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IMAPS 2014 - San Diego
The Future of Packaging!
www.imaps2014.org

IMAPS 2014 - San Diego

Conference:
October 14-16, 2014
Exhibition:
October 14-15, 2014
Professional Development Courses:
October 13 & 16, 2014
General Chair:
Ivan Ndip
Fraunhofer IZM
Ivan.Ndip@izm.fraunhofer.de
Technical Chair:
Subramanian "Subu" S. Iyer
IBM Systems & Technology Group
ssiyer@us.ibm.com
Technical Co-Chair - USA:
Erica Folk
Northrop Grumman Corp.
erica.folk@ngc.com
Technical Co-Chair - Europe:
Andre Rouzaud
CEA LETI
andre.rouzaud@cea.fr
Technical Co-Chair - Asia:
Woong-Sun Lee
SK Hynix, Inc.
woongsun.lee@sk.com
Assistant Technical Co-Chair - USA:
Urmi Ray
Qualcomm
uray@qti.qualcomm.com
Assistant Technical Co-Chair - Europe:
Gabriel Parès
CEA LETI
gabriel.pares@cea.fr
Assistant Technical Co-Chair - Asia:
Yasuhiro Kawase
Mitsubishi Chemical Corporation
kawase.yasuhiro@mw.m-kagaku.co.jp

Abstract Deadline Extended: April 18, 2014
Early Exhibit Deadline: March 28, 2014
Early Registration and Hotel Deadline: September 12, 2014


The 47th International Symposium on Microelectronics is being organized by the International Microelectronics Assembly and Packaging Society (IMAPS). The IMAPS Technical Committee seeks original papers that present progress on technologies throughout the entire microelectronics/packaging supply chain. The 47th Symposium on Microelectronics will cover three tiers of electronics: Systems and Applications; Design and related measurements; and Materials, Process and Reliability. IMAPS 2014 will feature 6 technical tracks that span the two and a half days of sessions on: INTERPOSERS & 2.5/3D PACKAGING; THE FUTURE OF PACKAGING; ADVANCED PACKAGING, INTERCONNECTS & ASSEMBLY; MATERIALS & PROCESSES; MODELING, DESIGN, & TEST; and SPECIAL SESSIONS ON SYSTEM-INTEGRATION, POWER & HIGH-RELIABILITY, as well as an Interactive Student Poster Session.

Technical sessions are being planned for these tracks, and abstracts will be considered on the topics listed below. Abstracts are rated by the technical committee members and are selected into the sessions by the session chairs appointed by the technical committee. Authors should identify their preferred session (topical area) when submitting their abstracts. Abstracts should highlight the major contributions of the work in one or more of these areas. All abstracts submitted must represent original, previously unpublished work.

Track:
INTERPOSERS & 2.5/3D PACKAGING
Topics:
• TSV Materials & Processes • Silicon Interposers • Applications, Markets & Challenges for 2.5/3D Packaging & Integration • Glass Interposers • Technologies & Methods for 2.5/3D Packaging & Integration • Stacked Dies, Packages and Memories • 3D Simulation and Modeling • Advanced 3D Materials • PWB Embedded Device Technologies • High Density Interposers & Integrated Passives • Vertical Interconnects • Cost Considerations for 2.5/3D • Think Thin: Thin IC Packaging For Mobile • 3D Printing (Inkjet & others)
Track:
THE FUTURE OF PACKAGING
Topics:
• Roadmaps • Package Scaling • Printed Electronics & Additive Manufacturing • Sensor Packaging • Medical Device Packaging • Microfluidics & Bio-MEMS • Packaging for Medical Implants & Ingestibles • Portable & Patient Monitoring Devices • Wearable Devices • Membrane & Capacitive Switches • Printable Display & Lighting • Automotive Microelectronics: "Infotainment" • "Internet of Things"
Track:
ADVANCED PACKAGING, INTERCONNECTS & ASSEMBLY
Topics:
• Wirebonding & Stud Bumping • Flip Chip Interconnects & Technologies • MEMS • Wafer Level Packaging • Chip Scale Packaging • Wafer Finishing (Bumping, Copper Pillar, Thinning) • Warpage Characterization and Mitigation • Gyros & Accelerometers • RF Devices • Optical Interconnects • Optical MEMS (MOEMS) • LED and Optoelectronics Packaging • Silicon Photonics • High Performance Interconnect & Boards • Novel Interconnections, Fabrication & Analysis Methods
Track:
MATERIALS & PROCESSES
Topics:
• Advanced Materials & Novel Assembly Processes • Polymers, Underfill/Encapsulants and Adhesives • Polymer Interposers • Substrate Materials • Ceramic & LTCC Packaging • Bonding Materials and Processes • Embedded and Integrated Passives • Thick / Thin Films • Pb-Free Solder & ROHS
Track:
MODELING, DESIGN, & TEST
Topics:
• Design for Reliability • Modeling & Design for SI, PI and EMC • Thermal and Thermo-Mechanical Modeling • Testing Methods and Process • RF and Microwave Packaging • Mechanical Modeling and Related Metrology • Design for Manufacturing • Package Reliability Testing • Fine Pitch Probes
Track:
SPECIAL SESSIONS ON SYSTEM-INTEGRATION, POWER & HIGH-RELIABILITY
Topics:
• European Perspective on System Integration • Asian Perspective on System Integration • Automotive Electronics • Harsh Environment / High Temperature • High Reliability for Military/Aero Applications • High-rel Drilling/Geo-Thermal • Power Packaging • Enabling Technologies for Power Management • Thin & Printed Battery Technology

Industries Represented:
Consumer, Portable and Wireless Biomedical Telecom Defense and Security Computing, and Gaming
Automotive Applications Solar and Alternative Energy
Gas, Drilling & GeoThermal

Please send your 500 word abstract electronically only using the On-line submittal form at: www.imaps.org/abstracts.htm. All Speakers are required to pay a reduced registration fee. If you need assistance with the on-line submittal form, please email Brian Schieman at bschieman@imaps.org or call 412-368-1621.

Submit Abstract(s)


Student Presenters:

The Microelectronics Foundation sponsors Student Paper Competitions and Awards in conjunction with IMAPS 2014. Students submitting their work and identifying that "Yes, I'm a full-time student" on the abstract submission form, will automatically be considered for these awards. The review committee will evaluate all student papers/posters and award the following at the 2014 Symposium:

  • Three (3) "Outstanding Student Paper" Awards - $500 Each Award
  • One (1) "Best Student Paper of Symposium" Award - $2000 Award
  • One (1) "Best Student Poster Presentation" Award - $250 Award

The selected student must attend the event to present his or her work and receive the award.

The Microelectronics Foundation

 

IMAPS 2014 Student Poster Session:
Interactive Student Poster Session Student papers will be considered for this interactive session. Students submitting abstracts for the poster session will be required to submit a full paper which will be PEER-REVIEWED and considered for paper and poster awards noted above. If you are interested in presenting in the interactive session at IMAPS Symposium, select the "*Student Poster Session" option under the session field on the abstract submission form.

 


Speaker/Author Information:

Abstracts Deadline Extended: April 18, 2014
Notice of Acceptance: April 30, 2014
Manuscripts Due for Peer-Review: June 30, 2014
Peer-Review of Papers: July 15-August 30, 2014
Final Papers Due To IMAPS: September 15, 2014
Early Registration / Hotel Deadline: September 12, 2014

Please send your 500 word abstract electronically only using the On-line submittal form at: www.imaps.org/abstracts.htm. All Speakers are required to pay a reduced registration fee. If you need assistance with the on-line submittal form, please email Brian Schieman at bschieman@imaps.org or call 412-368-1621.

Special Paper Recognition - Cash Awards Offered!

6 "Best of Track" Outstanding Papers - Six (6) $500 Cash Awards
Six "Best of Track" Winners will then be reviewed for...

1 Best Paper of the Symposium - One (1) additional $500 Cash Award for a "Best of Track" Winner


IMAPS Microelectronics Foundation Student Paper Awards
The Foundation is offering CASH AWARDS to the best papers submitted and presented by students at IMAPS 2014.

Accepted papers may be considered for publication in the IMAPS Journal of Microelectronics and Electronic Packaging.

 

Hotel Reservations (Hotel Deadline: September 12, 2014)
Reservations must be made directly with the:

Town and Country Hotel
550 Hotel Circle North
San Diego, CA 92108 USA

$154+taxes - single/double

On-Line Reservations

Phone Reservations: 1-800-772-8527 -- Mention IMAPS when calling.

IMAPS cannot guarantee room availability and/or rates after the published hotel deadline. Book your rooms directly with the hotel before the deadline noted above.

 

Hotel Scams Alert!
All reservations should be made directly with the hotel and within the IMAPS room block. We are not using a housing company. If any person or firm contacts you and offers to handle your reservations, please beware. They are completely unauthorized and possibly fraudulent. The convention industry is currently plagued by such groups. If you use one of them and experience any problems, including lost deposits and no reservation when you arrive, IMAPS may not be able to assist you. Please be aware in particular of one of these unauthorized firms - Exhibition Housing Services - whose salespeople have falsely claimed to be calling from IMAPS.

The only way to book a room in the official IMAPS Housing Block using the reservations information above..

 

 


PREMIER Sponsors:

   Platinum Premier Sponsor:

   Gold Premier Sponsor:
   Silver Premier Sponsor:
Natel - Premier Sponsor, Platinum
Heraeus Materials Technology - Premier Sponsor, Gold
Metalor - Premier Sponsor, Silver
CORPORATE Sponsors:
Event Sponsors:

Logo Bags, Final Program, Internet Cafe and Convention Hall Signs:
Natel - Premier Sponsor, Platinum

Logo Bags, Final Program, International Reception, and Note Pads/Pens for Technical Sessions:
Heraeus Materials Technology - Premier Sponsor, Gold
Logo Bags, Final Program, and Lanyards :
Metalor - Premier Sponsor, Silver
Conference Proceeding USB Drives:
Indium Corp - Keynote Presentations Sponsor

Bag Insert:
Plasma Therm: Bag Insert Sponsor

     
Golf Sponsors
     
Media Sponsors

 





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