Editorial
Mr.
Delip "Doug" Bokil
Welcome
to the second issue of year 2006. This
issue consists of two sections; the first one contains
five papers that were submitted directly and the second
section contains one paper from the IMAPS Poland-2005
symposium. As is our policy all papers were reviewed
by members of our Advisory Board.
Regular
Contributions:
Simulation
of Mold Filling for Non-Newtonian Fluids - Part
2
V.Kulkarni, C. Liang, C.W.Tan, P.A.
Aswatha Narayana, K.N.Seetharamu
New
Analytical Model for the Dielectric Loss of Microstrip
Lines on Multilayer Dielectric
Substrates: Effect of Conductor-Dielectric Interphase
H. Vo, F. Shi
Chip-On-ACB
(Anodized Circuit Board) Package for High Power
Light-Emitting Diode
K. Shin, S. Shin, S. Kweon, K. Kwon, S. Choi, Y. Lee
Impact
of Geometric Parameters of Capillary Design on Quality
of Gold Ball Bonding
J. Su, C. Yu
A
Systematic Approach to Thinning Silicon Wafers to
the sub-40µm
Thickness Range
P. Arunasalam, M. Gordon, L. Schaper
Invited
Manuscript (IMAPS Poland 2005):
Experimental
Characterization of Thermoelectric Properties of
Thick Film Composites
P. Markowski, A. Dziedzic
