Editorial
Mr. Jeffrey Demmin, Chair, IMAPS Publications Committee
Welcome to the third quarterly issue of 2006.
Regular readers will notice a different Editor's name with this issue. Former Editor-in-Chief, Doug Bokil, relinquished the reins to focus on other priorities. I would like to welcome Fred Barlow as the new editor-in-chief of the JMEP. Dr. Barlow is currently an Associate Professor of Electrical Engineering at the University of Idaho and has been an active member of IMAPS since 1991. This change will take effect for the 4th quarter issue of 2006, and I trust that you will be pleased with the quality and content of future issues of the journal.
Regular
Contributions:
Analysis of A Larger Die, Copper Pillar Bump Flip Chip Package
with No-Flow Underfill
X. Zhang, D. Pinjala, E. H. Wong, G. Chew, Z. Ma,
T. Tiong Tan, J. Chew
Invited
Manuscripts (CICMT 2006):
LTCC Microsystems and Microsystem Packaging
and Integration Applications
K.A. Peterson, K.D. Patel, C.K. Ho, B.R. Rohrer,
C.D. Nordquist, B.D. Wroblewski, K.B. Pfeifer
Fabrication of Conductors and Inductors by Nano-Particle Deposition
through Direct Write Technology
J. Colvin, M. Carter, J. Sears
An LTCC Based Filter and Front End Module using
Heterogeneous Dielectrics
J. Kim, D. Kim, H. Cho, J. Park, N. Kang
Development of LTCC Smart Channels for Integrated Chemical,
Temperature, and Flow Sensing
C. Ho, K. Peterson, L. McGrath, T. Turner
Three-dimensional fluidic microsystem fabricated in Low Temperature
Cofired Ceramic Technology
L. Golonka, T. Zawada, H. Roguszczak, K. Malecha,
M. Chudy, D. Stadnik, A. Dybko
Low Temperature Cofired Ceramic Microfluidic Microsystems for High
Temperature and High Pressure Applications
K. Patel, K. Peterson, K. Hukari
