Journal of
Microelectronics
and Electronic Packaging
(ISSN # 1551-4897)
Foreword . . . . . . . . . . . . . . . . . . . . . . . . .. . . . . . . . . . . . . . . . . . . . . . . . . . Fred D. Barlow III, Editor-in-Chief |
95 |
REGULAR CONTRIBUTIONS: |
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97 |
| Effect of Design Factors on Microvia Reliability of Flip Chip Ball Grid Array Polymeric Substrates . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . D. Leung, Xilinx; G. Selvaduray, San Jose State University |
104 |
| Transforming a Laser Micromachiner into a Direct-Write Tool for Electronic Materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A.D. Halvorsen, P. Vaidya, M. Robinson and D.L. Schulz, North Dakota State University |
116 |
| Packaging MEMS Die on E-Glass Substrates . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . M. Black, H. Boyett, N. Sanders, J. Weller, R. Dean, R.W. Johnson and M. Kranz, Auburn University |
122 |
| Reflection by Embedded Copper Plane and Volumetric Heating in Laser Microvia Drilling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . C. Zhang, I.A. Salama, Y. Li, N.R. Quick and A. Kar, University of Central Florida |
126 |
| Interconnect Analysis for 80-Gbps Serial Link Design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .J. Fasig, G. Rash, B. Randall, K. Fritz, S. Currie, B. McCoy, . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . P. Riemer, W. Wilkins, B. Gilbert and E. Daniel, Mayo Clinic |
135 |
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