IMAPS - iKnow Microelectronics
Detail Page
Advanced Search
Sign In

Research on Power Electronic Integrated Module for SMPs
(JMEP) - Journal Micro. and Elect. Pack.
Download - Paper
A novel structure for a power module used in switching mode power supplies (SMPs) is presented in this paper. The power module employs the three-dimensional terrace structure resulting in lowered parasitic parameters and a higher power density. Based on this structure, the characteristics of the power module, such as parasitic parameters and thermal management performance are evaluated through simulation analysis and experimental research. The measured results for a 1kw prototype demonstrate that the power module based on an aluminum substrate has higher power density, smaller volume and better thermal performance when compared to a module using a conventional structure.

Member Price: $0.00
Non-Member Price:
Email Friend

  • Amkor
  • Canon
  • Corning
  • Fastech Synergy Philippines
  • Honeywell
  • Indium
  • Isola Group
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • NEO Tech
  • Palomar
  • Plexus
  • Qualcomm
  • Specialty Coating Systems