Honeywell


IMAPS 2018 Pasadena

IMAPS 2018 - Pasadena
51st Symposium on Microelectronics
www.imaps2018.org

Conference:
October 9-11, 2018
Exhibition:
October 9-10, 2018
Professional Development Courses:
October 8, 2018
General Chair:
Mark Gerber
ASE US Inc.
General Chair-elect (2019):
Curtis Zwenger
Amkor Technology
Past General Chair (2017):
Dan Krueger
Honeywell FM&T

 
    PREMIER PROGRAM SPONSOR:
 
 
Premier Program Sponsor - Heraeus Materials Technology

 

    PREMIER TECHNOLOGY SPONSOR :

    PREMIER TECHNOLOGY SPONSOR :

   PREMIER TECHNOLOGY SPONSOR:
Bag Insert Sponsor: ASE Group
Premier Tech Sponsor - NGK NTK
Keynote Sponsor: SAMTEC

 

REGISTER ONLINE

PDCs
(Short Courses)
For Exhibitors
Visiting the Exhibits
Charity Golf Outing
   

SPONSOR/EXHIBITOR PROSPECTUS | EXHIBIT APPLICATION | FLOORPLAN
Phase III Open Application Period - Now Open...12PM Eastern April 2nd
Phase II Application Period for Returning IMAPS 2017 Exhibitors - Ended April 1st
Phase I Priority Sponsorship Commitments - Ended February 14th



The 51st International Symposium on Microelectronics is being organized by the International Microelectronics Assembly and Packaging Society (IMAPS). The Symposium will feature 5 technical tracks, plus our Interactive Poster Session, that span the three days of sessions on:

TRACK 1:
SiP/SiM (System Solutions)
TRACK 2:
Wafer Level/Panel Level (Advanced RDL)
TRACK 3:
High Performance / High Reliability
TRACK 4:
Flip Chip/2.5D/3D/Optical (Advanced Package)
TRACK 5:
Advanced Process & Materials (Enabling Technologies)

PLANNED SESSIONS:

• System Design & Integration
• CPI & Modeling
• Embedded/High Voltage
• Optical/Automotive
• Wearable / Test

PLANNED SESSIONS:

• Wafer-Level Fan Out
• WLCSP
• Advanced Fan Out
• Panel-Level Fan Out
• MEMS & Sensors

PLANNED SESSIONS:

• High Reliability - Defense/Aero
• MM Wave / High-Speed Packaging
• RF/Wireless Components
• High Reliability in Bio/Medical
• High Reliability in Extreme Environments

PLANNED SESSIONS:

• Large Body / Small Body FC
• 2.5D Technologies
• Optical
• BUMP & Interconnect
• 3D Technologies

PLANNED SESSIONS:

• Substrate Technology
• Polymer Materials & Processes
• Novel Materials & Processes
• Advanced Wirebond
• Advanced Equipment & Additive Manufacturing

TRACK 6:
INTERACTIVE POSTER SESSION - "Posters & Pizza Lunch"

 

 

 


Student Presenters:

The Microelectronics Foundation sponsors Student Paper Competitions and Awards in conjunction with IMAPS 2018. Students submitting their work and identifying that "Yes, I'm a full-time student" on the abstract submission form, will automatically be considered for these awards. The review committee will evaluate all student papers/posters and award the following at the 2018 Symposium:

  • Three (3) "Outstanding Student Paper" Awards - $500 Each Award
  • One (1) "Best Student Paper of Symposium" Award - $2000 Award
  • One (1) "Best Student Poster Presentation" Award - $250 Award

The selected student must attend the event to present his or her work and receive the award.

The Microelectronics Foundation

 

IMAPS 2018 Poster Session:
Interactive Poster Session Student papers will be considered for this interactive session. Students submitting abstracts for the poster session will be required to submit a full paper which will be PEER-REVIEWED and considered for paper and poster awards noted above. If you are interested in presenting in the interactive session at IMAPS Symposium, select the "Poster Session" option under the session field on the abstract submission form.

 


Speaker/Author Information:

 
  • "Call For Abstracts" Open: October 15, 2017
  • ~1,000-Word Abstract Deadline Extended to: FEBRUARY 14, 2018 (ABSTRACTS STILL BEING ACCEPTED - DUE IMMEDIATELY)
  • Confirmation of Abstract Receipt: Auto-Email Upon Submission (check spam/junk folders if you do not receive the email immediately upon submission)
  • Speaker Notification - Abstract Acceptance: April 17, 2018
  • Manuscripts Due for Peer-Review: May 25, 2018
  • Notification of Paper acceptance/revision/rejection: June 27, 2018
  • Final Papers due & Author registration deadline: July 31, 2018
    SPEAKERS MUST BE REGISTERED OR YOU WILL BE REMOVED FROM THE PROGRAM LISTING
  • Early Registration / Hotel Deadline: September 12, 2018
  • 2-3 Sentence BIO due NOT LATER THAN: September 15, 2018

Please send your 1,000-word abstract (references required) electronically only using the online submittal form at: www.imaps.org/abstracts.htm. All Speakers are required to pay a reduced registration fee. If you need assistance with the on-line submittal form, please email Brian Schieman at bschieman@imaps.org

Special Paper Recognition - Cash Awards Offered!

6 "Best of Track" Outstanding Papers - Six (6) $500 Cash Awards
Six "Best of Track" Winners will then be reviewed for...

1 Best Paper of the Symposium - One (1) additional $500 Cash Award for a "Best of Track" Winner


IMAPS Microelectronics Foundation Student Paper Awards
The Foundation is offering CASH AWARDS to the best papers submitted and presented by students at IMAPS Symposium.

Accepted papers may be considered for publication in the IMAPS Journal of Microelectronics and Electronic Packaging.

 

Registration & Hotel Information:
(Early Registration Deadline: September 12, 2018)
| REGISTER ONLINE

Full attendee registrations (not exhibits only) includes the Opening Ceremonies, IMAPS Annual Business Meeting, IMAPS Awards Ceremony, Keynote Presentations, Welcome Reception, Technical Sessions, GBC Plenary Session, Panel Discussion, Exhibit attendance, Breaks, Exhibit Hall Reception on Wednesday, Exhibit Hall Lunch on Tuesday, one 2018 Proceedings Download (and access via our Mobile APP) and an automatic one-year IMAPS membership renewal for individual and student members in good standing at the time of registration. For an additional fee you can register for a Professional Development Course (PDC), the Golf Tournament, and other activities/purchases. All prices below are subject to change.

Full Symposium cancellations will be refunded (less a $100 processing fee) only if written notice is postmarked on or before September 1, 2018. No refunds will be issued after that date.

Type
Early Fee
Through 9/12/2018
Advance/Onsite Fee
After 9/12/2018
IMAPS Member
$800
$900
Non-Member
$900
$1000
Speaker
$625
$725
Chair
$625
$725
Chapter Officer
$625
$725
Student (IMAPS Member)
$50
$75
Student (Non-Member)
$75
$100
Exhibits Only (LUNCH INCLUDED)
$30
$30
Exhibits Only (NO LUNCH INCLUDED)
Complimentary
Complimentary
ADDITIONAL REGISTRATION FEES:
Short Course / Professional Development Course "PDC" (one 2-hour PDC: Monday -- can take up to four total)
$300
$400
Golf (1 Golfer, Monday) - TBD
$125
$125

REGISTER ONLINE

 

Hotel Reservations (Hotel Deadline: September 12, 2018)
The Conference & Exhibition is being held at the Pasadena Convention Center.

Hotel Reservations must be made directly with the Host Hotels:

Hilton Pasadena
168 South Los Robles Avenue
Pasadena, California, 91101, USA

Single/Double Room Rate: $209 + taxes/fees

Online Reservations - SOON
Reservations by PHONE: 626-577-1000 - request group rate for International Microelectronics And Packaging Society

The Hilton Pasadena hotel is about a 7-minute walk to the Convention Center. The Hilton offers a complimentary shuttle service within a two-mile radius. The hotel is 20 minutes from Bob Hope Burbank Airport (BUR) and 45 minutes from Los Angeles International Airport (LAX).

Westin Pasadena
191 North Los Robles Avenue
Pasadena, California, 91101, USA

Single/Double Room Rate: $214 + taxes/fees

Online Reservations - SOON
Reservations by PHONE: 866-837-4181 - request group rate for IMAPS Annual Symposium 201

The Westin offers a complimentary shuttle within a 3 mile radius, including the Pasadena Convention Center.

Book your hotel reservation today! We have reserved a block of rooms at the host hotel to accommodate our attendees. The discounted room rates are only available until the hotel deadline listed above, or until the room block sells out (and they often sell out early - before the expire dates). Reservations received after the noted deadline or after the room block has been filled may be subject to significantly higher rates. IMAPS room blocks at most hotels historically sell out ahead of the discount deadline, so we encourage you to make your hotel reservations quickly for the best price and availability.

Hotel Scams Alert - The only way to book a room in the official IMAPS Housing Block using the reservations information above. IMAPS does not authorize any other hotel service/group to operate on its behalf.

 

Premier Program Sponsor - Heraeus Materials Technology

 

PREMIER Sponsors:

 

    Premier Program Sponsor:
Premier Program Sponsor - Heraeus Materials Technology

    Premier Technology Sponsor:

    Premier Technology Sponsor:
    Premier Technology Sponsor:
Bag Insert Sponsor: ASE Group
Premier Tech Sponsor - NGK NTK
Keynote Sponsor: SAMTEC
Event Sponsors:

Networking Sponsor:

EMD Performance Materials - Corporate Sponsor

Exhibit Lunch Sponsor:

Lunch Sponsor: MRSI

Posters & Pizza Sponsor:

Northrop Grumman EC - Poster Session Sponsor

Coffee Break Sponsor:

Coffee Break Sponsor:

Break Sponsor: Geib Refining

Coffee Break Sponsor:

Break Sponsor: Pac Tech

Bag Insert Sponsor:

Bag Insert Sponsor: NorCom Systems

 
Golf Sponsors
available      
Media Sponsors
3D Incites - Media Sponsor
Media Sponsor: MEPTEC
Media Sponsor: Webcom - Electronics Protection
Media Sponsor: US Tech

 

 


 




CORPORATE PREMIER MEMBERS
  • Amkor
  • ASE
  • Canon
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • NGK NTK
  • Palomar
  • Plexus
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems