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IMAPS - iKnow Microelectronics |
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2007 Journal of Microelectronics and Electronic Packaging (JMEP) - Volume 4, Number 4, Fourth Quarter
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| (JMEP) - Journal Micro. and Elect. Pack. |
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| Download - Full Journal Issue |
| 2007 |
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| Features 1 Editorial and 8 papers - 4 papers in a Special Section on Packaging for Extreme Cold Environments, 3 invited papers from CICMT 2007, and 1 regular contribution. The papers included in this issue are: Flight Qualification and Circuit Development of Sensor Front-End Electronics for PACS/Hershel at Liquid Helium Temperature; Development and Manufacture of a Linear 16-Pixel FIR Array—
The PACS Module; Testing of the Mars Exploration Rovers to Survive the Extreme Thermal Environments; Reliability Assessment of Advanced Flip-Chip Interconnect Electronic Package Assemblies under Extreme Cold Temperatures
(–190 and –120°C); LTCC-based Fluidic Components for Chemical Applications; Kinetic Modeling of LTCC Shrinkage: Effect of Alumina Content; Design and Implementation of Baluns at 60 GHz on LTCC; and Global-to-Local Modeling and Experiment Investigation of HFCBGA Package Board-Level Solder Joint Reliability. |
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