Invited Manuscripts (CICMT 2006):
MEMS Technologies and Devices for Single-Chip RF Front-Ends
C. Nguyen
LTCC Post Load Cell
M. Gongora-Rubio, M. Roberti, Z. da Rocha, L Fraigi
Regular Contributions:
Acceleration Factor to relate Thermal Cycles to Power Cycles for
Ceramic Ball Grid Area Array Packages
A. Perkins, K. Tunga, S. Sitaraman
Methods for Reducing Power Loss in On-Wafer Inductors
P. Karjalainen, P. Heino
Analysis of Embedded Baluns in 3D Packages
M. Mäntysalo, P. Heino
Fabrication and Testing of a Micromirror Device Actuated by PZT Thin Films
Z. Xiao, B. Chen, H. Fan
Electrical Characterization of FCBGA Package Based on Measurement
Approach for High-speed SOC Applications
M. Chen, C. Tai, Y. Huang
