Invited Papers (CICMT 2007):

New Sacrificial Layer-Based Screen-Printing Process for Free-Standing Thick-Films Applied to MEMS
C. Lucat, P. Ginet, F. Ménil

Nanoceramic Processing for High-Power Multi-channel Electron Multiplier in Low Temperature Cofire Ceramic (LTCC)
F. Zheng, W. Jones, W. Wu, R. Seelaboyina

Comparison of High-Resolution Patterning Technologies for LTCC Microwave Circuits
J. Müller, R. Perrone, K. Drüe, R. Stephan, J. Trabert, M. Hein, D. Schwanke, J. Pohlner, G. Reppe, R. Kulke, P. Uhlig, A. Jacob, T. Baras, A. Molke

Regular Contributions:

High-Temperature Spin-On Adhesives for Temporary Wafer Bonding
S. Pillalamarri, R. Puligadda, C. Brubaker, M. Wimplinger, S. Pargfrieder

Failure Analysis of Lead-Free Solder Joints of an 1657CCGA (Ceramic Column Grid Array) Package
J. Lau, T. Castello, D. Shangguan, W. Dauksher, J. Smetana, R. Horsley, D. Love, I. Menis, B. Sullivan

Design and Optimization of Piezoelectric Fans for Cooling of Microelectronic Devices
M. Ramana, I. Almanar, M. Abdullah, Z. Ripin, K. Seetaramu