Special Section on Packaging for Extreme Cold Environments:

Editorial
Rajeshuni Ramesham

Flight Qualification and Circuit Development of Sensor Front-End Electronics for PACS/Hershel at Liquid Helium Temperature
P. Merken, T. Souverijns, J. Putzeys, Y. Creten, C. Van Hoof

Development and Manufacture of a Linear 16-Pixel FIR Array-The PACS Module
H. Richter, M. Harr, P. Dinges, H. Krüger, A. Todisco, B. Zimmermann

Testing of the Mars Exploration Rovers to Survive the Extreme Thermal Environments
K. Man, A. Hoffman

Reliability Assessment of Advanced Flip-Chip Interconnect Electronic Package Assemblies under Extreme Cold Temperatures (-190 and -120°C)
R. Ramesham

Invited Papers (CICMT 2007):

LTCC-based Fluidic Components for Chemical Applications
T. Thelemann, M. Fischer, A. Groß, J. Müller

Kinetic Modeling of LTCC Shrinkage: Effect of Alumina Content
M. Eberstein, R. Müller, S. Reinsch, T. Rabe, W.A. Schiller, A. Thiel, J. Deubener

Design and Implementation of Baluns at 60 GHz on LTCC
S. Rentsch, J. Müller

Regular Contributions:

Global-to-Local Modeling and Experiment Investigation of HFCBGA Package Board-Level Solder Joint Reliability
C.I. Chena, S.C. Wub, D.S. Liub, C.Y. Nic, T. D. Yuanc