IMAPS 2017 - Raleigh

IMAPS 2017 - Raleigh
IMAPS 50th Anniversary Symposium |

October 10-12, 2017
October 10-11, 2017
Professional Development Courses:
October 9, 2017
General Chair:
Dan Krueger
Honeywell FM&T
Technical Chair:
Mary Cristina Ruales Ortega
University of Missouri, Kansas City
Technical Co-Chair:
Andre Rouzaud
CEA Leti

Premier Program Sponsor - Heraeus Materials Technology



Premier Tech Sponsor - NGK NTK
Premier Tech Sponsor - EMD Performance Materials

(Keynote Presentations, Sessions, Posters, and more!)

Register Online | Call for History



Monday, October 9, 2017

IMAPS Microelectronics Foundation David C. Virissimo Memorial Golf Classic | 9:00 AM - "Scramble"

Professional Development Courses (PDCs) - 8:00 AM - 5:30 PM)

Microelectronics/Packaging Industry Tour - 10:30 AM - 2:00 PM - TBD
Micross Advanced Interconnect Technology (AIT), a specialized division of Micross
Micross is the leading one-source, one-solution provider of bare die & wafers, wafer bumping & advanced interconnect technologies, custom packaging & assembly, component modification services, electrical & environmental testing and Hi-Rel products to manufacturers and users of semiconductor devices. In business for 35+ years, our comprehensive array of high-reliability capabilities serves the global defense, space, medical, industrial and fabless semiconductor markets. Micross possesses the sourcing, packaging, assembly, test and logistics expertise needed to support an application throughout its entire program cycle.

Micross Advanced Interconnect Technology (AIT), a specialized division of Micross, is home to one of the premier wafer bumping and wafer level packaging facilities in the U.S., with 20+ years of experience developing and providing leading edge interconnect and 3D integration technologies (TSV, Si interposers, 3D IC) to customers around the world. AIT has the unique ability to support early stage development needs as well as low-to-mid volume production for more mature applications and platform technologies. Our ITAR-registered facility supports wafer sizes up to 200mm with established and proven processes and the flexibility to tailor unique solutions for your most demanding interconnect requirements. The facility can also support the processing of non-standard materials, as well as the fabrication of novel device structures (e.g. MEMS and 3D microstructures).

Arrival and sign-in 11:10 -11:25
Introduction/Welcome to AIT (20-30 min) 11:30-12
Lunch 12-1 (IMAPS will bring in catered lunch for group)
Tour 1 (10-12 people): 11:55 ~12:40 Tour 2 (10-12 people): 12:00~12:45 Tour 3 (10-12 people): 12:05~12:50
Coffee in lobby 12:30-1:00
Depart 1:00

Welcome Reception | 5:30 PM - 7:30 PM

Welcome Reception Sponsored by:

   Premier Program Sponsor:
Heraeus Materials Technology - Premier Sponsor, Gold



Monday, October 9: 2-hour formats, by theme/track
8:00 AM-10:00 AM | 10:30 AM - 12:30 PM | 1:00 PM - 3:00 PM | 3:30 PM - 5:30 PM
*Attendees can take ONE PDC during each timeslot*

  Track A:
Intro to Microelectronics Packaging
Track B:
Next Generation Packaging Challenges
Track C:
Baseline and Emerging Technologies
Track D:
8:00 AM-10:00 AM A1: Introduction to System in Package (SiP) - The Heterogeneous Integration Driver - Mark Gerber, ASE Group

B1: Emerging Challenges in Semiconductor Packaging - Raja Swaminathan, Intel

C1: 2.5D IC Integration and TSV-less Interposers - John Lau, ASM Pacific Technology D1: Choosing Solders for the New Era: Low cost High Reliability Solder Alloy - Ning-Cheng Lee, Indium Corporation
10:00 AM-10:30 AM
Coffee / Networking
Open to all PDC participants
10:30 AM - 12:30 PM A2: Fundamentals of 3D and 2.5D Packaging Integration - Urmi Ray, STATS ChipPAC B2: Introduction to Package-on-Package (PoP) Design, Assembly and Quality: Focus on New Trends and Applications for Advanced Packaging - Fernando Roa, Amkor Technology, Inc C2: Workmanship Standards for Advanced Hybrids, ICs and Microwave Assemblies - Tom Green, TJ Green Associates D2: A Methodology for Understanding the Reliability of Electronic Packaging - Greg Caswell, DfR Solutions
12:30 PM-1:00 PM
Open ONLY to PDC participants taking morning AND afternoon courses
1:00 PM-3:00 PM A3: Wire bonding Fundamentals - Lee Levine, Process Solutions Consulting B3: Introduction to Fan Out Packaging - John Hunt, ASE Group C3: Photonic Interconnects - an Overview - Kannan Raj, Oracle D3: Package/Board Level Integrity & Solder Joint Reliability - Jennie Hwang, H-Technologies Group
3:00 PM-3:30 PM
Coffee / Networking
Open to all PDC participants
3:30 PM-5:30 PM A4: Introduction to Copper Pillar Flip Chip Interconnect - Mark Gerber, ASE US Inc. B4: Fan Out Packaging Evolution & Complexity - John Hunt, ASE Group C4: Heterogeneous Packaging of Wide Band Gap Power Electronics: Moving from IPM to SiP - Doug Hopkins, North Carolina State University D4: Copper and Gold Ball Bonding: Intermetallics, Aging and Bond Reliability - Lee Levine, Process Solutions Consulting
5:30 PM-7:30 PM
Welcome Reception
Open to all IMAPS 2017 participants


Cost for Each PDC: $300 (on/before 9/8/2017); $400 (after 9/8/2017)
Register Online




7:00 AM - 6:00 PM: Registration Open
12:00 PM - 5:00 PM: Exhibit Hall Open

IMAPS 2017 Opening & Plenary Session:

8:00 am - 8:15 am: Welcome to IMAPS 2017!
IMAPS President, Susan Trulli and General Chair, Dan Krueger

Keynote Session sponsored by:
Keynote Sponsor: SAMTEC


8:15 am - 9:00 am: Keynote Presentation 1

Keynote - Roawen Chen

TITLE - Soon
Abstract - Soon

Roawen Chen, Senior Vice President of Global Operations, Qualcomm
Dr. Roawen Chen is currently Senior Vice President of Global Operations at Qualcomm. In this role, Roawen oversees the worldwide operations including supply chain management, silicon and package technology, quality and reliability, module engineering, procurement, and Asia operation functions for Qualcomm semiconductor business. He has overall responsibility for driving the global supply chain to support $20 billions annual revenue, the largest one in fabless semiconductor industry.

Roawen is an experienced leader in semiconductor industry with diversified background in playing leading roles in multiple functions. In addition to his strong technical depth, he has proven experience in building fabless global supply chains and driving large organization to support high volume production. Prior to Qualcomm, Roawen was Vice President of Manufacturing Operations at Marvell Semiconductor in Santa Clara, California. Additionally, Roawen held a variety of leadership roles, including Vice President and General Manager of the Communications and Computing business unit and Vice President and General Manager of the Connectivity business unit, during his tenure in Marvell.

Prior to Marvell, Roawen held technical and business positions at Intel and TSMC-US. He earned a bachelor's degree in Physics from Tsing-Hua University in Taiwan, and a PhD in Electrical Engineering and Computer Science from the University of California, Berkeley. He served the Board of Directors at Global Semiconductor Alliance and a number of non-profitable organizations.

9:00 am - 9:45 am: Keynote Presentation 2

Keynote - Subu Iyer

Packaging without the Package - A More Holistic Moore's Law
Silicon features have scaled by over 1500X for over six decades, and with the adoption of innovative materials delivered better power-performance, density and till recently, cost per function, almost every generation. This has spawned a vibrant system-on-chip (SoC) approach, where progressively more function has been integrated on a single die. The integration of multiple dies on packages and boards has, however, scaled only modestly by a factor of three to five times. However, as SoCs have become bigger and more complex, the Non-Recurring Engineering (NRE) Charge and time to market have both ballooned out of control leading to ever increasing market consolidation. We need to address this problem through novel methods of system Integration. With the well-documented slowing down of scaling and the advent of the Internet of Things, there is a focus on heterogeneous integration and system-level scaling. Packaging itself is undergoing a transformation that focuses on overall system performance through integration rather than on packaging individual components. We propose ways in which this transformation can evolve to provide a significant value at the system level while providing a significantly lower barrier to entry compared with a chip-based SoC approach that is currently used. More importantly it will allow us to re-architect systems in a very significant way. This transformation is already under way with 3-D stacking of dies, Wafer level fan-out processing, and will evolve to make heterogeneous integration the backbone of a new SoC methodology, extending to integrate entire Systems on Wafers (SoWs). We will describe the technology we use and the results to-date. This has implications in redefining the memory hierarchy in conventional systems and in neuromorphic systems.  We extend these concepts to flexible and biocompatible electronics.

Subramanian S. Iyer (Subu) is Distinguished Chancellor's Professor and holds the Charles P. Reames Endowed Chair in the Electrical Engineering Department at the University of California at Los Angeles and Director of the Center for Heterogeneous Integration and Performance Scaling (CHIPS )
Subramanian S. Iyer (Subu) is Distinguished Chancellor's Professor and holds the Charles P. Reames Endowed Chair in the Electrical Engineering Department at the University of California at Los Angeles and Director of the Center for Heterogeneous Integration and Performance Scaling (CHIPS ) Prior to Joining UCLA in 2015, he was an IBM Fellow and managed the system integration effort at IBM. His interests lie in developing new integration paradigms that will allow for radically new system architectures.

9:45 am - 10:30 am: Keynote Presentation 3

Keynote - Benjamin Leever

Electronics Outside the Box: Building a Manufacturing Ecosystem for Flexible Hybrid Electronics
As the electronics in our daily lives proliferate, they continue to be largely limited to rigid form factors with bulky packaging dictated by traditional electronics manufacturing processes and fragile components. Yet for applications ranging from wireless, low-profile medical devices to smart food labels to aircraft with embedded stress sensors, there's a need for high-performance electronics that conform to the shape of our bodies, vehicles, and consumer goods. Flexible Hybrid Electronics (FHE), which combine additive manufacturing processes with flexible silicon will enable these capabilities. To move these concepts from the lab to the manufacturing floor in the United States, the Department of Defense established NextFlex, America's Flexible Hybrid Electronics Manufacturing Institute in 2015. Based in San Jose, CA, NextFlex is a $170M public-private partnership that is building a domestic FHE manufacturing ecosystem by developing manufacturing processes and tools with its member companies and universities, standing up an FHE manufacturing pilot line in Silicon Valley, and establishing education and workforce development programs to train tomorrow's workforce. This presentation will focus on the FHE opportunity, the NextFlex FHE manufacturing roadmaps, and NextFlex projects in areas such as device integration & packaging, modeling & design tools, and printed flexible components.

Benjamin Leever, Senior Materials Engineer, Air Force Research Laboratory (AFRL) Soft Matter Materials Branch
Benjamin Leever is currently a Senior Materials Engineer in the Air Force Research Laboratory (AFRL) Soft Matter Materials Branch. His primary roles are Advanced Development Lead and Government Chief Technology Officer of NextFlex, a $170M public-private partnership established to create a domestic manufacturing ecosystem in flexible hybrid electronics. In support of AFRL's investments in Soft Matter Materials, Dr. Leever determines technical strategy, manages AFRL contracts, and establishes industrial, academic, and governmental collaborations. He also leads the directorate's Energy Integrated Product Team and respresents the directorate on numerous domestic and international power & energy and additive manufacturing working groups.

Prior to assuming his current duties, Dr. Leever led a research team focused on the development and modeling of multifunctional materials for structural power applications. Dr. Leever began his career at AFRL in the Manufacturing Technology Division, where he managed programs related to electro-optics systems. He earned a B.S. in Chemical Engineering from the University of Cincinnati and a Ph.D. in Materials Science & Engineering from Northwestern University.

10:30 AM - 11:00 AM: Coffee Break in Foyer

Coffee Break Sponsor:
Break Sponsor: Geib Refining

11:00 am - 11:45 am: Keynote Presentation 4

Tim Olson

Transforming Electronic Interconnect

Tim Olson, DECA
In 2009, Tim Olson founded Deca Technologies with a vision of transforming electronic interconnect. Tim served as President and CEO until transitioning in 2013 into his current role of CTO. Tim has been board member since establishment of the company.

Prior to Deca, Tim was senior vice president of Amkor Technology where he led global research and development introducing key innovations to the market including PoP TMV* (Package on Package Through Mold Via) technology, FusionQuad* and the industry’s first high volume fine pitch Cu pillar flip chip on laminate technology. Tim also led creation of the micro-EMS model at Amkor establishing direct technology & business relationships with leading electronic systems OEMs providing SiP (System in Package) modules and other advanced electronic interconnect solutions. *Note: TMV and FusionQuad are trademarks of Amkor

Previously, Tim established the Systems Integration Division of Fico (now Besi) where the “Strip Testing” breakthrough was commercialized into the semiconductor industry for leadframe and laminate based devices. After several years, Tim led the sale of the Systems Integration division to Micro Component Technology (MCT) where he became Executive Vice President of products and operations. During this time, MCT established itself as the world leader in strip test technology as well as related automation software and systems.

Tim served for several years as the Chairman of the SEMI International Test, Assembly & Packaging committee while working in the semiconductor equipment industry with Fico and MCT. Tim began his semiconductor career at Motorola in manufacturing engineering. Within a few years, Tim led the creation, implementation and operation of PRISM, a highly automated and integrated semiconductor factory serving leading automotive and cellular handset OEMs. While at PRISM, Tim pioneered the concept of individual device traceability through utilization of 2D codes within manufacturing by adopting the technology used by NASA for traceability in spacecraft. The concept of strip testing was also pioneered at PRISM with the industry’s first high volume production implementation. PRISM was awarded CEO model factory in 1995 for the multiple innovations realized.

Tim graduated magna cum laude from the University of North Dakota with bachelor’s degrees in mechanical engineering and engineering management. Tim holds over two dozen patents relating to wafer processing, packaging, equipment, software, process and design.


11:45 am - 12:00 pm:
What's next for IMAPS? Urmi Ray, IMAPS VP of Technology
This Week's Technical Program - Mary Cristina Ruales Ortega, IMAPS 2017 Technical Chair


IMAPS 2017 EXHIBITS OPEN: 12:00 pm - 5:00 pm

12:00 pm - 2:30 pm: Lunch in Exhibit Hall

Exhibit Lunch Sponsor:

Lunch Sponsor: MRSI










Session TP1
Materials and Reliability I

Session Chairs: Tengfei Jiang, UCF; Venky Sundaram, Georgia Tech

In the first of the two sessions addressing this topic, we will address the many ways, new materials used in the assembly process can impact both "outgoing" and in-use reliability of the packages due to Chip-Package Interactions. Variables such as dielectric materials, CTE and modulus and qualification methodology will be discussed.

Session TP2
Packaging to meet the RF Roadmap - 2.4 to 26 to 60 GHz

Session Chairs: Mumtaz Bora, Peregrine Semi; Ambrose Wolf, Honeywell

The new generation of high speed wireless technologies coming to market require packaging technologies that can meet the material, process and assembly needs of the high frequency applications. Packaging roadmaps need to be flexible and scalable to meet the demands of distance, speed, low interference risk, security and cost targets of the emerging markets and technologies.

Session TP3
3D Technologies: Materials, Processes, and Applications

Session Chairs: Mark Gerber, ASE; Chet Palesko, SavanSys

This session will dive into the materials, processes and applications that enable various 3D technologies. Specific technologies including laser TSV, Passive Integration in RDL, Micro bumping, 3D printing, high thermal conductivity and other advanced processes will be reviewed. In support of this key focus area, this session will also review how the 2.5D/3D Ecosystem Is evolving and may influence the product solutions moving forward.

Session TP4
Wafer Level Packaging & Panel Level Packaging

Session Chairs: Habib Hichri, SUSS;
Michael Gallagher, DOW

This session will address the multi-functional purpose system packaging method and process. The leading edge technologies, such as ultrafine routing and through glass Via fabrication, and flexible hybrid electronics technologies are introduced for WLP and PLP. Also modeling method and applications for EMI shielding will be presented.

Session TP5
Novel Materials/Processes I

Session Chairs: Charles Woychik, i3 Electronics; Richard Stephenson, Silicon Valley Materials Technology Corp, Inc.

This session focuses on novel materials and processes for use in thermal and electrical device manufacture and sensing.

2:30 pm - 2:55 pm

Effect of Substrate Finish on Microstructure Evolution of Sintered Ag Joints to Attach Power Devices with Paste of Ag Nanoparticles during Isothermal Ageing
Yun Wang, China Aero-Polytechnology Establishment (Jianfeng Li, Pearl Agyakwa, Christopher Mark Johnson, Shuguang Li)

Packaging and Miniaturization of a 2-18 GHz UWB Radar for Measurements of Snow and Ice: Initial Results
F. Rodriguez-Morales, University of Kansas (C. Leuschen, J. Davisson, S. Garrison, & A. Wolf)

Development of Stacking Process for 3D TSV Structure using Laser
Kwang-Seong Choi, ETRI (Wagno Alves Braganca Junior, Keon-Soo Jang, Seok Hwan Moon, Hyun-Cheol Bae, Yong-Sung Eom)

3D IPD on Thru Glass Via Substrate Using Panel Manufacturing Technology
Takamasa Takano, Dai Nippon Printing (Hobie Yun, Qualcomm Technologies, Inc.)

Enhanced In-Plane Heat Transport in Embedded Mini Heat Pipes PCB
Jonathan Silvano de Sousa, AT&S Austria Technologie & Systemtechnik Aktiengesellschaft (P. L. Fulmek, M. Unger, P. Haumer, J. Nicolics)

3:00 pm - 3:25 pm

Power Cycle Reliability of SiC Devices with Metal-sinter die-attach and Thermostable Molding
Katsuaki Suganuma, Osaka University (Shijo Nagao, Hiroshi Fujita, Akio Shimoyama, Shinya Seki, Hao Zhang)

Ultra-Compact Four-Channel 5-18 GHz Switched Filter Bank Utilizing PolyStrata® Microfabrication and 3D Packaging
Chris Hermanson, Nuvotronics Inc. (Rob Reid, Will Stacy)

Inductors using 2.5D Silicon Interposer with Thick RDL and TSV-last Technologies
Gabriel Pares, CEA-Leti (J.P. Michel, E. Deschazeaux, V.Pernin, A. Giry, P. Ferris)

The IC in the Flexible Hybrid Electronics Technology: Flexibility and Bend Testing
Val Marinov, Uniqarta, Inc.

Alternative Deposition Solution for Cost Reduction of TSV Integration
Julien Vitiello, KOBUS (Fabien Piallat)

3:30 pm - 3:55 pm

Temperature and Process Dependent Material Characterization and Multiscale Stress Analysis for Performance and Reliability Management under Chip Package Interaction
Xiaopeng Xu, Synopsys, Inc. (Aditya Karmarkar, Karim El Sayed)

RF Test Article to Assess the Impact of Non-Hexavalent Chromium-Based Conversion Coatings on Electrical Assemblies
Joshua Petko, Northrop Grumman (Philip Lovell, Jeremy Clifton, Paul Cohen, Karl Schoch, Jr.)

3D Printed Waveguides for the Design of Microwave and Millimeter Passive Circuits
Premjeet Chahal, Michigan State University  (Mohd Ifwat, Mohd Ghazali,
Vincens Gjokaj, Amanpreet Kaur)

Shielding Effectiveness Simulation of SMT EMI Gaskets
Christopher Kerwien, W.L. Gore & Associates, Inc. (Charlotte Blair)

Highly Reliable Cu Wiring Layer of 1/1 µm Line/Space Using Newly Designed Insulation Barrier Film
Kazuyuki Mitsukura, Hitachi Chemical

Coffee Break in Exhibit Hall: 3:55 pm - 4:55pm

5:00 pm - 5:25 pm

Development of Liquid Compression Molding Material (LCM) for Low Warpage 
Tsuyoshi Kamimura, Namics Corp. (Satomi Kawamoto, Daisuke Hashimoto, Yuto Shigeno, Haruyuki Yoshii, Namics Corp.; Hirokazu Noma, Tomohiro Ookubo, Hisato Takahashi, Hidetoshi Inoue, Hitachi Chemical Co.) 

Fabrication of X-band Oscillator on LCP Substrate Using Aerosol Printing
Christopher Oakley, Michigan State University (John Albrecht, John Papapolymerou, Premjeet Chahal)

Building an EcoSystem for User-friendly Design of Advanced System in Package (SiP) Solutions
Herb Reiter, eda 2 asic Consulting, Inc

Fine Line Routing and Micro Via Patterning in ABF Enabled by Excimer Laser Ablation
Habib Hichri, SUSS MicroTec Photonic Systems Inc. (Lee Seongkuk; Markus Arendt; Shohei Fujishima; Shigeo Nakamura)

Experimental Assessment of Microwave Loss Caused by Non-Hexavalent Chromium-Based Conversion Coatings
Joshua Petko, Northrop Grumman (Philip Lovell, Jeremy Clifton, Paul Cohen, Karl Schoch, Jr.)

5:30 pm - 5:55 pm

Fine Resolution Photosensitive Polyimide Dry Film with High Resistance to Electromigration Under HAST Condition
Masao Tomikawa, Toray Industries Inc. (Kazuyuki Matsumura, Yoshiko Tatsuta, Yu Shoji, Ryoji Okuda)

Thin Film Capacitor Applications in RF/Microwave Circuits
William Kuhn, Kansas State University  (J. Ambrose Wolf)

In line Advanced Process Control Solution for the Fabrication of Micro-bumps
Dario Alliata, UnitySC (Stephane Godny, Cleonisse Serrecchia, Tristan Combier, Astrid Sippel, Philippe Gastaldo)

Ultra-fine Line Multi-Redistribution Layers with 10µm Pitch Micro-Vias for Wafer Level and Panel Level Packaging realized by an innovative Excimer Laser Dual Damascene Process 
Robert Gernhardt, Fraunhofer IZM (Friedrich Müller; Markus Woehrmann; Habib Hichri; Karin Hauck; Michael Toepper; Markus Arendt; Klaus-Dieter Lang)

Performance Evaluation of Ultra-Thin Dielectrics for Flexible Power Module Applications
Xin Zhao, North Carolina State University (Douglas Hopkins)

6:00 pm - 6:25 pm

Abstract soon

Integration and Miniaturization of a Ka-Band Stepped Frequency Radar for UAV Applications
Jay McDaniel, University of Oklahoma (Mark Yeary, Hjalti Sigmarsson, University of Oklahoma;
Sean Garrison, Kyle Byers, Ambrose Wolf, Honeywell FM&T)

Printed Wiring for High-Power Electric Devices by Using Ag-sinter Paste
Seungjun Noh, Osaka University (Chuantong Chen, Toshiyuki Ishina, Shijo Nagao, Katsuaki Suganuma)

Separation of Carrier from Large Thin Panel with Air Jetting 
Hao Tang, Micro Materials Inc.(My Nguyen)

A Frequency Swept Low-Cost Capacitive Fringing Field PCB Sensor
Robert Dean, Auburn University





7:00 AM - 6:00 PM: Registration Open
11:00 AM - 5:30 PM: Exhibit Hall Open









Session WA1
System Integration

Session Chairs: John Hunt, ASE; Steffen Kroehnert, Nanium

Presentations in this session will discuss evaluations done for system integration related Chip-Package Interaction topics. Packaging technologies addressed are Flip-Chip BGA, Multi-Chip modules, Fan-Out WLP, and System-in-Package, including such for automotive market, and advanced chip technology nodes.

Session WA2
Miniaturization of Bio-devices

Session Chairs: Kedar Shah, Verily Life Sciences (Google); Caroline Bjune, Draper Labs; Tim LeClair, Cerapax

Smaller form factors are critical for Injectables, Insertables, and Implantables.

Session WA3
Emerging Packaging Technologies

Session Chairs: Anne Zeng, Northrop Grumman; Doug Link, Starkey Hearing

In this age of mobile device proliferation, the Internet of Things, and electric vehicles, the drive to further microelectronic miniaturization has spawned emerging tehnological advances in height reduction, extended temperature range, and package flexibility. This session is focused on the emerging and innovative technologies in the advanced packaging world. The topics include the challenges and solutions for Wide-Bandgap (WBG) power packaging, plasma -based dicing technology in the BEOL process flows, new bonding process technique - polymer elastic bump (PEB) bonding for flexible SiF (System in Foil) package, as well as Precision Ultra-Thinning in emerging technology applications.

Session WA4
Heterogeneous & Complex System Packaging

Session Chairs: Woong-Sun Lee, SK Hynix; Robert Dean, Auburn University

This session is focused on the multi-functional purpose system packaging method and process. The leading edge technologies, such as WLP, eWLB etc, are introduced for heterogeneous and complex system packaging. Also modeling method and applications of SiP are presented.

Session WA5
Polymers in Microelectronics

Session Chairs: Andy Mackie, Indium; Frank Eberle, Northrop Grumman; Lyndon Larson, DOW

Incorporation of polymers in microelectronics continues to grow and evolve. This session focuses on the development of polymers for the use as encapsulates, dielectrics, conductors, and resistors for use in microelectronic devices.

8:00 am - 8:25 am

Advanced Packaging for Automotive
Pascal Oberndorff,
NXP Semiconductors (Peter Drummen, Leo van Gemert, Peter Offeringa)

Silicon Microfluidics: An Enabling Technology for Life Sciences Application 
Bivragh Majeed, IMEC (Lei Zhang, Giuseppe Fiorentino, Deniz Sabuncuoglu, IMEC; Edward Walsby, ORBOTECH) 

Plasma Dicing Process-Flows for Advanced Packaging Fabrications
Frank Wei, DISCO Corporation (Tomotaka Tabuchi, Hideyuki Sando)

Investigation of Wafer Level Packaging Schemes for 3D RF Interposer Multi-chip Module
Bart Vereecke, IMEC (Philippe Soussan, IMEC; Jian Zhu, NEDI)

Encapsulation of Microelectronic Assemblies for use in Harsh Environments
Hannah Varner, Charles Stark Draper Laboratory (Juliette Mahaffey, Thomas Marinis, Christopher DiBiasio)

8:30 am - 8:55 am

A Generic Strategy to Assess and Mitigate Chip Package Interaction Risk Factors
for Semiconductor Devices with Ultra-low k Dielectric Materials in Back End of Line
Frank Kuechenmeister, GLOBALFOUNDRIES Inc. (Dirk Breuer, Holm Geisler, Christian Klewer, Bjoern Boehme, Kashi Vishwanath Machani, Michael Hecker, Christian Goetze, Jae Kyu Cho, Himani Kamineni, Jens Paul, Michael Thiele)

Self-powered, Impact-monitoring System using a Flexible Hybrid Electronic Mouthpiece
Jeremy Ward, Air Force Research Lab (Kenji Aono, Casey Pirnstill, Shantanu Chakrabartty, Michael Durstock)

Investigation of Package Effects on the Edge Termination E-Field for HV WBG Power Semiconductors
Haotao Ke, North Carolina State University (Yifan Jiang, Adam Morgan, Douglas Hopkins)

Innovative Integration Solutions for SiP Packages Using Fan-Out Wafer Level eWLB Technology
Vinayak Pandey, STATS ChipPAC (Jacinta Lim)

Polymer Thick Film Conductor, Resistor and Dielectric Pastes for High Temperature Process or Operation
Seigi Suh, Heraeus (Steven Grabey)

9:00 am - 9:25 am

Co-Simulation Based Multi-Chip Module Design Flow and Wi-Fi Module Example with Integrated BAW and LNA
Jeffrey Dekosky, Qorvo (Deepukumar Nair, Larry Carastro, Scott Knapp)

Reliability Analysis of a Wearable Sensor Patch (WSP) to Monitor ECG Signals 
Varun Soman, Binghamton University (Mark Poliks, James Turner, Mark Schadt, Michael Shay, Frank Egitto)

Technology Transfer for MEMS and Advanced Packaging: Precision Surface Preparation Innovatively Applied to Emerging Technologies
Bob Roberts, Axus Technology

Lighting System Packaging for Smart Underwater Reefs for Sensing, Communications, and Robotics 
David Fries, IHMC (Tim Hutcheson, Connor Tate, Noam Josef, Kirsten Ayres, Sean Hickey)

Ablative Laser Patterning of Polymeric Dielectric Materials
Cristina Matos, Brewer Science, Inc. (Deborah Blumenshine, Lisa Kirchner, Rama Puligadda; Brewer Science, Inc.; Habib Hichri, Seongkuk Lee, Markus Arendt, Suss MicroTec Group)

Coffee Break in Foyer: 9:30 am - 10:00 am

Coffee Break Sponsor:
Break Sponsor: Pac Tech


10:00 am - 10:25 am

Direct Measurement of Silicon Strain in a Fine Pitch Flip Chip BGA Package
Nathan Whitchurch, Amkor Technology (Glenn Rinne, Wei Lin)

Practical Application and Analysis of Lead-Free Solder on Chip-On-Flip-Chip SiP for Hearing Aids
Youngtak Lee, Starkey Laboratories (Doug Link)

Stress Migration Bonding for SiC Power Devices
Katsuaki Suganuma, Osaka University (Hao Zhang, Norio Asatani, Koji Kimoto, Aishi Suetake, Toru Sugahara, Shijo Nagao, Toshiyuki Ishina)

Using SPICE to Model Nonlinearities Resulting from Heterogeneous Integration of Complex Systems 
Aubrey Nathan Beal, Oakridge Institute for Science and Education (Robert Dean)

Adhesion Characteristics of Epoxy Molding Compound and Copper Leadframe Interface: Impact of Environmental Reliability Stresses
Nishant Lakhera, NXP Semiconductors (Sandeep Shantaram)

10:30 am - 10:55 am

Non-Destructive Testing for System-in-Package Integrity Analysis
Karl-Friedrich Becker, Fraunhofer IZM (Mathias Minkus, Volker Bader, Steve Voges, Gerd Jungmann, Hubert Wieser, Tanja Braun, Martin Schneider-Ramelow, Klaus-Dieter Lang)

Microfabrication and Packaging Process for a Single-Chip Position, Navigation, and Timing System 
Vamsy Chodavarapu, University of Dayton (JunJun Huan, George Xereas, Charles Allan)

Comparative Evaluation and Analysis of Gate Driver Impact on Switching Speed of SiC MOSFET in a SiC MOSFET-Gate Driver Co-packaged Power Module
Liqi Zhang, FREEDM Systems Center, North Carolina State University  (Alex Huang, Pengkun Liu, Suxuan Guo)

Atmospheric Probe for Real Time Weather Monitoring 
J. Craig Prather, Auburn University (Michael Bolt, Haley Harrell, Tyler Horton, John Manobianco, Mark Adams )

Development and Characterization of Silicone Gel for High Temperature Encapsulation in WBG Power Modules
Adam Morgan, North Carolina State University (Xin Zhao, Haotao Ke, Jason Rouse, Douglas Hopkins)

11:00 am - 11:25 am

Abstract soon

An Implantable, Designed-for-Human-Use Peripheral Nerve Stimulation and Recording System for Advanced Prosthetics
Caroline Bjune, Draper (John Lachapelle, Carlos Segura, John Burns IV, Jake Hellman, Alejandro Miranda, Elliot Greenwald, Andrew Czarnecki, Matthew Muresan, Brian Nugent, Daniel Guyon, Wes Uy, Tirunelveli Sriram, Jesse Wheeler, Alexander Kindle, Philip Parks, Draper; Edward Keefer, Nerves, Inc.; Jonathan Cheng, University of Texas-Southwestern; Steve Tillery, Arizona State University)

PEB (Polymer Elastic Bump) Face-Down Assembly Process for Ultra-Thin Flexible Package
Jae Hak Lee, Korea Institute of Machinery and Materials (Chung Woo Lee, Yong Jin Kim, Seung Man Kim, Jun-Yeob Song)

Environmentally Isolating Packaging for MEMS Inertial Sensors 
Michael Kranz, EngeniusMicro (Michael Whitley, Carl Rudd, Robert Dean, George Flowers) 

Reliability of Coated and Alloyed Copper/Silver Ball Bonds
Murali Sarangapani, Heraeus Materials Singapore Pte Ltd (Bayaras Abito Danila, Zhang Xi)

11:30 am - 1:00 pm: Lunch in Exhibit Hall










Session WP1
Advanced CMOS Nodes

Session Chairs: Urmi Ray, STATS ChipPAC; Rich Rice, ASE

This session will address the complex interplay, both electrical and mechanical, especially related to transistor performances and BEOL integration issues arising out of Chip-Package Interactions.

Session WP2
Power, Batteries and Energy Harvesting

Session Chairs: David Johnson, Vadatech, Inc.; Ben Leever, USAF

Development and demonstration of electronics devices and systems for energy harvesting, management, and storage.

Session WP3
LTCC and Ceramic Technologies

Session Chairs: Howard Imhof, Silicon Valley Mats.; Martin Schneider-Ramelow, Fraunhofer IZM

Demonstrated performance driven packaging opportunities in 5G, aerospace, medical, high power, embedded passive elements, and integrated liquid cooling with state of the art LTCC technology.

Session WP4
Wire Bonding

Session Chairs: Lee Levine, Process Solutions Consulting; Dan Evans, Palomar

Wire Bonding remains a major chip and package interconnection method. New materials, process and machine innovations contribute to the continued successful implementation of this process.

Session WP5
Novel Materials/Processes II

Session Chairs: Aric Shorey, Corning;
Carol Putman, Daikin America

During this session of novel materials and processes, we will be focusing on new developments to overcome adhesion challenges between hybrid micro layers in electronic components to ensure reliability on thermal and electrical performance and expected life time. Innovative alternatives for processing on controlled metallization as well as to enhance adhesion on glass substrates will be presented as solutions to the manufacture of multilayer electrical components and their requirements to enhance reliability.

1:00 pm - 1:25 pm

Electrical Chip-Board Interaction (e-CBI) of Wafer Level Packaging Technology
Wei Zhao, Qualcomm Technologies (Mark Nakamoto, Karthikeyan Dhandapani, Brian Henderson, Ron Lindley, Riko Radojcic, Urmi Ray, Aurel Gunterus, Mark Schwarz, Ahmer Syed, Vidhya Ramachandran)

Optimizing the Segmented Thermoelectric Generator using Taguchi Method
Ravi Anant Kishore, Center for Energy Harvesting Materials and Systems (CEHMS), Virginia Tech (Shashank Priya)

The Relevance of Low Temperature Co-fired Ceramic Module Packaging in the 5G Market  
Ton Schless, SIBCO LLC (Frank Chen)

Wire Bonding Looping Solutions for High Density System-in-Package (SiP)
Basil Milton, Kulicke & Soffa (Odal Kwon, Cuong Huynh, Ivy Qin, Bob Chylak)

Using a Metal Oxide Adhesion Layer and Wet Chemical Cu Metallization for Fine Line Pattern Formation on Glass
Robin Taylor, Atotech Deutschland GmbH (Michael Merschky, Fabian Michalik, Martin Thoms, Diego Reinoso-Cocina, Stephan Hotz, Patrick Brooks)

1:30 pm - 1:55 pm

14nm Chip Package Interaction technology development
Lei Fu, Advanced Micro Devices (YS Low, Milind Bhagavat, Ivor Barber)

Thermal-Mechanical Performance Evaluation of Flexible Substrate Based 1.2 kV SiC Power Module
Xin Zhao, North Carolina State University (Douglas Hopkins)

LTCC Based Highly Integrated SiPM Module With Integrated Liquid Cooling Channels for High Resolution Molecular Imaging
Rainer Dohle, Micro Systems Engineering GmbH, an MST company (Ilaria Sacco, Thomas Rittweg, Thomas Friedrich, Gerold Henning, Jörg Gossler, Peter Fischer)

High Temperature Storage Reliability of Bond Resistance of Palladium-Coated Copper Ball Bonds
Michael David Hook, University of Waterloo (Michael Mayer, Stevan Hunter)

Direct Copper Metallization on TGV (Thru-Glass-Via) for High Performance Glass Substrate
Kotoku Inoue, KoTo Electric Co.,Ltd.

2:00 pm - 2:25 pm

2.5D FPGA-HBM Integration Challenges
Jaspreet Gandhi, Xilinx (Boon Ang, Tom Lee, Henley Liu, Myongseob Kim, Ho Hyung Lee, Gamal Refai-Ahmed, Hong Shi, Suresh Ramalingam, Xilinx)

Photovoltaic Effect in Bi0.9La0.1FeO3 Thin Films
C. L. Fu, Chongqing University of Science and Technology (R. L. Gao, W. Cai, G. Chen, X. L. Deng)

Direct Sapphire to Ceramic Bonding for CMOS Image Sensor Packaging Using Room Temperature Bonding Technology
Liam Murphy, ESTEC, European Space Agency (Heidi Lundén, Primoceler Inc; Antti Määttänen)

Multidimensional Ultrasonic Copper Bonding - New Challenges for Tool Design
Paul Eichwald, University of Paderborn (Simon Althoff, Reinhard Schemmel, Walter Sextro,Andreas Unger, Michael Broekelmann, Matthias Hunstig)

A Novel Microvia Process for Below 10 Um Diameter
Abdelghani Renbi, Luleå University of Technology (Jerker Delsing)

2:30 pm - 2:55 pm

Next Generation Xeon Server Package Architecture
Raja Swaminathan, Intel (Ram Viswanath, Sriram Srinivasan, Arun Chandrasekhar, Michael Carroll, Krishna Bharath, Wei-Lun Jen, Zhichao Zhang, Rajen Sidhu)

Design of 240°C Low Voltage Power Supply
Saurabh Kulkarni, Baker Hughes Inc

Thick Film Materials for High Power Hybrid Circuits on Aluminum Nitride and Silicon Nitride
Matt Sgriccia, Heraeus Precious Metals (Ryan Persons, Frank Sandoval)

Aluminium Wedge-Wedge Bonding Using Capillary and Ball Bonder
Murali Sarangapani, Heraeus Materials Singapore Pte Ltd (Ei Phyu Phyu Theint, Hamdan Faizul Fitri, Tan Kean Tiong, Zhang Xi)

Glass Solutions for Packaging and IoT
Aric Shorey, Corning Incorporated (Rachel Lu)

3:00 pm - 3:25 pm

High Density Tall Cu Pillars for 3D Packaging
Keith Best, Rudolph Technologies (Tom Swarbrick, Kevin Martin)

Direct Aerosol Printing of Lithium-ion Batteries
Heng Pan, Missouri University of Science and Technology

Precision Embedded Passive Circuit Elements on Low Temperature Co-Fired Ceramic (LTCC) Substrate for Aerospace Electronics 
Devin Smarra, University of Dayton (Guru Subramanyam, Vamsy  Chodavarapu, Sivaram Gogineni, Kenneth Semega, Alireza Behbahani)

Wedge Bonding Ribbon - Short Bond Span and Low Loop Study for RF Package Interconnect
Wenjuan Qi, Palomar Technologies (Daniel Evans)

Optimization of Chemistry for a Vapour Phase Process for Defluxing No Clean Lead Free Materials 
Rodrigo Aguilar, Inventec Performance Chemicals (Emmanuelle Guene, Aurelie Ducoulombier, Anne Marie Laugt)

3:30 pm - 5:30 pm: Happy Hour in Exhibits

5:30 pm - 7:30 pm: International Panel Session & Wine Reception





7:00 AM - 3:00 PM: Registration Open
NO EXHIBITS - Exhibitor Move-Out










Session THA1
Process Integration

Session Chairs: Horst Clauberg, Kulicke & Soffa; Rajiv Roy, FormFactor

This session will focus on the process and equipment advances that enable advanced applications and the material sets associated with high performance device packaging and impact Chip-Package Interaction.

Session THA2
Extreme Environment Device Reliability

Session Chairs: Otto Fanini, Baker Hughes; Bill Marsh, Northrop Grumman

This session is focused on microelectronic device durability and reliability under extreme environmental conditions including high temperature, pressure, vibration, and shock, and exposed to various forms of chemical attack and contamination. Devices and interconnects include sensors, substrates, integrated circuits, wire bonds and other microelectronic assembly and packaging media.

Session THA3
Fanout Wafer Level Packaging

Session Chairs: Rajiv Dunne, Qualcomm; Shamima Afroz, Northrop Grumman

Fan-out Wafer-Level Package (FOWLP) development continues at a rapid pace and is enabling thin/low-cost products and heterogenous SIP integration. This session covers the development of unit processes, metrology and innovative FOWLP packaging process flows/solutions for applications in mobile, IoT and Bio-MEMS areas to name a few.

Session THA4
Antennas & Advanced RF System-Integration

Session Chairs: Ivan Ndip, Fraunhofer IZM; Christian Hoffmann, Qualcomm; Manos Tenzeris, Georgia Tech PRC

The focus of this session is on modeling, design and measurement of antennas and RF components for RF system integration.

Session THA5

Session Chairs: Tim Jensen, Indium Corp.; Greg Caswell, DfR Solutions

As electronics technology advances, devices are generating more power in smaller form factors that are going into broader ranges of applications. This session focuses on several facets of electronics reliability.

8:00 am - 8:25 am

Automotive IC Probing Challenges - FFI MEMS Technology Meets and Exceeds Expectation
Ashish Bhardwaj, FormFactor Inc. (Amy Leong)

Design for Reliability Analysis of Vibration Induced Failures due to Equipment Assembly Bending Load and Vibration Responses
Josh Liew, Baker Hughes Inc. (Otto Fanini)

Characterization of Fan-out Wafer Level Packaging
Ming Li, ASM Technology Hong Kong Ltd (Tian Dewen, Li Qingqian, John Lau, Eric Kuah, Nelson Fan)

Antenna Systems for Simultaneous Transmit and Receive (STAR) Applications
Dejan Filipovic, University of Colorado Boulder (Mohamed Elmansouri, Ehab Etellisi)

Strength Assessment for Direct-sintered Al2O3-to-Cu Joints based on Damage Modeling
Adrian Lis, Osaka University (Koji Asama, Tomoki Matsuda, Tomokazu Sano, Akio Hirose)

8:30 am - 8:55 am

Journey to Success for New Analog Technologies for Texas Instruments
Basab Chatterjee, Texas Instruments (Mario Magaña, Rey Javier)

Operation of Silicon Carbide Integrated Circuits under High Temperature and Pressure 
A. Matt Francis, Ozark Integrated Circuits, Inc. (Matthew Barlow, Jim Holmes)

Effective Inspection Methods for Advanced Packaging Technologies
Julia Brueckner, Quantum Analytics (Michael Schwander, Sentronics Metrology GmbH)

Compact Beam Steering Antennas for Wearable Wireless Applications
Mohammod Ali, University of South Carolina (Nowrin Chamok, Md. Nazmul Alam, Paul Czeresko)

Tin Whisker Growth from Sn-In-Ag Solder
Lyudmyla Panashchenko, NASA Goddard Space Flight Center (Scott Merritt)

9:00 am - 9:25 am

Die Placement Error Management for Fan Out Applications Using Projection Lithography
Habib Hichri, SUSS MicroTec Photonic Systems Inc

High Temperature Reliability of Wire Bonds on Thick Film
Zhenzhen Shen, Baker Hughes (Aleksey Reiderman)

Technology Development towards a Foldable Fan-out Wafer Level Package
Tanja Braun, Fraunhofer IZM (K.-F. Becker, R. Kahle, L. Georgi, S. Raatz, S. Voges, M. Minkus, J. Bauer, M. Schneider-Ramelow, K.-D. Lang)

E-Band 4-Bit Phase Shifter using SP4T Flip Chip Switches
Jia-Chi Samuel Chieh, Space and Naval Warfare Systems Center Pacific (Jason Rowland, Anh-Vu Nguyen, Satish Sharma)

Design of Experiments Approach to Evaluating the Reliability of System-in-Package Assemblies
Timothy Dittman, Northrop Grumman Mission Systems (Alex Bailey, David Ebner)

Coffee Break in Foyer: 9:25 am - 9:45 am

9:45 am - 10:10 am

Reduction of Thermal Stress - Part I: Passivation Thickness Optimization of Standard Bump Design
Raj Sekar Sethu, X-FAB Semiconductor Foundries AG (Salil Hari Kulkarni, How Ung Ha, Kok Heng Soon)

Durability and Reliability of Electro-Mechanical Relays for Oil and Gas
Saeed Rafie, Baker Hughes, Inc.

Implementation of Wafer Level Packaging KOZ using SU-8 as Dielectric for the Merging of WL Fan Out to Microfluidic and Bio-Medical Applications
Andre Cardoso, NANIUM, SA (Raquel Pinto, Elisabete Fernandes, Steffen Kroehnert)

Planar Antenna for Terahertz Application in Fan Out Wafer Level Package
Daijiro Ishibashi, FUJITSU Laboratories Ltd.  (Yoshihiro Nakata)

High Reliability and High Throughput Ball Bumping Process Solution - Solder Joint Encapsulant Adhesives
Wusheng Yin, YINCAE Advanced Materials, LLC. (Mary Liu)

10:15 am - 10:40 am

Reduction of Thermal Stress - Part II: Passivation Thickness Optimization of FLATPV Bump Design
Raj Sekar Sethu, X-FAB Semiconductor Foundries AG (Salil Hari Kulkarni, How Ung Ha, Kok Heng Soon)


Fan-Out Wafer-Level Packaging of Large Chip with Multiple Redistribution-Layers
John Lau, ASM Pacific Technology (Ming Li, Nelson Fan, Eric Kuah, Zhang Li, Kim Hwee Tan, Tian DeWen, Margie Li, Mian Tao, Jeffery Lo, Rozalia Beica, YuHua Chen, CT Ho, Sze Pei Lim, NC Lee, Jiang Ran)

Fully Printed Static Gain Reconfigurable Conformal Patch Antenna Arrays
Nolan Grant, University of Massachusetts Lowell (Mahdi Haghzadeh, Alkim Akyurtlu)

Surviving the Heat Wave: A presentation of Thermally Induced Failures and Reliability Risks Created by Advancements in Electronic Technologies
Greg Caswell, DfR Solutions

10:45 am - 11:10 am

Electrochemical Analysis of Aged Copper Plating Bath in Wafer Level Packaging
Michael Pavlov, ECI Technology (Danni Lin, Eugene Shalyt, Isaak Tsimberg)


Advanced eWLB FOWLP: Enabling Integrated MEMS and Sensors Packaging Solutions
Seung Wook Yoon, STATS ChipPAC Pte Ltd

Multi-factor product authentication using integrated Quick Response (QR) Code Antenna
John Doroshewitz, Michigan State University  (Jeffrey Nanzer, Premjeet Chahal, Amanpreet Kaur)

Modeling Vibration Induced Fatigue Failure of Free Standing Wirebonds
Zhenzhen Shen, Baker Hughes (James Story, Otto Fanini, Michael Osterman)


11:15 am - 12:55 pm: 
(in Foyer)
Session Chairs: Bill Marsh, Northrop Grumman; Richard Stephenson, Silicon Valley Materials Technology Corp, Inc.

Impact of RDL Polymer on Thermal Cycle Reliability of FOPLP (Fan-out Panel Level Package)
Jinyoung Kim, Samsung Electro-Mechanics (Jaekul Lee, Seok Hwan Kim, Job Ha, Hyung Mi Jung, Jihye Shim)

PEB (Polymer Elastic Bump) Face-Down Assembly Process for Ultra-Thin Flexible Package
Jae Hak Lee, Korea Institute of Machinery and Materials (Chung Woo Lee, Yong Jin Kim, Seung Man Kim, Jun-Yeob Song)

Stencil Print solutions for Advance Packaging Applications
Phani Vallabhajosyula, Photo Stencil 

Rapid Prototyping Tape Stencils for the Application of Solder Paste
Mimi Yang, Stanford University (Karen Dowling, Debbie Senesky, H.-S. Philip Wong)

Measurement of In-Package Pressure using Bondwires
Behraad Bahreyni, Simon Fraser University  (Yuxi Zhang, Albert Leung, Behraad Bahreyni)

High Current Testing and Simulation for Land Grid Array Sockets
Brian Beaman, IBM (Jean Audet)

Thermal & viscoelastic properties of underfills using hexagonal boron nitride (hBN) nanofiller
Sara Abbasirazgaleh, North Carolina A&T State University (Shyam Aravamudhan)

Polyimide and Photoresist Residue Detection in Advanced Packaging
Jonathan Cohen, Rudolph Technologies (Gurvinder Singh, WooYoung Han, Mike Marshall)

Challenges of Large Format Packaging and Some of Its Assembly Solutions 
Eric Kuah, ASM Pacific Technology (Nelson Fan, Li Ming, John Lau, Eric Ng, Tian DeWen, Wu Kai)

3D Printed Integrated Microfluidic Cooling for High Power RF Applications 
Michael Craton, Michigan State Univerisity (Mohd Ifwat Mohd Ghazali, Brian Wright, Kyoung Youl Park, Premjeet Chahal, John Papapolymerou)

Flip chip reliability and design rules for SIP module
Morard Adrien, SAFRAN SA (Pares Gabriel, Riou Jean-Christophe)

Relation between relative humidity and electrical performance of electrochromic displays 
Alexandre Garcia, SINTEF (Huiting Jin, Kjell Olafsen, Sigbjorn Kolberg, Daniel Nilsen Wright, Maaike M. Visser Taklo; SINTEF; Annelie Eveborn, Olle Hagel, Torbjorn Eriksson, Thin Film Electronics)

Solderability and Reliability Evolution of No-Clean Solder Fluxes For Selective Soldering
Rodrigo Aguilar, Inventec Performance Chemicals (Emmanuelle Guene, Aurelie ducoulombier, Richard Anisko, Anne Marie Laugt)

Dark Current Leakage in Optoelectronic Hermetic Packages 
Marwan Albarghouti, SEMTECH (Clara Dionet, Kevin Ma)

Inkjet and 3D Printing Technology for Fundamental Millimeter-Wave Wireless Packaging
Bijan Tehrani, Georgia Institute of Technology (Ryan Bahr, Manos Tentzeris)










Session THP1
Materials and Reliability II

Session Chairs: Ennis Ogawa, Broadcom; Raja Swaminathan, Intel Corp.

The second session of the two sessions addressing this topic further elaborates ways to analyze and address a variety of CPI that have implications for reliability in advanced packages and focuses on the interactions among critical factors that affect reliability such as assembly processes, thermomechanical stress development, materials properties, and package geometries.

Session THP2
Assuring Device Security - Network and Microelectronic Solutions

Session Chairs: Erica Folk, Northrop Grumman; Wayne Churaman, ARL

Security Strategies using Devices, Packaging, and Software.

Session THP3
Embedded Packaging

Session Chairs: Karl-Friedrich Becker, Fraunhofer IZM; Susie Johansson, Starkey Hearing

Recent developments in the field of embedding/integrating active component in/on printed circuit boards, covering technological as well as cost aspects.

Session THP4
Panel/Board level System-Integration

Session Chairs: Vanessa Smet, Georgia Tech, PRC; Zhenzhen Shen, Baker Hughes

This session is focused on technology that enables further miniaturization and heterogeneous board/panel integration, including large area processing and SIP integration.

Session THP5
Additive Manufacturing

Session Chairs: Craig Armiento, University of Massachusetts Lowell; Paul Deffenbaugh, SCIPERIO

Additive technologies are now being applied to the fabrication of electronics and will transform manufacturing processes, enable rapid prototyping and create new form factors for electronic products. This session will review ongoing efforts to apply additive technologies to a variety of electronic applications.

1:00 pm - 1:25 pm

Reliable Chip & Bond Wire QA Sampling, Counting & Inspection by Implementing Multiple Magnification AOI
Hector Fonseca, Nordson Yestech, Advanced Technology Systems

Supply Chain Hardware Integrity for Electronics Defense (SHIELD) Using Small "Dielets"
Len Chorosinski, Northrop Grumman (Richard Calatayud, Parrish Ralston, Scott Suko, David Fry, Venky Sundaram, Klaus Wolter, Nathanael Ellerhoff)

Development of Thinner POP base Package by Die Embedded and RDL Structure
Masahiro Kyozuka, SHINKO Electric Industries Co., Ltd. (Takahiko Kiso, Koichi Tanaka, Tetsuya Koyama)

Ultra-fine Cu Wiring Surrounded by Electroless-Plated Ni: Effective Structure for High Insulation Reliable Wiring Applicable to Panel Level Fabrication
Masaya Toba, Hitachi Chemical

Prototyping and Production of High-temperature Power Electronic Substrates through Additive Manufacturing Processes
Thomas Stoll, Friedrich-Alexander-Universität Erlangen-Nürnberg (FAU), Institute for Factory Automation and Productions Systems (FAPS) (Joerg Franke, FAU, FAPS; Aarief Syed-Khaja, Heraeus Deutschland GmbH)

1:30 pm - 1:55 pm

Investigation & Resolution of Current Leakage Failure caused by Carbon Black Aggregation in Mold Compound
Akhilesh Singh, NXP Semiconductors (Teck Beng Lau, Nishant Lakhera, Hoffmann James, Boon Yew Low)

Experimental and Analytical Analysis of Shape Memory (SMA) Actuators Microfabricated Using Novel Techniques
Cory Knick, General Technical Services, LLC (Gabriel Smith, Darin Sharar, Nicholas Piekiel, Christopher Morris)

Cost Comparison of Fan-out Wafer-Level Packaging to Embedded Die Packaging
Chet Palesko, SavanSys Solutions LLC (Amy Lujan)

Challenges of Large Format Packaging and Some of Its Assembly Solutions
Eric Kuah, ASM Pacific Technology (Nelson Fan, Li Ming, John Lau, Eric Ng, Tian DeWen, Wu Kai)

3D Printed Electronic Processes for the Next Generation of Printed Circuit Structures 
Kenneth Church, Sciperio (Sam LeBlanc, Paul Deffenbaugh)

2:00 pm - 2:25 pm

Demonstration of Embedded Cu Trench RDL using Panel Scale Lithography and Photosensitive Dry Film Polymer Dielectrics

Venky Sundaram, Fuhan Liu, Chandra Nair, Rao Tummala (GT), Atsushi Kubo, Tomoyuki Andoh (TOK Japan), Keith Best, Corey Shay (Rudolph Technologies).

Secure Tunable LNA Design for Internet of Things 
Bruce Kim, City University of New York/CCNY (Sang-Bock Cho)

Multichip Module Planarity Requirements Derived From Solder Surface Tension Models
Thomas Marinis, Draper (Joseph Soucy)

Flip Chip Reliability and Design Rules For SIP Module
Morard Adrien, SAFRAN SA (Gabriel Pares, Jean-Christophe Riou)

Additive Packaging for Microwave Applications
Craig Armiento, University of Massachusetts Lowell (Susan Trulli, Christopher Laighton, Elicia Harper, Raytheon Integrated Defense Systems; Mahdi Haghzadeh, Alkim Akyurtlu, University of Massachusetts Lowell)

2:30 pm - 2:55 pm

Reduction of Thermal Stress - Part III: UBM Thickness and Passivation Thickness Optimization
Raj Sekar Sethu, X-FAB Semiconductor Foundries AG (Salil Hari Kulkarni, How Ung Ha, Kok Heng Soon)

Nondestructive Imaging of Packaged Microelectronics using Pulsed Terahertz Technology 
Magda El-Shenawee, University of Arkansas (Tyler Bowman)

Next Generation Chip Embedding Technology for High Efficient Mid Power Modules 
Kay Essig, ASE Group (CT Chiu, Jarris Kuo, Phidia Chen, Jean-Marc Yannou)

Abstract Soon

Direct Write Additive Manufacturing of 'Born Qualified' Ceramic Components 
Adam Cook, Sandia National Labs (Christopher Diantonio, William Reinholtz, Daniel Kammler, Harlan Brown-Shaklee, Fadi Abdeljawad) 


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