Journal of
Microelectronics
and Electronic Packaging
(ISSN # 1551-4897)
Foreword . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Fred D. Barlow III, Editor-in-Chief |
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INVITED PAPERS: |
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Broadband Dielectric Characterization of Aluminum Oxide (Al2O3) . . . . . . . . . . . . K.Z. Rajab, Pennsylvania State University;
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . M. Naftaly, E.H. Linfield, University of Leeds;
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . J.C. Nino, D. Arenas, D. Tanner, University of Florida;
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .R. Mittra and M. Lanagan, Pennsylvania State University
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Photoimageable Thick-Film Components for a Ceramic Analytical Microsystem. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . B. Dziurdzia, Z. Magonski, AGH University of Science and Technology;
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .S. Nowak, Institute of Electron Technology |
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REGULAR CONTRIBUTIONS: |
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Development of Reliability Allocation and Assessment Algorithms for Designing Multilevel Microelectronic Systems
. . . . . . . . . . . . . . . . . . . . . . . . . .I. Kim, R.V. Pucha, Russell S. Peak and S.K. Sitaraman, Georgia Institute of Technology |
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A Real-Time Precision Characterization Technique for Low-Loss Optical Polymeric Waveguide and Lightwave Circuits
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . F. Wang, F. Liu, G.-K. Chang, Georgia Institute of Technology;
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . M.Q. Yao, Rockwell Collins;
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A. Adibi and R. Tummala, Georgia Institute of Technology |
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Fatigue Prediction of Electronic Packages Subjected to Random Vibrations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . S. Saravanan, M.I. Sakri and P.V. Mohanram, PSG College of Technology |
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An Improved Closed-Form Solution for Shearing and Peeling Stresses of Trimaterial Assembly in Electronic Packaging
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .D. Sujan, M.V.V. Murthy, A.Y. Hassan, University of Science Malaysia;
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . K.N. Seetharamu, M.S. Ramaiah School of Advanced Studies |
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