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IMAPS - iKnow Microelectronics |
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Detail Page
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2006 Journal of Microelectronics and Electronic Packaging (JMEP) - Volume 3, Number 3, Third Quarter
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| (JMEP) - Journal Micro. and Elect. Pack. |
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| Download - Full Journal Issue |
| 2006 |
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| Features 7 papers on: Analysis of A Larger Die, Copper Pillar Bump Flip Chip Package with No-Flow Underfill; LTCC Microsystems and Microsystem Packaging
and Integration Applications; Fabrication of Conductors and Inductors by Nano-Particle Deposition through Direct Write Technology; An LTCC Based Filter and Front End Module using Heterogeneous Dielectrics; Development of LTCC Smart Channels for Integrated Chemical, Temperature, and Flow Sensing; Three-dimensional fluidic microsystem fabricated in Low Temperature Cofired Ceramic Technology; and Low Temperature Cofired Ceramic Microfluidic Microsystems for High Temperature and High Pressure Applications. |
Member Price: $0.00
Non-Member Price: $30.00 |
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