Editorial
Mr.
Delip "Doug" Bokil
Welcome to the first issue of year 2005.
In this issue, in addition to the "Regular Contributors" and "Best
Paper - IMAPS Symposia", we have the privilege of adding a separate
section for the "Best Paper - 28th International Conference,
IMAPS Poland". This issue echoes and exemplifies what Bruce Romenesko,
the current IMAPS President, has written in Advancing Microelectronics, "A
word is in order about our increasingly intertwined society".
Invited
Manuscripts (Best Papers - 28th International
Conference, IMAPS Poland):
Smart and Sequential Approach
to Numerical Prototyping in Micro-Electronic Applications
A. Wymyslowski, W. van Driel, G. Zhang, J. van de Peer,
N. Tzannetakis
Advanced Assembly Techniques
For Silicon Sensors
Z. Szczepanski, J. Kalenik
Laser forming of LTCC Ceramics
for Hot-Plate Gas Sensors
J. Kita, F. Rettig, R. Moos, K. Drüe, H. Thust
New
Trim Configurations for Laser Trimmed Thick-Film Resistors
- Experimental Verification
S. Kaminski, E. Mis, M. Szymendera, A. Dziedzic
Invited
Manuscripts (Best Paper - IMAPS Symposia):
Screen-Printed
Fe2O3/ZnO thick films for gas sensing applications
K. Arshak, I. Gaidan, L. Cavanagh
Regular Contributions:
Investigation
of Steady State and Transient Thermal Management
in Portable Telecommunication
Product
- Part 1
C. Soon Yee, K. Seetharamu, G. Quadir,
Z. Zainal
Modified-Amine Cured Epoxy
Formulation For The Encapsulation Of Electronic Circuits
G. Rinaldi, A. Catalani, G. Rubini,
D. Surace
Modeling Thermal Behavior
of System-in-Package with Dynamic Compact Model
K. Kaija, P. Heino, E. Ristolainen
Lead-free Solder Joint
Reliability - State of the Art and Perspectives
J. Pan, J. Wang, D. Shaddock
A New Method of Determining
the Thermal Resistance of Microelectronic Packages
K. Teoh, K. Seetharamu, A. Yusoff
Hassan
