Editorial
Mr.
Delip "Doug" Bokil
Update on progress of JMEP.
Regular
Contributions
Heat
Spreading Enhancement in High Power Amplifier Heat
Sinks – Comparison
of Measurements with Numerical
Predictions
L. Maguire, M. Behnia and G. Morrison
Numerical
Investigations of the Thermal Characteristics of
a Flip-Chip BGA Package with
and without Heat Sink
M. Wang and C. Lin
Evaluation of Forced-air
Cooling Capability Affected by the Exhausted Air Flow
from Subracks
N. Sugiura
Transient Thermal Analysis
of Wave Soldering Process for Optical Encoder Module
F. Wong, C. Chong and K. Seetharamu
Immersion Cooling
of Vertically Mounted Plastic Packages Using Various
Flourinert Liquids
L. Bharatham, G. Quadir, A. Hassan and K. Seetharamu
Analysis
of Capacitive and Inductive Coupling inside Hybrid
Integrated Power Electronic Module
X. Zeng, X. Yang and Z. Wang
Invited Manuscripts (Best
Paper - IMAPS Symposia)
Measurements of Thermal
Conductivity of Thin Films by Means of Comparative
Method
S. Achmatowicz, Wojciech Lobodzinski, Iwona Wyzkiewicz,
Elzbieta Zwierkowska
A Tenfold Reduction in Interface
Thermal Resistance for Heat Sink Mounting
D. Van Heerden, T. Rude, J. Newson, J.
He, E. Besnoin, O. Knio and T. Weihs
Contact
Resistance of Anisotropic Conductive Adhesives
R. Divigalpitiya and P. Hogerton
