IMAPS - JMEP 2nd Quarter 2004 Idex

Journal of Microelectronics
and Electronic Packaging

Volume 1, Number 2
Second Quarter 2004
download pdf of full Journal

As a result of the name change of the IMAPS Journal, we have had to reapply for a new ISSN. This process should be completed soon with the new ISSN available before release of the 3rd Quarter Issue.

Editorial
Mr. Delip "Doug" Bokil
Update on progress of JMEP.

Regular Contributions

Planarization and Dielectric Properties of Thin Photosensitive and Nonphotosensitive BCB
B. Dusch and P. Kohl

Influence of Solder Joint Shape on the Thermo-mechanical Reliability of CSP's
C. van Veen, B. Vandevelde and E. Beyne

Board Level Reliability Enhancement for a Double-bump Wafer Level Chip Scale Package
X. Zhang, E. Wong and M. Iyer

An Application for Superelastic Material in a Passive Inertial Damage Sensor for Detection of Conditions Leading to the Accumulation of Hidden Structural Damage Caused by Transient Loading in Aircraft - The Conception
J. Hoffman and R. Jeffers

Study of Thermal Effect of Power Circuit on Driver & Protection PCB in Hybrid IPEM
Y. Xiaoling, X. Wei, Z. Wei and F. Quanke

Creep Characterization of Ceramic BGA
L. Goldmann and M. Farooq

Epoxies for OptoElectronic Packaging; Applications and Material Properties
M. Hodgin