Editorial
Mr.
Delip "Doug" Bokil
The
JMEP has become global in character, in the sense that
the authors contributing papers to the JMEP are
now from many countries around our globe as shown below
in alphabetical order:
Australia,
Austria, Belgium, Canada, Finland, Germany, Hong Kong,
India, Ireland, Italy, Japan, Malaysia, Netherlands,
P.R. China, Poland, Singapore, Spain, Taiwan and USA.
In
keeping with this aspect of globalization our referees
are now from the USA, UK and Singapore. Shortly, we plan
to add referees from Europe, Japan, India and other countries...
Regular
Contributions:
Interfacial
Stresses in a Tri-Material Assembly Subjected to
Differential Temperatures in the Layers in Electronic
Packaging
D. Sujan, M. Murthy, K. Seetharamu, A. Hassan
Board
Level Power Cycling and Thermal Cycling Fatigue Reliability
of Chip-scale Packages
T. Wang, Y. Lai, C. Lee
Design
of Drop Test Apparatus for Electronic Packages
C. Yeh, Y. Lai
Pretreatment
of Blind Via Holes before Ni/Au and Cu Plating Applied
with Atmospheric Pressure Plasma Jet
Y. Sawada, K. Yamazaki , N. Taguchi, T. Shibata
Study
of Interfacial Delamination by Considering the Effect
of Temperature and Moisture
during Solder Reflow for QFN Package
F. Wong, K. Seetharamu
Invited Manuscript
(Best Paper - IMAPS 2004):
Soldering
Properties and Interfacial Microstructure of CSP
Solder
Joints with Lower Melting Lead-free Solder
A. Yamaguchi, Y. Yamashita, A. Furusawa, K. Nishida,
T. Hojo,
Y. Sogo, A. Miwa, A. Hirose, K. Kobayashi
Lead
Free Die Mount Adhesive Using Silver Nanoparticles
Applied To
Power Discrete Package
Y. Ukita, K. Tateyama, M. Segawa, Y. Tojo, H. Gotoh,
K. Oosako
