Editorial
Mr.
Delip "Doug" Bokil
Happy Holidays! This issue covers transfer molding, laser
processing, RF IC processing, high temperature components, power microelectronics, BGA
and CSP packages, and thermal analysis.
Regular
Contributions
Simulation
of Balanced Mold Filling in Transfer Molding for Newtonian
Fluids
Chu Wee
Liang, Venkatesh M.Kulkarni, P.A.A. Aswataha Narayana
and K.N.Seetharamu
Spiral Inductors with Multi-Strip
Coils Processed on Sapphire and Bulk Silicon Substrates
Päivi H. Karjalainen, Juha Rapelo and Eero O. Ristolainen
Self-packaged
Boron Nitride Capacitor for High Temperature Applications
N. Badi, C. Boney and A. Bensaoula
Research on Power Electronic
Integrated Module for SMPs
Chen Qiaoliang, Zeng Xiangjun, Yang Xu and Wang Zhaoan
Study
of Laser Microdrilling for Applications in Microelectronics
and Packaging
Wei Han and Ryszard J. Pryputniewicz
Mechanical Reinforcement
for Sphere Attach Applications
Maureen Brown, Richard Jung, Jin Liu, John Stipp,
Amir Fattahian and Sandy Shashipadme
Three Dimensional
CFD Conjugate Analysis of Two Inline PLCC Packages
Horizontally Mounted
B. Jayakumar, G. A. Quadir, M. Z. Abdullah and
K. N. Seetharamu
Electrical Resistance of
Laser Sintered Direct-Write Deposited Materials for
Microelectronic
Applications
Valery R. Marinov
Investigation of Delamination
Between Leadframe and Mold Compound on a LED Package
Fu-Mauh Wong and K.N Seetharamu
