KESTER


IMAPS 2017 - Raleigh

IMAPS 2017 - Raleigh
IMAPS 50th Anniversary Symposium
www.imaps2017.org | www.imaps50th.org

Conference:
October 10-12, 2017
Exhibition:
October 10-11, 2017
Professional Development Courses:
October 9, 2017
General Chair:
Dan Krueger
Honeywell FM&T
Technical Chair:
Mary Cristina Ruales Ortega
University of Missouri, Kansas City
Technical Co-Chair:
Andre Rouzaud
CEA Leti

 
    PREMIER PROGRAM SPONSOR:
 
 
Premier Program Sponsor - Heraeus Materials Technology

 

    PREMIER TECHNOLOGY SPONSOR :

   PREMIER TECHNOLOGY SPONSOR:
   PREMIER TECHNOLOGY SPONSOR:
Premier Tech Sponsor - NGK NTK
Premier Tech Sponsor - EMD Performance Materials
available

 

Early Registration & Hotel Deadlines: September 8, 2017

Register Online | Call for History

       

 

We hope you can join us at IMAPS 2017, Raleigh --
the 50th International Symposium on Microelectronics!

IMAPS Raleigh is the LARGEST Conference Program for Microelectronics,
Assembly, Reliabiity, Emerging Applications, Materials &
Advanced Packaging in the FALL of 2017:
3 Days, 25 Sessions, 4 Keynotes, 140+ Speakers!!

The Symposium will feature 5 technical tracks that span the three days of sessions on:

TRACK 1:
CHIP PACKAGING INTERACTIONS (CPI)
TRACK 2:
HIGH PERFORMANCE, RELIABILITY, & SECURITY
TRACK 3:
ADVANCED PACKAGING & ENABLING TECHNOLOGIES
TRACK 4:
ADVANCED PACKAGING & SYSTEM INTEGRATION
TRACK 5:
ADVANCED MATERIALS & PROCESSES

CPI SESSIONS:

• Materials & Reliability I
• System Integration
• Advanced CMOS Nodes
• Process Integration
• Materials & Reliability II

HI-REL SESSIONS:

• Packaging to meet the RF Roadmap - 2.4 to 26 to 60 GHz
• Miniaturization of Bio-devices
• Power, Batteries and Energy Harvesting
• Extreme Environment Device Reliability
• Assuring Device Security - Network and Microelectronic Solutions

ADV PACKAGING SESSIONS:

• 3D Technologies: Materials, Processes, and Applications
• Emerging Packaging Technologies
• LTCC and Ceramic Technologies
• Fan-out Wafer Level packaging
• Embedded Packaging

SYSTEM INTEGRATION SESSIONS:

• Wafer Level Packaging & Panel Level Packaging
• Heterogeneous & Complex System Packaging
• Wire Bonding
• Antennas & Advanced RF System-Integration
• Panel/Board level System-Integration

MATERIALS SESSIONS:

• Novel Materials/Processes I
• Polymers in Microelectronics
• Novel Materials/Processes II
• Reliability
• Additive Manufacturing

TRACK 6:
INTERACTIVE POSTER SESSION - "Posters & Pizza Luncheon"

 

 

IMAPS 2017 Advance Program
Download the Advance Program PDF

Warm greetings and a BIG "Hello" to IMAPS members and the worldwide microelectronics community!

Dan Krueger, Honeywell FM&T
General Chair, IMAPS 2017
Mary Cristina Ruales Ortega, Univ of Missouri, Kansas City
Technical Chair, IMAPS 2017

Welcome to the IMAPS 50th Annual International Symposium on Microelectronics. We hope that you will be able to join us from October 9th to 12th at the Raleigh Convention Center in Raleigh, North Carolina and participate in the many events that are planned for IMAPS 2017.

You will find a IMAPS 2017 program with technical sessions balancing between emerging, new and mature topics, and a large cross-section of vendors exhibiting their products and technologies in the exhibition hall.

The IMAPS committees and many dedicated volunteers have been working together over the past six months to prepare for the 2017 Symposium with an emphasis on bringing exciting topics that are relevant within the microelectronics community. This year’s Technical Committee, chaired by Mary Cristina Ruales Ortega, has prepared technical sessions with topics on: fan-out wafer level packaging; embedded packaging; heterogeneous & complex system packaging; advanced CMOS nodes; miniaturization of bio-devices; 3D technologies; wire bonding; additive manufacturing; materials; and much more.

Complementing the technical sessions, we are also planning multiple Professional Development Courses (PDCs) with variety of topics bound to enhance and broaden your technical portfolio. This will be held on Monday, October 9, prior to the kick-off of the technical sessions.

The IMAPS Exhibition returns featuring a 2-day show floor with more than 120 exhibit booths, featuring companies and research labs that will showcase a vast array of new products serving all segments of the microelectronics industry, including Consumer, Healthcare and Biomedical, Military, Aerospace, Computing, and Automotive/Industrial. Browsing the exhibit hall and talking to the exhibitors are bound to be exciting and we hope that this enables you to learn the latest and greatest solutions to the changing needs in your business and research.

We hope you can take some time from your busy schedules to attend IMAPS 2016, to learn about the changing world of microelectronics packaging in the 21st century. Next stop: RALEIGH!

 

There is also a lot of other exciting activites for the 50th Anniversary of IMAPS and much more!
Sign up for the IMAPS Microelectronics Foundation David C. Virissimo Memorial Golf Classic, the Welcome Reception and opening ceremonies, to name only a few.

We hope you join us for the 50th International Symposium on Microelectronics - IMAPS 2017, RALEIGH!

Technical Program | PDCs (Short Courses) | Register Online

 

 

 

 


Speaker/Author Information:

 
  • "Call For Abstracts" Open: October 1, 2016
  • 1,000-Word Abstract Deadline NOW: DUE IMMEDIATELY
  • Speaker Notification #1 - abstract received: Auto-Email upon submission
  • Speaker Notification #2 - ABSTRACT Acceptance: April 12, 2017
  • Manuscripts Due for Peer-Review: May 17, 2017
  • Peer-Review Comments to Author: August 24, 2017
  • Speaker Notification #3 - Final PAPER Acceptance/Rejection: August 24, 2017
    • SPEAKERS MUST BE REGISTERED OR YOU WILL BE REMOVED FROM THE PROGRAM LISTING
    • All Speakers are required to pay a reduced registration fee
  • Revisions Complete - Final Papers Due To IMAPS: September 15, 2017
  • 2-3 Sentence BIO due NOT LATER THAN: September 15, 2017
  • Early Registration / Hotel Deadline: September 8, 2017

    Paper Format/Template
    IMAPS emailed all the speakers the required paper template upon acceptance and with instructions for paper submission and peer review.

    Presentation Format/Template:
    IMAPS does not require you to use a conference powerpoint template.
    You are able to use your regular company/preferred powerpoint templates.
    Please include the IMAPS show name and dates on your template and/or an IMAPS logo.

    Dress Code:
    There is no officially "dress code" for IMAPS Conferences. We ask you to be BUSINESS CASUAL or whatever more you prefer. Most speakers tend to be in business pants and button down/company logo shirts (Women in dresses or the same). Suits, sport coats and ties are common as well. We do not recommend casual attire.

    Session rooms will be equipped with:
    Screen, projector, podium, IMAPS laptop (with Microsoft Windows and recent OFFICE suite), microphone, and slide remote/laser pointer.

    All session presentations are 20 minutes followed by 5 minutes for Questions
    You are required to load your powerpoint/presentation onto the session laptop yourself using your USB drive.
    Speak with your session chair if you need assistance.

    About the Session:
    Sessions begin with Session Chairs making general announcements. Session Chairs will then introduce speakers by reading BIOs. Speaker will present for 20 minutes, followed by 5 minutes for questions. Session Chairs will thank the speakers. This process is repeated for each speaker in the session. Many sessions will take refreshment breaks (see program).

    Poster Session/Information
    The poster session is planned to be an INTERACTIVE presentation. This means you do not start and complete a scheduled talk without interuption like in a regular/oral session. Speakers should have talking points and be at their poster throughout the entire session. You can "present" your scheduled materials, but more often the attendees will review your slides and ask questions. Or you can watch them and talk to them depending on which slide they are on. .

    Authors may either print out each of their powerpoint slides on regular paper and tack them up in order, or prepare a large poster (or 2 even). Recommended poster size is typically 3x4 feet, with the max space on the board being 4 ft high x 8 ft wide. IMAPS staff will provide tacks to secure your print outs. The session is first-come-first-serve so there are not assigned poster boards/locations. POSTER SETUP FROM 10AM UNTIL 11:15AM.

    Photography is not permitted in the session rooms.

    Silence all mobile phones during session attendance.


Special Paper Recognition - Cash Awards Offered!

6 "Best of Track" Outstanding Papers - Six (6) $500 Cash Awards
Six "Best of Track" Winners will then be reviewed for...

1 Best Paper of the Symposium - One (1) additional $500 Cash Award for a "Best of Track" Winner


IMAPS Microelectronics Foundation Student Paper Awards
The Foundation is offering CASH AWARDS to the best papers submitted and presented by students at IMAPS Symposium.

Accepted papers may be considered for publication in the IMAPS Journal of Microelectronics and Electronic Packaging.

 

Student Presenters:

The Microelectronics Foundation sponsors Student Paper Competitions and Awards in conjunction with IMAPS 2017. Students submitting their work and identifying that "Yes, I'm a full-time student" on the abstract submission form, will automatically be considered for these awards. The review committee will evaluate all student papers/posters and award the following at the 2017 Symposium:

  • Three (3) "Outstanding Student Paper" Awards - $500 Each Award
  • One (1) "Best Student Paper of Symposium" Award - $2000 Award
  • One (1) "Best Student Poster Presentation" Award - $250 Award

The selected student must attend the event to present his or her work and receive the award.

The Microelectronics Foundation

 

IMAPS 2017 Poster Session:
Interactive Poster Session Student papers will be considered for this interactive session. Students submitting abstracts for the poster session will be required to submit a full paper which will be PEER-REVIEWED and considered for paper and poster awards noted above. If you are interested in presenting in the interactive session at IMAPS Symposium, select the "Poster Session" option under the session field on the abstract submission form.

 


Registration & Hotel Information:
(Early Registration Deadline: September 8, 2017)
| REGISTER ONLINE

Full attendee registrations (not exhibits only) includes the Opening Ceremonies, IMAPS Annual Business Meeting, IMAPS Awards Ceremony, Keynote Presentations, Welcome Reception, Technical Sessions, GBC Plenary Session, Panel Discussion, Exhibit attendance, Breaks, Exhibit Hall Reception on Wednesday, Exhibit Hall Lunch on Tuesday, one 2017 Proceedings Download (and access via our Mobile APP) and an automatic one-year IMAPS membership renewal for individual and student members in good standing at the time of registration. For an additional fee you can register for a Professional Development Course (PDC), the Golf Tournament, and other activities/purchases. All prices below are subject to change.

Full Symposium cancellations will be refunded (less a $100 processing fee) only if written notice is postmarked on or before Friday, September 8, 2017. No refunds will be issued after that date.

 

Type
Early Fee
Through 9/8/2017
Advance/Onsite Fee
After 9/8/2017
IMAPS Member
$775
$875
Non-Member
$875
$975
Speaker
$625
$725
Chair
$625
$725
Chapter Officer
$625
$725
Student (IMAPS Member)
$50
$75
Student (Non-Member)
$75
$100
Exhibits Only (LUNCH INCLUDED)
$30
$30
Exhibits Only (NO LUNCH INCLUDED)
Complimentary
Complimentary
ADDITIONAL REGISTRATION FEES:
Short Course / Professional Development Course "PDC" (one 2-hour PDC: Monday -- can take up to four total)
$300
$400
Golf (1 Golfer, Monday) - Scramble 9am Start at Lonnie Pool Golf Course NCSU
$125
$125

Register Online

 

Hotel Reservations (Hotel Deadline: September 8, 2017)
The Conference & Exhibition is being held at the Raleigh Convention Center (500 S Salisbury St, Raleigh, NC 27601).

Book your hotel reservation today! We have reserved a block of rooms at the host hotel to accommodate our attendees. The discounted room rates are only available until the hotel deadline listed above, or until the room block sells out (and they often sell out early - before the expire dates). Reservations received after the noted deadline or after the room block has been filled may be subject to significantly higher rates. IMAPS room blocks at most hotels historically sell out ahead of the discount deadline, so we encourage you to make your hotel reservations quickly for the best price and availability.

IMAPS is pleased to partner with the following hotels for IMAPS 2017:

Marriott Raleigh City Center
500 Fayetteville St, Raleigh, NC 27601
Single/Double - $174 + Taxes/Fees
Click here to book the Marriott online.
Sheraton Downtown Raleigh
421 S Salisbury St, Raleigh, NC 27601
Single/Double - $189 + Taxes/Fees
Click here to book the Sheraton online.

Both hotels are considered host hotels for IMAPS 2017 and are located directly across the street from the Raleigh Convention Center (less than one block).

Hotel Scams Alert - The only way to book a room in the official IMAPS Housing Block using the reservations information above. IMAPS does not authorize any other hotel service/group to operate on its behalf.

 

PREMIER Sponsors:

 

    Premier Program Sponsor:
Premier Program Sponsor - Heraeus Materials Technology

    Premier Technology Sponsor:

    Premier Technology Sponsor:
    Premier Technology Sponsor:
Premier Tech Sponsor - NGK NTK
Premier Tech Sponsor - EMD Performance Materials
AVAILABLE
Event Sponsors:
Keynote Sponsor:

Keynote Sponsor: SAMTEC

Exhibit Lunch Sponsor:

Lunch Sponsor: MRSI

Coffee Break Sponsor:

Break Sponsor: Geib Refining

Coffee Break Sponsor:

Break Sponsor: Pac Tech

Bag Insert Sponsor:

Bag Insert Sponsor: NorCom Systems

More sponsorships available
   
Golf Sponsors
EMD Performance Materials - Corporate Sponsor
golf holes/sponsors still available
   
Media Sponsors
Media Sponsor: MEMS Journal
Media Sponsor: US Tech
Solid State Technology - Media Sponsor
Media Sponsor: MEPTEC
3D Incites - Media Sponsor
Media Sponsor: Webcom - Antenna Systems & Technology
Media Sponsor: Webcom - Electronics Protection
Media Sponsor: Webcom - Thermal News
Media Sponsor: Chip Scale Review
     

 


 




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