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Modeling Thermal Behavior of System-in-Package with Dynamic Compact Model
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| (JMEP) - Journal Micro. and Elect. Pack. |
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| Download - Paper |
| 2005 |
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| Integrating more functionality into smaller size increases the heat dissipation density and emphasizes the need for thermal simulations and accurate thermal models. With a compact thermal model (CTM) the dynamic and steady state thermal behavior of a package with several heat dissipating dice can be modeled. The optimization of the model’s parameters requires a properly defined cost function. In this paper a two-phase optimization routine was used to find simultaneously good capacitance and resistance values. The accuracy of the model was improved when effective surface areas defined the convections of a CTM. Parameter optimization in time domain, for variable thermal load and nonlinear system, was tested and found accurate, but time consuming. |
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