KESTER


 
    PREMIER PROGRAM SPONSOR:
 
 
Premier Program Sponsor - Heraeus Materials Technology

 

    PREMIER TECHNOLOGY SPONSOR :

   PREMIER TECHNOLOGY SPONSOR:
   PREMIER TECHNOLOGY SPONSOR:
Premier Tech Sponsor - Metalor
Premier Tech Sponsor - Indium Corp.
Premier Tech Sponsor - NGK NTK

IMAPS 2016 - Pasadena
Packaging the Connected World
www.imaps2016.org

IMAPS 2016 Pasadena

Conference:
October 11-13, 2016
Exhibition:
October 11-12, 2016
Professional Development Courses:
October 10, 2016
General Chair:
Erica Folk
Northrop Grumman Corp.
Technical Chair:
Dan Krueger
Honeywell FM&T
     
Technical Co-Chair - USA:
Mary Cristina Ruales Ortega
University of Missouri, Kansas City
Technical Co-Chair - Europe:
André Rouzaud
CEA LETI
Technical Co-Chair - Asia:
Woong-Sun Lee
SK Hynix, Inc
Assistant Technical Co-Chair - USA:
Samson Shahbazi, Heraeus
Aric Shorey, Corning
Assistant Technical Co-Chairs - Europe:
Gabriel Parès, CEA LETI
Steffen Kroehnert, Nanium
Assistant Technical Co-Chair - Asia:
Kwang Sung Choi, ETRI
Seungwook Yoon, STATS ChipPAC Ltd.

Program & Registration Available mid-June

SUBMIT YOUR ABSTRACTS

Exhibition Application
(Full Exhibit Details in Spring)

Early Exhibit Fee Deadline Now: April 29, 2016


The 49th International Symposium on Microelectronics is being organized by the International Microelectronics Assembly and Packaging Society (IMAPS). The IMAPS 2016 Technical Committee seeks original papers that present progress on technologies throughout the entire microelectronics/packaging supply chain. The Symposium will feature 5-6 technical tracks that span the three days of sessions on: EMERGING APPLICATIONS & THE CONNECTED WORLD; 2.5/3D PACKAGING & EMBEDDED PACKAGING TECHNOLOGIES; ADVANCED PACKAGING AND ENABLING TECHNOLOGIES; ADVANCED MATERIALS & PROCESSES; MODELING, DESIGN, TEST & RELIABILITY; as well as the Interactive Poster Session.

Technical sessions are being planned for these tracks, and abstracts will be considered on the topics listed below. Abstracts are rated by the technical committee members and are selected into the sessions by the session chairs appointed by the technical committee. Authors should identify their preferred session (topical area) when submitting their abstracts. Abstracts should highlight the major contributions of the work in one or more of these areas. All abstracts submitted must represent original, previously unpublished work.

Track:
EMERGING APPLICATIONS & THE CONNECTED WORLD
Topics:
• Internet of Things "IoT" • Hardware-based Security • Counterfeit Avoidance • Printable Display & Lighting • Automotive Microelectronics: “Infotainment” • 3D printing • Packaging for Drones & Robotics • Packaging Roadmaps • Package Scaling • Printed Electronics & Additive Manufacturing • Sensor Packaging • RFIDs • Thin & Printed Battery Technology • Energy Harvesting • Enabling Technologies for Power Management • MEMS • Gyros & Accelerometers • Membrane & Capacitive Switches • Miniaturized Sensor Nodes
Featuring New Sessions on LIFE SCIENCES: • Wearable devices • Wireless Medical Devices • Packaging Implantables & Ingestibles • Portable & Patient Monitoring Devices • Bio-Tools & Instruments • Medical Packaging Components & Supply Chain • Microfluidics & Bio-MEMS

Track:
2.5/3D PACKAGING & EMBEDDED PACKAGING TECHNOLOGIES
Topics:
• TSV Materials & Processes • Silicon Interposers • Glass Interposers • Applications, Markets & Challenges for 2.5/3D Packaging & Integration • Technologies & Methods for 2.5/3D Packaging & Integration • Stacked Dies, Packages and Memories • PWB Embedded Device Technologies • High Density Interposers & Integrated Passives • Vertical Interconnects • Cost Considerations for 2.5/3D • Think Thin: Thin IC Packaging For Mobile • 3D Printing (Inkjet & others) • Embedded Packaging Technologies • Embedded Die in PCB/Substrate • "Active Interposers"
Track:
ADVANCED PACKAGING AND ENABLING TECHNOLOGIES
Topics:
• Panel-based Die Integration • Fan-out Wafer Level Packaging (FOWLP) • Flip Chip Interconnects & Technologies • Wafer Level Packaging • System Integration • Wirebonding & Stud Bumping • Chip Scale Packaging • Wafer Finishing (Bumping, Copper Pillar, Thinning) • Warpage Characterization and Mitigation • RF Devices • Optical Interconnects • Optical MEMS (MOEMS) • LED and Optoelectronics Packaging • Silicon Photonics • High Performance Interconnect & Boards • Novel Interconnections, Fabrication & Analysis Methods• RF and Microwave Packaging• Power Packaging • RFIDs
INVITED SESSION on: Chip Packaging Interactions with FOWLP and Embedded Die
Track:
ADVANCED MATERIALS & PROCESSES
Topics:
• Advanced Materials & Novel Assembly Processes • Polymers, Underfill/Encapsulants and Adhesives • Polymer Interposers • Substrate Materials • Ceramic & LTCC Packaging • Bonding Materials and Processes • Embedded and Integrated Passives • Thick / Thin Films • Pb-Free Solder & ROHS • Advanced 3D Materials • Automotive Electronics • Harsh Environment / High Temperature
Track:
MODELING, DESIGN, TEST & RELIABILITY
Topics:
• Design for Manufacturability • Design for Reliability • Design for Test • Modeling & Design for SI, PI and EMC • Reliability Testing Processes, Equipment & Standards • Thermal, Mechanical & Multi-Physics Modeling • Testing Methods and Process • Package Reliability Testing • Fine Pitch Probes • 3D Simulation and Modeling • Low-Power Design • High Reliability for Military/Aero Applications • High-rel Drilling/Geo-Thermal

 

SUBMIT YOUR ABSTRACTS

Industries Represented:
Consumer, Portable and Wireless Biomedical Telecom Defense and Security Computing, and Gaming
Automotive Applications Solar and Alternative Energy
Gas, Drilling & GeoThermal

Full Program available in Mid-June 2016. Please email Brian Schieman at bschieman@imaps.org with questions.

 


Student Presenters:

The Microelectronics Foundation sponsors Student Paper Competitions and Awards in conjunction with IMAPS 2016. Students submitting their work and identifying that "Yes, I'm a full-time student" on the abstract submission form, will automatically be considered for these awards. The review committee will evaluate all student papers/posters and award the following at the 2016 Symposium:

  • Three (3) "Outstanding Student Paper" Awards - $500 Each Award
  • One (1) "Best Student Paper of Symposium" Award - $2000 Award
  • One (1) "Best Student Poster Presentation" Award - $250 Award

The selected student must attend the event to present his or her work and receive the award.

The Microelectronics Foundation

 

IMAPS 2016 Poster Session:
Interactive Poster Session Student papers will be considered for this interactive session. Students submitting abstracts for the poster session will be required to submit a full paper which will be PEER-REVIEWED and considered for paper and poster awards noted above. If you are interested in presenting in the interactive session at IMAPS Symposium, select the "Poster Session" option under the session field on the abstract submission form.

 


Speaker/Author Information:

 

Abstracts Deadline Extended: April 22, 2016
Notice of Acceptance: June 1, 2016
Manuscripts Due for Peer-Review: July 1, 2016
Peer-Review Comments to Author: July 29, 2016
Final Papers Due To IMAPS: August 19, 2016
Early Registration / Hotel Deadline: September 14, 2016

Please send your abstract (recommended approximately 500 words) electronically only using the online submittal form at: www.imaps.org/abstracts.htm. All Speakers are required to pay a reduced registration fee. If you need assistance with the on-line submittal form, please email Brian Schieman at bschieman@imaps.org or call 412-368-1621.

Special Paper Recognition - Cash Awards Offered!

6 "Best of Track" Outstanding Papers - Six (6) $500 Cash Awards
Six "Best of Track" Winners will then be reviewed for...

1 Best Paper of the Symposium - One (1) additional $500 Cash Award for a "Best of Track" Winner


IMAPS Microelectronics Foundation Student Paper Awards
The Foundation is offering CASH AWARDS to the best papers submitted and presented by students at IMAPS 2015.

Accepted papers may be considered for publication in the IMAPS Journal of Microelectronics and Electronic Packaging.

 

Registration & Hotel Information:
(Early Registration Deadline: September 14, 2016)
| REGISTER ONLINE SOON

Full attendee registrations (not exhibits only) includes the Opening Ceremonies, IMAPS Annual Business Meeting, IMAPS Awards Ceremony, Keynote Presentations, Welcome Reception, Technical Sessions, GBC Plenary Session, Panel Discussion, Exhibit attendance, Breaks, Exhibit Hall Reception on Wednesday, Exhibit Hall Lunch on Tuesday, one 2016 Proceedings Download (and access via our Mobile APP) and an automatic one-year IMAPS membership renewal for individual and student members in good standing at the time of registration. For an additional fee you can register for a Professional Development Course (PDC), the Golf Tournament, and other activities/purchases. All prices below are subject to change.

Full Symposium cancellations will be refunded (less a $100 processing fee) only if written notice is postmarked on or before Friday, September 18, 2015. No refunds will be issued after that date.

ALL PRICING BELOW MAY CHANGE

Type
Early Fee
Through 9/14/2016
Advance/Onsite Fee
After 9/14/2016
IMAPS Member
$675
$775
Non-Member
$800
$900
Speaker
$550
$650
Chair
$550
$650
Chapter Officer
$550
$650
Student (IMAPS Member)
$35
$45
Student (Non-Member)
$45
$55
Exhibits Only TUESDAY
$35
$35
Exhibits Only WEDNESDAY
Complimentary
Complimentary
ADDITIONAL REGISTRATION FEES:
1 PDC (Full-Day: Monday)
$600
$700
1 PDC (Half-Day: Monday)
$400
$500
Golf (1 Golfer, Monday)
$125
$125

Register Online - SOON

 

Hotel Reservations (Hotel Deadline: September 14, 2016)
Reservations must be made directly with the:

Sheraton Pasadena Hotel (HOST HOTEL - NEXT DOOR TO CC)
Single/Double: $209 + taxes/fee
REGISTER ONLINE

Hilton Pasadena Hotel (6-minute Walk to CC)
Single/Double: $195 + taxes/fee
REGISTER ONLINE

Book your hotel reservation today! We have reserved a block of rooms at the host hotel to accommodate our attendees. The discounted room rates are only available until the hotel deadline listed above, or until the room block sells out (and they often sell out early - before the expire dates). Reservations received after the noted deadline or after the room block has been filled may be subject to significantly higher rates. IMAPS room blocks at most hotels historically sell out ahead of the discount deadline, so we encourage you to make your hotel reservations quickly for the best price and availability.

Hotel Scams Alert - The only way to book a room in the official IMAPS Housing Block using the reservations information above. IMAPS does not authorize any other hotel service/group to operate on its behalf.

 

 


PREMIER Sponsors:

 

    Premier Program Sponsor:
Premier Program Sponsor - Heraeus Materials Technology

    Premier Technology Sponsor:

    Premier Technology Sponsor:
    Premier Technology Sponsor:
Premier Tech Sponsor - Metalor
Premier Tech Sponsor - Indium Corp.
Premier Tech Sponsor - NGK NTK
CORPORATE Sponsors:
available
Event Sponsors:
Dessert "Happy Hour" Sponsor:

Palomar Technologies: Dessert "Happy Hour" Sponsor
Posters & Pizza Sponsor:

Northrop Grumman EC - Poster Session Sponsor
available
 
Golf Sponsors
golf holes still available
     
Media Sponsors
available
     

 




CORPORATE PREMIER MEMBERS
  • Amkor
  • ASE
  • Canon
  • GaN Systems
  • Honeywell
  • Indium
  • Isola Group
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • NEO Tech
  • NGK NTK
  • Palomar
  • Plexus
  • Qualcomm
  • Specialty Coating Systems