Micross


IMAPS 2018 Pasadena

IMAPS 2018 - Pasadena
51st Symposium on Microelectronics
www.imaps2018.org

Conference:
October 9-11, 2018
Exhibition:
October 9-10, 2018
Professional Development Courses:
October 8, 2018
General Chair:
Mark Gerber
ASE US Inc.
General Chair-elect (2019):
Steffen Kroehnert
Amkor Technology (formerly Nanium)
Past General Chair (2017):
Dan Krueger
Honeywell FM&T

Abstracts Due: January 31, 2018

SUBMIT YOUR ABSTRACTS

Click here for IMAPS 2018 Sponsor/Exhibit Prospectus
Phase I Priority Sponsorship Commitments Now Being Accepted through February 14th!

Phase II Application Period for Returning IMAPS 2017 Exhibitors Opens at 12PM Eastern February 15th.
Phase III Open Application Period opens at 12PM Eastern April 1st.


The 51st International Symposium on Microelectronics is being organized by the International Microelectronics Assembly and Packaging Society (IMAPS). The IMAPS 2018 Technical Committee seeks original papers that present progress on technologies throughout the entire microelectronics/packaging supply chain. The Symposium will feature 5 technical tracks, plus our Interactive Poster Session, that span the three days of sessions on:

TRACK 1:
Modules- SiP/SiM (System Solutions)
TRACK 2:
Wafer Level/Panel Level (Advanced RDL)
TRACK 3:
High Performance/Reliability - Defense/Aero/Medical
TRACK 4:
Flip Chip/2.5D/3D - Advanced Package
TRACK 5:
Process, Materials and CPI

PLANNED SESSIONS:

• Embedded/High Voltage and Power
• Optical/Si Photonics
• Automotive/RF/High Frequency
• System Design, Integration, & Test
• Wearable

PLANNED SESSIONS:

• Fan Out
• WLCSP
• 3D Technologies
• High Performance RDL / Test
• MEMS, Sensors, Small Body

PLANNED SESSIONS:

• High Reliability - Defense/Aero 1
• Bio/Medical
•High Reliability - Defense/Aero 1
• High Reliability - RF Defense/Aero
• MM Wave

PLANNED SESSIONS:

• Large Body
• Small Body - CSP & Leadframe
• Advanced Node & CPI
• BUMP & Interconnect
• 3D Technologies

PLANNED SESSIONS:

• Substrate Technoloogy
• Polymer Materials & Processes
• Novel Materials & Processes
• Advanced Wirebond
• Advanced Equipment & Additive Manufacturing

TRACK 6:
INTERACTIVE POSTER SESSION - "Posters & Pizza Lunch"

 

Technical sessions are being planned for these tracks, and abstracts will be considered on the session topic listed below. Abstracts are rated by the technical committee members and are selected into the sessions by the session chairs appointed by the technical committee. Authors should identify their preferred session (topical area) when submitting their abstracts. Abstracts should highlight the major contributions of the work in one or more of these areas. All abstracts submitted must represent original, previously unpublished work.

The speaker/abstract timeline and process has changed this year significantly as we further enhance our peer review process and we move to further improve the quality of our technical program.

 

SUBMIT YOUR ABSTRACTS

 

 

 


Student Presenters:

The Microelectronics Foundation sponsors Student Paper Competitions and Awards in conjunction with IMAPS 2018. Students submitting their work and identifying that "Yes, I'm a full-time student" on the abstract submission form, will automatically be considered for these awards. The review committee will evaluate all student papers/posters and award the following at the 2018 Symposium:

  • Three (3) "Outstanding Student Paper" Awards - $500 Each Award
  • One (1) "Best Student Paper of Symposium" Award - $2000 Award
  • One (1) "Best Student Poster Presentation" Award - $250 Award

The selected student must attend the event to present his or her work and receive the award.

The Microelectronics Foundation

 

IMAPS 2018 Poster Session:
Interactive Poster Session Student papers will be considered for this interactive session. Students submitting abstracts for the poster session will be required to submit a full paper which will be PEER-REVIEWED and considered for paper and poster awards noted above. If you are interested in presenting in the interactive session at IMAPS Symposium, select the "Poster Session" option under the session field on the abstract submission form.

 


Speaker/Author Information:

 
  • "Call For Abstracts" Open: October 15, 2017
  • ~1,000-Word Abstract Due: January 31, 2018
  • Confirmation of Abstract Receipt: Auto-Email Upon Submission (check spam/junk folders if you do not receive the email immediately upon submission)
  • Speaker Notification - Abstract Acceptance: March 15, 2018
  • Manuscripts Due for Peer-Review: April 20, 2018
  • Notification of Paper acceptance/revision/rejection: May 18, 2018
  • Final Papers due & Author registration deadline: July 13, 2018
    SPEAKERS MUST BE REGISTERED OR YOU WILL BE REMOVED FROM THE PROGRAM LISTING
  • Early Registration / Hotel Deadline: September 2018
  • 2-3 Sentence BIO due NOT LATER THAN: September 15, 2018

Please send your 1,000-word abstract (references required) electronically only using the online submittal form at: www.imaps.org/abstracts.htm. All Speakers are required to pay a reduced registration fee. If you need assistance with the on-line submittal form, please email Brian Schieman at bschieman@imaps.org

Special Paper Recognition - Cash Awards Offered!

6 "Best of Track" Outstanding Papers - Six (6) $500 Cash Awards
Six "Best of Track" Winners will then be reviewed for...

1 Best Paper of the Symposium - One (1) additional $500 Cash Award for a "Best of Track" Winner


IMAPS Microelectronics Foundation Student Paper Awards
The Foundation is offering CASH AWARDS to the best papers submitted and presented by students at IMAPS Symposium.

Accepted papers may be considered for publication in the IMAPS Journal of Microelectronics and Electronic Packaging.

 

Registration & Hotel Information:
(Early Registration Deadline: September 2018)
| REGISTER ONLINE SOON

Full attendee registrations (not exhibits only) includes the Opening Ceremonies, IMAPS Annual Business Meeting, IMAPS Awards Ceremony, Keynote Presentations, Welcome Reception, Technical Sessions, GBC Plenary Session, Panel Discussion, Exhibit attendance, Breaks, Exhibit Hall Reception on Wednesday, Exhibit Hall Lunch on Tuesday, one 2018 Proceedings Download (and access via our Mobile APP) and an automatic one-year IMAPS membership renewal for individual and student members in good standing at the time of registration. For an additional fee you can register for a Professional Development Course (PDC), the Golf Tournament, and other activities/purchases. All prices below are subject to change.

Full Symposium cancellations will be refunded (less a $100 processing fee) only if written notice is postmarked on or before September 1, 2018. No refunds will be issued after that date.

PRICING BELOW IS NOT FINAL - ALL PRICING BELOW WILL CHANGE IN SPRING 2018

Type
Early Fee
Through 9/2018
Advance/Onsite Fee
After 9/2018
IMAPS Member
$675
$775
Non-Member
$800
$900
Speaker
$550
$650
Chair
$550
$650
Chapter Officer
$550
$650
Student (IMAPS Member)
$35
$45
Student (Non-Member)
$45
$55
Exhibits Only TUESDAY
$35
$35
Exhibits Only WEDNESDAY
Complimentary
Complimentary
ADDITIONAL REGISTRATION FEES:
1 PDC (Full-Day: Monday)
$600
$700
1 PDC (Half-Day: Monday)
$400
$500
Golf (1 Golfer, Monday)
$125
$125

Register Online - SOON

 

Hotel Reservations (Hotel Deadline: September 2018)
The Conference & Exhibition is being held at the Pasadena Convention Center.

Hotel Reservations must be made directly with the:

AVAILABLE SOON

 

Book your hotel reservation today! We have reserved a block of rooms at the host hotel to accommodate our attendees. The discounted room rates are only available until the hotel deadline listed above, or until the room block sells out (and they often sell out early - before the expire dates). Reservations received after the noted deadline or after the room block has been filled may be subject to significantly higher rates. IMAPS room blocks at most hotels historically sell out ahead of the discount deadline, so we encourage you to make your hotel reservations quickly for the best price and availability.

Hotel Scams Alert - The only way to book a room in the official IMAPS Housing Block using the reservations information above. IMAPS does not authorize any other hotel service/group to operate on its behalf.

 

 


 




CORPORATE PREMIER MEMBERS
  • Amkor
  • ASE
  • Canon
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • NGK NTK
  • Palomar
  • Plexus
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems