KESTER


IMAPS 2017 - Raleigh

IMAPS 2017 - Raleigh
IMAPS 50th Anniversary Symposium
www.imaps2017.org | www.imaps50th.org

Conference:
October 10-12, 2017
Exhibition:
October 10-11, 2017
Professional Development Courses:
October 9, 2017
General Chair:
Dan Krueger
Honeywell FM&T
Technical Chair:
Mary Cristina Ruales Ortega
University of Missouri, Kansas City
Technical Co-Chair:
Andre Rouzaud
CEA Leti

 
    PREMIER PROGRAM SPONSOR:
 
 
Premier Program Sponsor - Heraeus Materials Technology

 

    PREMIER TECHNOLOGY SPONSOR :

   PREMIER TECHNOLOGY SPONSOR:
   PREMIER TECHNOLOGY SPONSOR:
Premier Tech Sponsor - NGK NTK
Premier Tech Sponsor - EMD Performance Materials
available

 

Program Coming Soon!

Register Online | Call for History

   
Charity Golf Outing
   

 

The 50th International Symposium on Microelectronics is being organized by the International Microelectronics Assembly and Packaging Society (IMAPS). The IMAPS 2017 Technical Committee seeks original papers that present progress on technologies throughout the entire microelectronics/packaging supply chain. The Symposium will feature 5 technical tracks that span the three days of sessions on: CHIP PACKAGING INTERACTIONS (CPI); HIGH PERFORMANCE, RELIABILITY, & SECURITY; ADVANCED PACKAGING AND ENABLING TECHNOLOGIES; ADVANCED PACKAGING & SYSTEM INTEGRATION; ADVANCED MATERIALS & PROCESSES; as well as the Interactive Poster Session.

Technical sessions are being planned for these tracks, and abstracts will be considered on the session topic listed below. Abstracts are rated by the technical committee members and are selected into the sessions by the session chairs appointed by the technical committee. Authors should identify their preferred session (topical area) when submitting their abstracts. Abstracts should highlight the major contributions of the work in one or more of these areas. All abstracts submitted must represent original, previously unpublished work.

The speaker/abstract timeline and process has changed this year significantly as we further enhance our peer review process and we move to further improve the quality of our technical program.

TRACK 1:
CHIP PACKAGING INTERACTIONS (CPI)
TRACK 2:
HIGH PERFORMANCE, RELIABILITY, & SECURITY
TRACK 3:
ADVANCED PACKAGING & ENABLING TECHNOLOGIES
TRACK 4:
ADVANCED PACKAGING & SYSTEM INTEGRATION
TRACK 5:
ADVANCED MATERIALS & PROCESSES

PLANNED SESSIONS:

• Advanced CMOS Nodes
• System Integration
• Materials & Reliability
• Process Integration I
• Process Integration II

PLANNED SESSIONS:

• Packaging to meet the RF Roadmap - 2.4 to 26 to 60 GHz
• Miniaturization of Bio-devices
• Batteries and Energy Harvesting
• Assuring Device Security - Network and Microelectronic Solutions
• Extreme Environment Device Reliability

PLANNED SESSIONS:

• 3D Technologies: Materials, Processes, and Applications
• Emerging Packaging Technologies
• Fan-out Wafer Level packaging
• Embedded Packaging
• LTCC and Ceramic Technologies

PLANNED SESSIONS:

• Wafer Level Packaging & System-Integration I
• Wafer Level Packaging & System-Integration II
• Panel/Board level System-Integration I
• Panel/Board level System-Integration II
• Antennas & Advanced RF System-Integration

PLANNED SESSIONS:

• Substrate Materials/Processing
• Polymers in Microelectronics
• Novel Materials/Processes
• Reliability
• Additive Manufacturing

TRACK 6:
INTERACTIVE POSTER SESSION - "Posters & Pizza Lunch"

 

 

 

 


Speaker/Author Information:

 
  • "Call For Abstracts" Open: October 1, 2016
  • 1,000-Word Abstract Deadline NOW: DUE IMMEDIATELY
  • Speaker Notification #1 - abstract received: Auto-Email upon submission
  • Speaker Notification #2 - ABSTRACT Acceptance: April 12, 2017
  • Manuscripts Due for Peer-Review: May 17, 2017
  • Peer-Review Comments to Author: July 28, 2017
  • Speaker Notification #3 - Final PAPER Acceptance/Rejection: July 28, 2017
    • SPEAKERS MUST BE REGISTERED OR YOU WILL BE REMOVED FROM THE PROGRAM LISTING
    • All Speakers are required to pay a reduced registration fee
  • Revisions Complete - Final Papers Due To IMAPS: August 25, 2017
  • Early Registration / Hotel Deadline: September 8, 2017
  • 2-3 Sentence BIO due NOT LATER THAN: September 15, 2017

    Paper Format/Template
    IMAPS emailed all the speakers the required paper template upon acceptance and with instructions for paper submission and peer review.

    Presentation Format/Template:
    IMAPS does not require you to use a conference powerpoint template.
    You are able to use your regular company/preferred powerpoint templates.
    Please include the IMAPS show name and dates on your template and/or an IMAPS logo.

    Dress Code:
    There is no officially "dress code" for IMAPS Conferences. We ask you to be BUSINESS CASUAL or whatever more you prefer. Most speakers tend to be in business pants and button down/company logo shirts (Women in dresses or the same). Suits, sport coats and ties are common as well. We do not recommend casual attire.

    Session rooms will be equipped with:
    Screen, projector, podium, IMAPS laptop (with Microsoft Windows and recent OFFICE suite), microphone, and slide remote/laser pointer.

    All session presentations are 20 minutes followed by 5 minutes for Questions
    You are required to load your powerpoint/presentation onto the session laptop yourself using your USB drive.
    Speak with your session chair if you need assistance.

    About the Session:
    Sessions begin with Session Chairs making general announcements. Session Chairs will then introduce speakers by reading BIOs. Speaker will present for 20 minutes, followed by 5 minutes for questions. Session Chairs will thank the speakers. This process is repeated for each speaker in the session. Many sessions will take refreshment breaks (see program).

    Poster Session/Information
    The poster session is planned to be an INTERACTIVE presentation. This means you do not start and complete a scheduled talk without interuption like in a regular/oral session. Speakers should have talking points and be at their poster throughout the entire session. You can "present" your scheduled materials, but more often the attendees will review your slides and ask questions. Or you can watch them and talk to them depending on which slide they are on. .

    Authors may either print out each of their powerpoint slides on regular paper and tack them up in order, or prepare a large poster (or 2 even). Recommended poster size is typically 3x4 feet, with the max space on the board being 4 ft high x 8 ft wide. IMAPS staff will provide tacks to secure your print outs. The session is first-come-first-serve so there are not assigned poster boards/locations. POSTER SETUP FROM 10AM UNTIL 11:15AM.

    Photography is not permitted in the session rooms.

    Silence all mobile phones during session attendance.


Special Paper Recognition - Cash Awards Offered!

6 "Best of Track" Outstanding Papers - Six (6) $500 Cash Awards
Six "Best of Track" Winners will then be reviewed for...

1 Best Paper of the Symposium - One (1) additional $500 Cash Award for a "Best of Track" Winner


IMAPS Microelectronics Foundation Student Paper Awards
The Foundation is offering CASH AWARDS to the best papers submitted and presented by students at IMAPS Symposium.

Accepted papers may be considered for publication in the IMAPS Journal of Microelectronics and Electronic Packaging.

 

Student Presenters:

The Microelectronics Foundation sponsors Student Paper Competitions and Awards in conjunction with IMAPS 2017. Students submitting their work and identifying that "Yes, I'm a full-time student" on the abstract submission form, will automatically be considered for these awards. The review committee will evaluate all student papers/posters and award the following at the 2017 Symposium:

  • Three (3) "Outstanding Student Paper" Awards - $500 Each Award
  • One (1) "Best Student Paper of Symposium" Award - $2000 Award
  • One (1) "Best Student Poster Presentation" Award - $250 Award

The selected student must attend the event to present his or her work and receive the award.

The Microelectronics Foundation

 

IMAPS 2017 Poster Session:
Interactive Poster Session Student papers will be considered for this interactive session. Students submitting abstracts for the poster session will be required to submit a full paper which will be PEER-REVIEWED and considered for paper and poster awards noted above. If you are interested in presenting in the interactive session at IMAPS Symposium, select the "Poster Session" option under the session field on the abstract submission form.

 


Registration & Hotel Information:
(Early Registration Deadline: September 8, 2017)
| REGISTER ONLINE

Full attendee registrations (not exhibits only) includes the Opening Ceremonies, IMAPS Annual Business Meeting, IMAPS Awards Ceremony, Keynote Presentations, Welcome Reception, Technical Sessions, GBC Plenary Session, Panel Discussion, Exhibit attendance, Breaks, Exhibit Hall Reception on Wednesday, Exhibit Hall Lunch on Tuesday, one 2017 Proceedings Download (and access via our Mobile APP) and an automatic one-year IMAPS membership renewal for individual and student members in good standing at the time of registration. For an additional fee you can register for a Professional Development Course (PDC), the Golf Tournament, and other activities/purchases. All prices below are subject to change.

Full Symposium cancellations will be refunded (less a $100 processing fee) only if written notice is postmarked on or before Friday, September 8, 2017. No refunds will be issued after that date.

 

Type
Early Fee
Through 9/8/2017
Advance/Onsite Fee
After 9/8/2017
IMAPS Member
$775
$875
Non-Member
$875
$975
Speaker
$625
$725
Chair
$625
$725
Chapter Officer
$625
$725
Student (IMAPS Member)
$50
$75
Student (Non-Member)
$75
$100
Exhibits Only (LUNCH INCLUDED)
$30
$30
Exhibits Only (NO LUNCH INCLUDED)
Complimentary
Complimentary
ADDITIONAL REGISTRATION FEES:
Short Course / Professional Development Course "PDC" (one 2-hour PDC: Monday -- can take up to four total)
$300
$400
Golf (1 Golfer, Monday) - Scramble 9am Start at Lonnie Pool Golf Course NCSU
$125
$125

Register Online

 

Hotel Reservations (Hotel Deadline: September 8, 2017)
The Conference & Exhibition is being held at the Raleigh Convention Center (500 S Salisbury St, Raleigh, NC 27601).

Book your hotel reservation today! We have reserved a block of rooms at the host hotel to accommodate our attendees. The discounted room rates are only available until the hotel deadline listed above, or until the room block sells out (and they often sell out early - before the expire dates). Reservations received after the noted deadline or after the room block has been filled may be subject to significantly higher rates. IMAPS room blocks at most hotels historically sell out ahead of the discount deadline, so we encourage you to make your hotel reservations quickly for the best price and availability.

IMAPS is pleased to partner with the following hotels for IMAPS 2017:

Marriott Raleigh City Center
500 Fayetteville St, Raleigh, NC 27601
Single/Double - $174 + Taxes/Fees
Click here to book the Marriott online.
Sheraton Downtown Raleigh
421 S Salisbury St, Raleigh, NC 27601
Single/Double - $189 + Taxes/Fees
Click here to book the Sheraton online.

Both hotels are considered host hotels for IMAPS 2017 and are located directly across the street from the Raleigh Convention Center (less than one block).

Hotel Scams Alert - The only way to book a room in the official IMAPS Housing Block using the reservations information above. IMAPS does not authorize any other hotel service/group to operate on its behalf.

 

PREMIER Sponsors:

 

    Premier Program Sponsor:
Premier Program Sponsor - Heraeus Materials Technology

    Premier Technology Sponsor:

    Premier Technology Sponsor:
    Premier Technology Sponsor:
Premier Tech Sponsor - NGK NTK
Premier Tech Sponsor - EMD Performance Materials
AVAILABLE
Event Sponsors:
Dessert "Happy Hour" Sponsor:

Palomar Technologies: Dessert "Happy Hour" Sponsor
Keynote Sponsor:

Keynote Sponsor: SAMTEC

Exhibit Lunch Sponsor:

Lunch Sponsor: MRSI

Coffee Break Sponsor:

Break Sponsor: Geib Refining

Coffee Break Sponsor:

Break Sponsor: Pac Tech

Bag Insert Sponsor:

Bag Insert Sponsor: NorCom Systems

   
Golf Sponsors
EMD Performance Materials - Corporate Sponsor
golf holes/sponsors still available
   
Media Sponsors
Media Sponsor: MEMS Journal
Media Sponsor: US Tech
Solid State Technology - Media Sponsor
Media Sponsor: MEPTEC
3D Incites - Media Sponsor
Media Sponsor: Webcom - Antenna Systems & Technology
Media Sponsor: Webcom - Electronics Protection
Media Sponsor: Webcom - Thermal News
Media Sponsor: Chip Scale Review
     

 


 




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