sponsor, Platinum
Heraeus Materials Technology - Premier Sponsor, Gold
Metalor - Premier Sponsor, Silver
Honeywell - Student Programs Sponsor
Event Sponsors:

Logo Bags, Final Program, Internet Cafe and Convention Hall Signs:
Natel - Premier Sponsor, Platinum

Logo Bags, Final Program, International Reception, and Note Pads/Pens for Technical Sessions:
Heraeus Materials Technology - Premier Sponsor, Gold
Logo Bags, Final Program, and Lanyards :
Metalor - Premier Sponsor, Silver
Conference Proceeding USB Drives:
Indium Corp - Keynote Presentations Sponsor

IMAPS Cafe - Refreshment Breaks:
Invensas: IMAPS Cafe Refreshment Breaks Sponsor

Student Programs & Keynotes Sponsor:

Honeywell - Student Programs Sponsor

Dessert "Happy Hour" Sponsor:
Palomar Technologies: Dessert "Happy Hour" Sponsor
Bag Insert:
Plasma Therm: Bag Insert Sponsor
Bag Insert:

Credence Engineering: Bag Insert Sponsor
Bag Insert:
SEKISUI America Corp.: Bag Insert Sponsor
Golf Sponsors
Golf Hole:
Technic - Golf Hole Sponsor
Golf Hole:
Golf Hole Sponsor: Coining Inc/Ametek
Golf Hole:
Golf Hole Sponsor: AGC Electronics America
Golf Hole:
Golf Hole Sponsor: Quik-Pak
Golf Hole:
Hole Sponsor: NAMICS
golf holes still available
Media Sponsors
Media Sponsor: MEMS Journal
Media Sponsor: US Tech
Media Sponsor: Chip Scale Review
Media Sponsor: MEPTEC
Media Sponsor: Webcom - Antenna Systems & Technology
Media Sponsor: Webcom - Electronics Protection
Media Sponsor: Webcom - Thermal News
Media Sponsor: Semiconductor Packaging News
3D Incites - Media Sponsor
Solid State Technology - Media Sponsor


  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Rochester Electronics
  • Specialty Coating Systems
  • Spectrum Semiconductor Materials
  • Technic