International Symposium on Microelectronics
The 53rd International Symposium on Microelectronics, IMAPS 2020, was hosted LIVE in a virtual environment from October 5-8. It remains on-demand for all previous and new registrants until October 30th.
General Chair of IMAPS 2020:
Ajinomoto Fine-Techno USA Corporation
General Chair-elect (2021):
Past General Chair (2019):
2020 Virtual Symposium Overview
The IMAPS 2020 organizing committee launched a Symposium experience that attendees, speakers, and exhibitors safely enjoyed from home. The theme Enabling a Connected World: Always On! was more relevant than ever as we debuted this online experience with truly global reach. Attendees continued to expect the same valuable technical content as our in-person event, including:
- Live keynotes, panel session, and a feature workshop from Fraunhofer IZM
- Live professional development courses
- Five tracks and nearly 80 technical speakers and poster presentations available on-demand
- Face to face connections in the virtual exhibit hall
- And more!
Learn more about the program below!
CVP and GM for Packaging, Assembly, and Test
Advanced Packaging Architectures: Scaling for A Heterogeneous World
Chiplets: How to Utilize Them, Some of the Challenges, and What They Can Do
Director Silicon Engineering
Packaging Enabling Tomorrow’s Realities
Vice President & General Manager
Silicon Detector Configurations for Optimizing Lidar Systems
Jeff Pauza, Mustapha Slamani, and Selaka Bulumulla
mmWave Antenna in Package Needs More than a Package
Chair and Moderator:
Jan Vardaman, TechSearch International
Koushik Banerjee, Intel Corp.
Dan Berger, GLOBALFOUNDRIES
Eelco Bergman, ASE
Mike Kelly, Amkor Technology
Khai Nguyen, NVIDIA
Craig Orr, Samsung
Ashkan Seyedi, HPE
Over 80 technical speaker presentations are available on-demand during the virtual symposium. Presentations are sorted across 5 tracks and 17 sessions, plus a poster session. Click here for the full listing of accepted speakers and presentation titles.
IMAPS 2020 offered supplementary classroom-style education in the form of two-hour short courses taught by industry leaders.
PDCs were taught live and are not available for replay or on-demand. Please join us in April at the International Conference on Device Packaging for the next selection of PDC courses!
|Track A||Track B|
**MOVED FROM MONDAY, OCTOBER 5 at 2PM**
Polymers for Electronic Packaging
Jeffrey Gotro, InnoCentrix LLC
|**PDC B4 MOVED TO FRIDAY, OCTOBER 2 at 9:30AM**|
Fan Out Variations - Structures and Processes for Low and High Density
John Hunt, ASE US, Inc
The Evolution of Flip Chip Package Technology
Mark Gerber, ASE US, Inc.
The exhibit hall remains OPEN through October 30th!
Sponsoring & Exhibiting Organizations
Ajinomoto Fine-Techno USA Corp.
EMD Performance Materials
Heidelberg Instruments Inc.
Hermetic Solutions Group
Kulicke & Soffa Industries Inc.
Microcircuit Laboratories LLC
Micro Systems Technologies, Inc.
NorCom Systems, Inc.
NTK Technologies, Inc.
Specialty Coating Systems
Torrey Hills Technologies
Universal Instruments Corporation
Speaker or Chair
| Student Member*|
*Student membership is now FREE!
Professional Development Course
Add $250 per course
Starting at $1,200
Inclusive of student
How to Register
- Click here to register as a Member, Non-Member, Speaker, Chair, Student, or Exhibits Visitor.
- Select your registration type from the available options.
- Make payment online with a credit card.
- Receive a confirmation via email. If you do not receive an email confirmation, please contact us at (919) 293-5000.
If you wish to pay via credit card over the phone, please call (919) 293-5000 to make your registration over the phone.