IMAPS 2018 Pasadena

IMAPS 2018 - Pasadena
51st Symposium on Microelectronics

October 9-11, 2018
October 9-10, 2018
Professional Development Courses:
October 8, 2018
General Chair:
Mark Gerber
General Chair-elect (2019):
Curtis Zwenger
Amkor Technology
Past General Chair (2017):
Dan Krueger
Honeywell FM&T

Premier Program Sponsor - Heraeus Materials Technology




Bag Insert Sponsor: ASE Group
Premier Tech Sponsor - NGK NTK
Keynote Sponsor: SAMTEC



For Exhibitors


The 51st International Symposium on Microelectronics is organized by the International Microelectronics Assembly and Packaging Society (IMAPS). This year IMAPS has rolled out a new technical program that has been organized to help attendees find their key interests faster. This was done by defining 5 leading Tracks with topics centered around the major package platforms such as Wafer Level, Flip Chip, 2D/3D, SiP, as well as the traditional focus areas of reliability, advanced materials and processes. As a result, we have seen a high level of turnout in abstract submissions. This new technical structure was the result of previous attendee feedback, where they were interested in a technical program that makes it much easier to attend multiple papers in a single session vs having to search to find the key topics of interest. The Symposium will again feature our Interactive Poster Session.

SiP/SiM (System Solutions)
Wafer Level/Panel Level (Advanced RDL)
High Performance / High Reliability
Flip Chip/2.5D/3D/Optical (Advanced Package)
Advanced Process & Materials (Enabling Technologies)


• System Design & Integration
• CPI & Modeling
• Embedded/High Voltage
• Optical/Automotive
• Wearable / Test


• Wafer-Level Fan Out
• Advanced Fan Out
• Panel-Level Fan Out
• MEMS & Sensors


• High Reliability - Defense/Aero
• MM Wave / High-Speed Packaging
• RF/Wireless Components
• High Reliability in Bio/Medical
• High Reliability in Extreme Environments


• Large Body / Small Body FC
• 2.5D Technologies
• Optical
• BUMP & Interconnect
• 3D Technologies


• Substrate Technology
• Polymer Materials & Processes
• Novel Materials & Processes
• Advanced Wirebond
• Advanced Equipment & Additive Manufacturing





Student Presenters:

The Microelectronics Foundation sponsors Student Paper Competitions and Awards in conjunction with IMAPS 2018. Students submitting their work and identifying that "Yes, I'm a full-time student" on the abstract submission form, will automatically be considered for these awards. The review committee will evaluate all student papers/posters and award the following at the 2018 Symposium:

  • Three (3) "Outstanding Student Paper" Awards - $500 Each Award
  • One (1) "Best Student Paper of Symposium" Award - $2000 Award
  • One (1) "Best Student Poster Presentation" Award - $250 Award

The selected student must attend the event to present his or her work and receive the award.

The Microelectronics Foundation


IMAPS 2018 Poster Session:
Interactive Poster Session Student papers will be considered for this interactive session. Students submitting abstracts for the poster session will be required to submit a full paper which will be PEER-REVIEWED and considered for paper and poster awards noted above. If you are interested in presenting in the interactive session at IMAPS Symposium, select the "Poster Session" option under the session field on the abstract submission form.


Speaker/Author Information:

  • "Call For Abstracts" Open: October 15, 2017
  • ~1,000-Word Abstract Deadline Extended to: FEBRUARY 14, 2018
  • Confirmation of Abstract Receipt: Auto-Email Upon Submission (check spam/junk folders if you do not receive the email immediately upon submission)
  • Speaker Notification - Abstract Acceptance: April 17, 2018
  • Manuscripts Due for Peer-Review: May 25, 2018
  • Notification of Paper acceptance/revision/rejection (Peer Review Comments back to author): August 27, 2018
  • Author registration deadline: September 12, 2018
  • Early Registration / Hotel Deadline: September 12, 2018
  • Final Papers due to IMAPS: September 27, 2018
  • 2-3 Sentence BIO due NOT LATER THAN: September 27, 2018

Paper Format/Template
IMAPS emailed all the speakers the required paper template upon acceptance and with instructions for paper submission and peer review.

Presentation Format/Template:
IMAPS does not require you to use a conference powerpoint template.
You are able to use your regular company/preferred powerpoint templates.
Please include the IMAPS show name and dates on your template and/or an IMAPS logo.

Dress Code:
There is no official "dress code" for IMAPS Conferences. We ask you to be BUSINESS CASUAL or whatever more you prefer. We do not recommend casual attire.

Session rooms will be equipped with:
Screen, projector, podium, IMAPS laptop (with Microsoft Windows and recent OFFICE suite), microphone, and slide remote/laser pointer.

All session presentations are 20 minutes followed by 5 minutes for Questions
You are required to load your powerpoint/presentation onto the session laptop yourself using your USB drive.
Speak with your session chair if you need assistance.

About the Session:
Sessions begin with Session Chairs making general announcements. Session Chairs will then introduce speakers by reading BIOs. Speaker will present for 20 minutes, followed by 5 minutes for questions. Session Chairs will thank the speakers. This process is repeated for each speaker in the session. Many sessions will take refreshment breaks (see program).

Poster Session/Information
The poster session is planned to be an INTERACTIVE presentation. This means you do not start and complete a scheduled talk without interuption like in a regular/oral session. Speakers should have talking points and be at their poster throughout the entire session. You can "present" your scheduled materials, but more often the attendees will review your slides and ask questions. Or you can watch them and talk to them depending on which slide they are on. .

Authors may either print out each of their powerpoint slides on regular paper and tack them up in order, or prepare a large poster (or 2 even). Recommended poster size is typically 3x4 feet, with the max space on the board being 4 ft high x 8 ft wide. IMAPS staff will provide tacks to secure your print outs. The session is first-come-first-serve so there are not assigned poster boards/locations. POSTER SETUP FROM 10:30 AM UNTIL 11:40AM.

Photography is not permitted in the session rooms.

Silence all mobile phones during session attendance.

Special Paper Recognition - Cash Awards Offered!

6 "Best of Track" Outstanding Papers - Six (6) $500 Cash Awards
Six "Best of Track" Winners will then be reviewed for...

1 Best Paper of the Symposium - One (1) additional $500 Cash Award for a "Best of Track" Winner

IMAPS Microelectronics Foundation Student Paper Awards
The Foundation is offering CASH AWARDS to the best papers submitted and presented by students at IMAPS Symposium.

Accepted papers may be considered for publication in the IMAPS Journal of Microelectronics and Electronic Packaging.


Registration & Hotel Information:
(Early Registration Deadline: September 12, 2018)

Full attendee registrations (not exhibits only) includes the Opening Ceremonies, IMAPS Annual Business Meeting, IMAPS Awards Ceremony, Keynote Presentations, Welcome Reception, Technical Sessions, GBC Plenary Session, Panel Discussion, Exhibit attendance, Breaks, Exhibit Hall Reception on Wednesday, Exhibit Hall Lunch on Tuesday, one 2018 Proceedings Download (and access via our Mobile APP) and an automatic one-year IMAPS membership renewal for individual and student members in good standing at the time of registration. For an additional fee you can register for a Professional Development Course (PDC), the Golf Tournament, and other activities/purchases. All prices below are subject to change.

Full Symposium cancellations will be refunded (less a $100 processing fee) only if written notice is postmarked on or before September 1, 2018. No refunds will be issued after that date.

Early Fee
Through 9/12/2018
Advance/Onsite Fee
After 9/12/2018
IMAPS Member
Chapter Officer
Student (IMAPS Member)
Student (Non-Member)
Exhibits Only (LUNCH INCLUDED)
Short Course / Professional Development Course "PDC" (one 2-hour PDC: Monday -- can take up to four total)
Golf (1 Golfer, Monday) - TBD


Hotel Reservations
Westin booking deadline extended through Monday, September 17th!

The Conference & Exhibition is being held at the Pasadena Convention Center.

Hotel Reservations must be made directly with the host hotels:

Westin Pasadena
191 North Los Robles Avenue
Pasadena, California, 91101, USA

Hilton Pasadena
168 South Los Robles Avenue
Pasadena, California, 91101, USA

The Hilton and Westin Pasadena hotels offer shuttle service to the convention center and around Pasadena within a 2-3 mile radius of the hotel. Both hotels are 20 minutes from the Bob Hope Burbank Airport (BUR) and 45 minutes from Los Angeles International Airport (LAX).



Book your hotel reservation today! We have reserved a block of rooms at the host hotel to accommodate our attendees. The discounted room rates are only available until the hotel deadline listed above, or until the room block sells out (and they often sell out early - before the expire dates). Reservations received after the noted deadline or after the room block has been filled may be subject to significantly higher rates. IMAPS room blocks at most hotels historically sell out ahead of the discount deadline, so we encourage you to make your hotel reservations quickly for the best price and availability.

Hotel Scams Alert - The only way to book a room in the official IMAPS Housing Block using the reservations information above. IMAPS does not authorize any other hotel service/group to operate on its behalf.


Premier Program Sponsor - Heraeus Materials Technology


PREMIER Sponsors:


    Premier Program Sponsor:
Premier Program Sponsor - Heraeus Materials Technology

    Premier Technology Sponsor:

    Premier Technology Sponsor:
    Premier Technology Sponsor:
Bag Insert Sponsor: ASE Group
Premier Tech Sponsor - NGK NTK
Keynote Sponsor: SAMTEC
Event Sponsors:

Supporting Technology Sponsor:

JCET Group - Supporting Technology Sponsor

Networking Sponsor:

EMD Performance Materials - Corporate Sponsor

Exhibit Lunch Sponsor:

Lunch Sponsor: MRSI

Posters & Pizza Sponsor:

Northrop Grumman EC - Poster Session Sponsor

Keynote/Plenary Sponsor:

Student Programs Sponsor:

Honeywell - Student Programs Sponsor

Coffee Break Sponsor:

Break Sponsor: Geib Refining

Coffee Break Sponsor:

Break Sponsor: Pac Tech

Coffee Break Sponsor:

Coffee Break Sponsor: ORS Oneida Research Services & Silicon Cert Labs

Bag Insert Sponsor:

Bag Insert Sponsor: NorCom Systems

Supporting Sponsor:

American Elements, global manufacturer of high purity metals, semiconductors, nanomaterials, sputtering targets & evaporation materials for optoelectronics, sensors, thin films, MEMS devices & Microelectronics Materials

Golf Sponsors
Media Sponsors
3D Incites - Media Sponsor
Media Sponsor: MEPTEC
Media Sponsor: Webcom - Electronics Protection
Media Sponsor: US Tech




  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Rochester Electronics
  • Specialty Coating Systems
  • Spectrum Semiconductor Materials
  • Technic