Editorial
Mr.
Delip "Doug" Bokil
Thermal management issues continue to
motivate us to design better heat-sinks. Papers one through
three offer
several possible solutions to
designing heat-sinks for ever shrinking sizes of electronic
products. Paper four deals with
the thermal stresses faced by bimaterial structures -
who hasn't experienced bonded semiconductor
die or packaged die that have
lifted from their substrates? Well, check this one out
for possible leads! Rapid curing
of polymer dielectrics using microwave processing is
covered in paper five. In 1975
we felt lucky if we were able to print consistently thick
film lines and spaces that were 250µm wide.
In paper six, photoimageable thick
film inks are used to print line widths of 30 µm
and spaces of 100 µm - that
is progress.
Regular
Contributions:
Investigation
of Steady State and Transient Thermal Management
in Portable Telecommunication
Product - Part 2
C. Yee, G. Quadir, Z. Zainal, K. Seetharamu
Analysis
and Optimization Of Single Layer Counter Flow Micro-Channel
Heat Sink
K. Jeevan, K. Seetharamu, I. Azid
Two-Phase
Stacked Microchannel Heat Sinks for Microelectronics
Cooling
P. Hegde, K. Seetharamu, P. Aswatha Narayana, Z. Abdullah
Engineering
Model for Interfacial Stresses of a Heated Bimaterial
Structure with Bond Material
Used in Electronic Packages
D. Sujan, M. Murthy, K. Seetharamu, A. Hassan
Low
Temperature Rapid Curing of Polymer Dielectrics on
Metallized Organic
Laminates by Variable Frequency
Microwave Processing
T. Sung, S. Bidstrup Allen, P. Kohl
Invited
Manuscript (Best Paper - IMAPS 2004):
Progress
in the Integration of planar and 3D Coils on LTCC
by using photoimageable Inks
R. Perrone, H. Thust, K. Drüe
