Editorial
Mr.
Delip "Doug" Bokil
Welcome
to the fourth quarterly issue of year 2005.
It
is difficult for me to imagine that I have had the
fabulous challenge and opportunity of being the EIC
of
JMEP for the past two years - time flies when you are
having fun!
It is our pleasure to introduce to you three new Associate
Editors who have joined our Editorial board. (1) Prof.
K N Seetharamu, M S Ramaiah School of Advance Studies,
Bangalore, India, (2) Dr. Andrzej Dziedzic, Wroclaw
University of Technology, Poland and (3) Mr. Ziliang
Wang, Professor of Electronics Packaging with Nanjing
Electronic Devices Institute, PRC.
In
this issue we have two issues on MEMS applications,
one on thermal
analysis, and one on non-destructive testing,
two on general aspects of plastic packaging and one that
revisits Au-Sn intermetallic - something that I first
encountered when we were developing Au thermo-sonic wire
bonding at RCA during the late 1970s!...
Regular
Contributions:
Micromachined
Vibration Isolation Filters to Enhance
Packaging for Mechanically Harsh Environments
R. Dean, G. Flowers, N. Sanders, R. Horvath, M. Kranz,
M. Whitley
Thermal
Design Optimization of Optoelectronic Package
N. Aizar A. Karim, P.A. Aswatha Narayana, K.N. Seetharamu
Electrical
Approach to Nondestructive Analysis on WB-PBGA
with TDR Technology
M. Chen, C. Tai, Y. Huang
Experimental
Evaluation of Glob-top Materials for use
in Harsh Environments
M. Lindgren, I. Belov, P. Leisner
Reliability
of Anisotropic Conductive Joints for Bumpless Flip-Chip
on Flex Packages Under Thermal Stresses
L. Ali, Y. C. Chan, M. Alam
Effects
of Gold on the Properties of Tin-Antimony Solder in
Flip-Chip-Pin-Grid-Array (FCGPA) Packages
S. Kee, L. Hussain, K. Nair, Y. Khong, D. Chandran
Prem Kumar
Invited
Manuscript (Best Paper - IMAPS 2005):
Development
of Biocompatible MEMS Wireless Capacitive Pressure
Sensor
S. Janardhanan, J. Delalic, J. Catchmark, D. Saini
