Platinum Premier Sponsor:

   Gold Premier Sponsor:
   Silver Premier Sponsor:
NEO Tech - Premier Sponsor, Platinum
Heraeus Materials Technology - Premier Sponsor, Gold
Metalor - Premier Sponsor, Silver

IMAPS 2015 - Orlando
Advanced Packaging & the Internet of Things: The Future of Our Industry

IMAPS 2015 - Orlando

October 27-29, 2015
October 27-28, 2015
Professional Development Courses &
Welcome Reception :
October 26, 2015
General Chair:
Urmi Ray
Qualcomm, Inc.
Technical Chair:
Erica Folk
Northrop Grumman Corp.

Technical Committee:
Technical Co-Chair - USA:
Dan Krueger
Honeywell FM&T
Technical Co-Chair - Europe:
Andre Rouzaud
Technical Co-Chair - Asia:
Woong-Sun Lee
SK Hynix, Inc.
Assistant Technical Co-Chair - USA:
Mary Cristina Ruales Ortega,
University of Missouri
Tim Mobley, Triton Micro Tech
Assistant Technical Co-Chairs - Europe:
Gabriel Parès, CEA LETI
Steffen Kroehnert, Nanium
Assistant Technical Co-Chairs - Asia:
Yu-Hua Chen, Unimicron
Won Kyoung Choi, Stats ChipPAC

GBC, Keynote Presentations, & Proceedings Papers
Now Linked to IMAPSource from the PROGRAM Page...

Thank you to all who participated at IMAPS 2015 Orlando...
the LARGEST Conference Program for Microelectronics,
Assembly, 2.5/3D, Interconnect & Packaging in FALL 2015:
3 Days, 30 Sessions, 5 Keynotes, 160+ Speakers!!


Warm greetings and a BIG "Hello" to IMAPS members and the worldwide microelectronics community!

Urmi Ray, Qualcomm
General Chair, IMAPS 2015
Erica Folk, Northrop Grumman
Technical Chair, IMAPS 2015

Welcome to the IMAPS 48th Annual International Symposium on Microelectronics. We hope that you will be able to join us from October 26th to 29th at the Rosen Centre Hotel in Orlando, FL and participate in the many events that are planned for IMAPS 2015.

You will find a "revamped" IMAPS 2015 program with technical sessions balancing between emerging, new and mature topics, and a large cross-section of vendors exhibiting their products and technologies in the exhibition hall.

The IMAPS committees and many dedicated volunteers have been working together over the past six months to prepare for the 2015 Symposium focusing on the industry trend of the growing importance of microelectronics packaging and integration. The goal is to provide the audience with additional learning and networking opportunities. This year's technical sessions cover topics ranging from high reliability avionics systems to "cheap" disposable healthcare packages. The conference theme for IMAPS 2015 is "Advanced Packaging & the Internet of Things: The Future of Our Industry". To kick off the conference, industry leaders will be providing their insights oin challenges and progresses in Automotive Packaging, novel system level concepts for breaking into the Internet of Things business and updates to the packaging roadmap critical with the More than Moore concepts. Piggybacking and expanding on the successes of the previous symposia, the technical program in 2015 will run 6 parallel tracks covering:


Complementing the technical sessions, we are also planning multiple Professional Development Courses (PDCs) with variety of topics bound to enhance and broaden your technical portfolio. This will be held on Monday, October 26, prior to the kick-off of the technical sessions.

The IMAPS Exhibition returns featuring a 2-day SOLD-OUT show floor with more than 135 exhibit booths featuring companies and research labs that will showcase a vast array of new products serving all segments of the microelectronics industry, including Consumer, Healthcare and Biomedical, Military, Aerospace, Computing, Automotive/Industrial, and Alternate Energy. Browsing the exhibit hall and talking to the exhibitors are bound to be exciting and we hope that this enables you to learn the latest and greatest solutions to the changing needs in your business and research.

We hope you can take some time from your busy schedules to attend IMAPS 2015, to learn about the changing world of microelectronics packaging in the 21st century. Next stop: Orlando!


...and that's only the technical side of the Symposium! There was also a lot of other exciting activites -- the 21st Annual Golf Classic, the Welcome Reception and opening ceremonies, to name only a few.

We hope you enjoyed the 48th International Symposium on Microelectronics - IMAPS 2015, Orlando!

Technical Program | PDCs (Short Courses)


Speaker/Author Information:

  • Abstracts Deadline: May 15, 2015
  • Notice of Acceptance: July 8, 2015
  • Manuscripts Due for Peer-Review: August 7, 2015
  • Peer-Review Comments to Author: September 23, 2015
  • Final Papers Due To IMAPS: October 2, 2015
  • Early Registration / Hotel Deadline: September 30, 2015
  • Speaker Bios Due: October 23, 2015
  • Powerpoint/Presentation file used during session: Speaker's responsibility to bring to session on USB (recommended to have back-up on personal laptop or email to prior to event)
  • Technical Presentation Time: 25 minutes (20 to present; 5 for Q&A) - Keynotes: 45 minutes (40 to present; 5 for Q&A)
  • All Speakers are required to pay a reduced registration fee.
  • If you need assistance with speaker information, please email Brian Schieman at Additional Speaker Information Below...

Presentation Format/Template:
IMAPS does not require you to use a conference powerpoint template.
You are able to use your regular company/preferred powerpoint templates.
Please include the IMAPS show name and dates on your template and/or an IMAPS logo.

Dress Code:
There is no officially "dress code" for IMAPS Conferences. We ask you to be BUSINESS CASUAL or whatever more you prefer. Most speakers tend to be in business pants and button down/company logo shirts (Women in dresses or the same). Suits, sport coats and ties are common as well. We do not recommend casual attire.

Session rooms will be equipped with:
Screen, projector, podium, IMAPS laptop (with Microsoft Windows and recent OFFICE suite), microphone, and slide remote/laser pointer.

All session presentations are 20 minutes followed by 5 minutes for Questions
You are required to load your powerpoint/presentation onto the session laptop yourself using your USB drive.
Speak with your session chair if you need assistance.

About the Regular/Oral Sessions
Sessions begin with Session Chairs making general announcements. Session Chairs will then introduce speakers by reading BIOs. Speaker will present for 20 minutes, followed by 5 minutes for questions. Session Chairs will thank the speakers. This process is repeated for each speaker in the session. Many sessions will take refreshment breaks (see program).

Poster Session/Information
The poster session is planned to be an INTERACTIVE presentation. This means you do not start and complete a scheduled talk without interuption like in a regular/oral session. Speakers should have talking points and be at their poster throughout the session. You can "present" your scheduled materials, but more often the attendees will review your slides and ask questions. Or you can watch them and talk to them depending on which slide they are on.

Authors may either print out each of their powerpoint slides on regular paper and tack them up in order, or prepare a large poster (or 2 even). Recommended poster size is typically 3x4 feet, with the max space on the board being 4 ft high x 8 ft wide. IMAPS staff will provide tacks to secure your print outs. The session is first-come-first-serve so there are not assigned poster boards/locations.

Photography is not permitted in the session rooms.

Silence all mobile phones during session attendance.

Special Paper Recognition - Cash Awards Offered!

6 "Best of Track" Outstanding Papers - Six (6) $500 Cash Awards
Six "Best of Track" Winners will then be reviewed for...

1 Best Paper of the Symposium - One (1) additional $500 Cash Award for a "Best of Track" Winner

IMAPS Microelectronics Foundation Student Paper Awards
The Foundation is offering CASH AWARDS to the best papers submitted and presented by students:
$2000 Best Student Paper, $500 for 3 Outstanding Student Papers, $250 Best Poster

Accepted papers may be considered for publication in the IMAPS Journal of Microelectronics and Electronic Packaging.

Student Presenters:

The Microelectronics Foundation sponsors Student Paper Competitions and Awards in conjunction with IMAPS 2015. Students submitting their work and identifying that "Yes, I'm a full-time student" on the abstract submission form, will automatically be considered for these awards. The review committee will evaluate all student papers/posters and award the following at the 2015 Symposium:

  • Three (3) "Outstanding Student Paper" Awards - $500 Each Award
  • One (1) "Best Student Paper of Symposium" Award - $2000 Award
  • One (1) "Best Student Poster Presentation" Award - $250 Award

The selected student must attend the event to present his or her work and receive the award.

The Microelectronics Foundation


IMAPS 2015 Poster Session:
Interactive Poster Session papers will be considered for this interactive session. Students and industry professionals who were accepted into POSTER session will be required to submit a full paper which will be PEER-REVIEWED and considered for paper and poster awards noted above. If you are still interested in presenting in the interactive session at IMAPS Symposium, please contact Brian Schieman at immediately.

Registration & Hotel Information: (Early Registration Deadline: September 30, 2015)

Full attendee registrations (not exhibits only) includes the Opening Ceremonies, IMAPS Annual Business Meeting, IMAPS Awards Ceremony, Keynote Presentations, Welcome Reception, Technical Sessions, GBC-Marketing Forum, Panel Discussion, Exhibit attendance, Breaks, Exhibit Hall Reception on Wednesday, Exhibit Hall Lunch on Tuesday, one 2015 Proceedings USB and an automatic one-year IMAPS membership renewal for individual and student members in good standing at the time of registration. For an additional fee you can register for a Professional Development Course (PDC), the Golf Tournament, and other activities/purchases. All prices below are subject to change.

Full Symposium cancellations will be refunded (less a $100 processing fee) only if written notice is postmarked on or before Friday, September 18, 2015. No refunds will be issued after that date.


Early Fee
Through 9/30/2015
Advance/Onsite Fee
After 9/30/2015
IMAPS Member
Chapter Officer
Student (IMAPS Member)
Student (Non-Member)
Exhibits Only (NO lunch tickets included)
Lunch Tickets (1-day per ticket: TUESDAY OR WEDNESDAY)
1 PDC (Full-Day: Monday)
1 PDC (Half-Day: Monday)
GBC Ticket (Forum & Lunch)
Golf (1 Golfer, Monday)


Hotel Reservations (Hotel Deadline: September 30, 2015)
Reservations must be made directly with the:

Rosen Centre Hotel
9840 International Dr
Orlando, FL 32819 USA



PREMIER Sponsors:

   Platinum Premier Sponsor:

   Gold Premier Sponsor:
   Silver Premier Sponsor:
NEO Tech - Premier Sponsor, Platinum
Heraeus Materials Technology - Premier Sponsor, Gold
Metalor - Premier Sponsor, Silver
Honeywell - Student Programs Sponsor
Event Sponsors:

Logo Bags, Final Program, Internet Cafe and Convention Hall Signs:
NEO Tech - Premier Sponsor, Platinum

Logo Bags, Final Program, International Reception, and Note Pads/Pens for Technical Sessions:
Heraeus Materials Technology - Premier Sponsor, Gold
Logo Bags, Final Program, and Lanyards :
Metalor - Premier Sponsor, Silver
Conference Mobile APP & Proceedings Download:
Indium Corp - Keynote Presentations Sponsor
Dessert "Happy Hour" Sponsor:
Palomar Technologies: Dessert "Happy Hour" Sponsor
Student Programs Sponsor:
Honeywell - Student Programs Sponsor
Lunch Sponsor:
Applied Materials - Event Sponsor
Keynote Session Sponsor:
Enthone - Keynote Session Sponsor
Posters & Pizza Sponsor:
Northrop Grumman EC - Poster Session Sponsor
Bag Insert Sponsor:
American Elements - Bag Insert Sponsor
Golf Sponsors
Golf Hole Sponsor: Infinite Graphics
Golf Hole Sponsor
Golf Hole Sponsor: Coining/Ametek
Golf Hole Sponsor
golf holes still available
Media Sponsors
Media Sponsor: MEMS Journal
Media Sponsor: US Tech
Solid State Technology - Media Sponsor
Media Sponsor: MEPTEC
3D Incites - Media Sponsor
Media Sponsor: Webcom - Antenna Systems & Technology
Media Sponsor: Webcom - Electronics Protection
Media Sponsor: Webcom - Thermal News
Media Sponsor: Semiconductor Packaging News
Media Sponsor: YOLE


  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Rochester Electronics
  • Specialty Coating Systems
  • Spectrum Semiconductor Materials
  • Technic