Journal of Microelectronics and Electronic Packaging
(ISSN # 1551-4897)

Editor-in-Chief:
Jianbiao "John" Pan, Ph.D., CQE, CRE
Professor, Industrial & Manufacturing Engineering
California Polytechnic State University
jmep@imaps.org

This archival Journal is a publication of the International Microelectronics Assembly and Packaging Society (IMAPS) and is dedicated to publishing peer-reviewed papers in microelectronics, multichip module technologies, electronic packaging, electronic materials, surface mount and other related technologies, interconnections, RF and microwaves, wireless communications, manufacturing, design, test, and reliability.

The Journal of Microelectronics and Electronic Packaging is published quarterly by the International Microelectronics Assembly and Packaging Society (IMAPS). The technical content of the articles is the sole responsibility of the authors and the articles do not necessarily reflect the views of the editors or the publisher. 

IMAPS members receive complimentary access to the online Journal with their membership as detailed below. Members may download individual papers based on the details of their membership level at no additional cost, unless they have exceeded theiir maximum annual downloads. Non-members must subscribe as outlined below. Both members and nonmembers may pay download fees to gain access to individual papers through IMAPSource (IMAPS On-line Microelectronics Portal).

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