KemLab


IMAPS 2020 SAN DIEGO

Conference:
October 6-8, 2020
Exhibition:
October 6-7, 2020
Professional Development Courses:
October 5, 2020
General Chair:
Habib Hichri
SUSS Microtec
Past General Chair (2019):
Curtis Zwenger
Amkor Technology

ABSTRACT DEADLINE: JANUARY 31, 2020

SUBMIT YOUR ABSTRACTS


The 53rd International Symposium on Microelectronics is being organized by the International Microelectronics Assembly and Packaging Society (IMAPS). The IMAPS 2020 Technical Committee seeks original papers that present progress on technologies throughout the entire microelectronics/packaging supply chain. The Symposium will feature 5 technical tracks, plus our Interactive Poster Session, that span the three days of sessions on:

TRACK 1:
SiP/SiM/CPI
(System Solutions)
TRACK 2:
Wafer Level/Panel Level (Advanced RDL)
TRACK 3:
High Performance / High Reliability
TRACK 4:
Advanced Package (Flip Chip, Heterogeneous Integration, 2.5D, 3D, Optical...)
TRACK 5:
Advanced Process & Materials (Enabling Technologies)

PLANNED TOPICS:

• System Design & Integration
• CPI & Modeling
• Embedded/High Voltage
• Optical/Automotive
• Wearable / IoT
• System Partitioning / EMI Shielding
• Computing & Networking
• Package Assembly Design Kit (PADK) & Process Design Kit (PDK)


PLANNED TOPICS:

• Wafer-Level Fan Out
• WLCSP
• Advanced Fan Out & Heterogeneous Integration
• Panel-Level Fan Out
• MEMS & Sensors
• Edge Protection
• Carrier Technologies
• Reliability & Test

PLANNED TOPICS:

• High Reliability - Defense/Aero
• MM Wave / High-Speed Packaging
• RF/Wireless Components
• High Reliability in Bio/Medical
• High Reliability in Extreme Environments

PLANNED TOPICS:

• Large Body / Small Body FC
• 2.5D Technologies
• Optical / Photonics
• BUMP & Interconnect
• 3D Technologies
• 5G Applications
• Heterogeneous Integration

PLANNED TOPICS:

• Advanced Equipment for Additive Manufacturing
• Flexible Electronics
• Substrate Technology

• Polymer Materials & Processes
• Novel Materials & Processes
• Advanced Wirebond

TRACK 6:
INTERACTIVE POSTER SESSION

 

Technical sessions are being planned for these tracks, and abstracts will be considered on the session topic listed below. Abstracts are rated by the technical committee members and are selected into the sessions by the session chairs appointed by the technical committee. Authors should identify their preferred session (topical area) when submitting their abstracts. Abstracts should highlight the major contributions of the work in one or more of these areas. All abstracts submitted must represent original, previously unpublished work.

IF YOUR ABSTRACT IS SELECTED FOR THIS SYMPOSIUM, YOU WILL BE EXPECTED TO FOLLOW THE FOLLOWING SPEAKER TIMELINE (subject to changes): - Speaker Acceptance/Rejection (April 1, 2020); - First Paper to Peer Review (May 15, 2020); - Peer Review feedback to authors (July 1, 2020); - Final/corrected Papers (August 1, 2020); - Speaker must register before (September 1, 2020); - BIO due (September 21, 2020); Speaker Breakfast (morning of your session); and - Slides/Presentation ready (on/before October 5, 2020).

Please send your ~1,000-word abstract (suggested length & references highly recommended) electronically only using the online submittal form at: www.imaps.org/abstracts.htm. All Speakers are required to pay a reduced registration fee. If you need assistance with the on-line submittal form, please email Brian Schieman at bschieman@imaps.org

Accepted papers may be considered for further peer review and publication in the IMAPS Journal of Microelectronics and Electronic Packaging.

 

SUBMIT YOUR ABSTRACTS

Special Paper Recognition - Cash Awards Offered!

6 "Best of Track" Outstanding Papers - Six (6) $500 Cash Awards
Six "Best of Track" Winners will then be reviewed for...

1 Best Paper of the Symposium - One (1) additional $500 Cash Award for a "Best of Track" Winner


IMAPS Microelectronics Foundation Student Paper Awards
The Foundation is offering CASH AWARDS to the best papers submitted and presented by students at IMAPS Symposium.

 

 

 


Student Presenters:

The Microelectronics Foundation sponsors Student Paper Competitions and Awards in conjunction with IMAPS 2020. Students submitting their work and identifying that "Yes, I'm a full-time student" on the abstract submission form, will automatically be considered for these awards. The review committee will evaluate all student papers/posters and award the following at the 2020 Symposium:

  • Three (3) "Outstanding Student Paper" Awards
  • One (1) "Best Student Paper of Symposium" Award
  • One (1) "Best Student Poster Presentation" Award

The selected student must attend the event to present his or her work and receive the award.

The Microelectronics Foundation

 

IMAPS 2020 Poster Session:
Interactive Poster Session Student papers may also be considered for this interactive session. Students submitting abstracts for the poster session will be required to submit a full paper which will be PEER-REVIEWED and considered for paper and poster awards noted above. If you are interested in presenting in the interactive session at IMAPS Symposium, select the "Poster Session" option under the session field on the abstract submission form.

 


Speaker/Author Information:

 
  • "Call For Abstracts" Open: September 25, 2019
  • ~1,000-Word Abstracts Due: JANUARY 31, 2020
  • Confirmation of Abstract Receipt: Auto-Email Upon Submission (check spam/junk folders if you do not receive the email immediately upon submission)
  • Speaker Notification - Abstract Acceptance: April 1, 2020
  • Manuscripts Due for Peer-Review: May 15, 2020
  • Peer review feedback to authors: July 1, 2020
  • Final/corrected Papers due: August 1, 2020
  • SPEAKERS MUST BE REGISTERED ON/BEFORE September 1, 2020, OR YOU WILL BE REMOVED FROM THE PROGRAM LISTING
  • Early Registration / Hotel Deadline: September 2020 TBD
  • 2-3 Sentence BIO due NOT LATER THAN: September 21, 2020
  • Speaker/Chair Breakfast Meeting: Morning of your Session/Presentation (TBD)
  • Slides/Presentation/Posters Ready for Presentation: on/before October 5, 2020

Poster Session/Information
The poster session is planned to be an INTERACTIVE presentation. This means you do not start and complete a scheduled talk without interruption like in a regular/oral session. Speakers should have talking points and be at their poster throughout the entire session. You can "present" your scheduled materials, but more often the attendees will review your slides and ask questions. Or you can watch them and talk to them depending on which slide they are on.

Authors may either print out each of their powerpoint slides on regular paper and tack them up in order, or prepare a large poster (or 2 even). Recommended poster size is typically 3x4 feet, with the max space on the board being 4 ft high x 8 ft wide. IMAPS staff will provide tacks to secure your print outs. The session is first-come-first-serve so there are not assigned poster boards/locations.

The Posters & Pizzas Interactive Session will be held Thursday, October 8 in the Convention Center Foyer from 11:45 AM - 12:45 PM. POSTER SETUP FROM 10:30 AM UNTIL 11:40AM. **DAY & TIMES SUBJECT TO CHANGE**

 

 

 

 


 




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