IMAPS - JMEP 4th Quarter 2008

Journal of Microelectronics
and Electronic Packaging
(ISSN # 1551-4897)

Volume 5, Number 4
Fourth Quarter 2008
download pdf of full Journal - 2 mb

Foreword . . . . . . . . . . . . . . . . . . . . . . . . .. . . . . . . . . . . . . . . . . . . . . . . . . . Fred D. Barlow III, Editor-in-Chief	141
INVITED PAPER:
Systematic Characterization of Embossing Processes for LTCC Tapes H.B. de Torres, R. Gade, A. Albrecht and M. Hoffmann, Institute for Micro- and Nanotechnologies	142
Thick Film Accelerometers in LTCC Technology - Design Optimization, Fabrication, and Characterization H. Neubert, Technische Universitat Dresden; Uwe Partsch, Fraunhofer-Institute Ceramic Technologies and Systems; D. Fleischer, M. Gruchow, A. Kamusella, Technische Universitat Dresden; T-Q. Pham, OptiY e.K. Aschaffenburg	150
High Layer Count in LTCC Dual Band Antenna for Galileo GNSS A.D. P. Uhlig, IMST GmbH; D. Manteuffel, Christian-Albrechts-University of Kiel; S. Malkmus, W. C. Heraeus GmbH	156
Power Inductors in Ceramic Multilayer Circuit Boards R. Matz, D. Gotsch, Siemens Corporate Technology; T. Goßner, Walther Meissner Institute; R. Karmazin, R. Manner, and B. Siessegger, Siemens Corporate Technology	161
Morphological and Electrical Properties of Silver Thin Films Sputter Deposited on LTCC Substrates A. Bittner, T. Bohnenberger, R. Engel, H. Seidel, Saarland University; U. Schmid, Vienna University of Technology	169
REGULAR CONTRIBUTIONS:
Predicting the Thermal Conductivity of Low Temperature Co-fired Ceramic with Embedded Thermal via Arrays using the Rule-of-Mixtures and Interface Area Analytical Methods T.S. Vincent, Worcester Polytechnic Institute	174
Second- and Third-Level BGA Solder Joint Reliability of High-End Flip Chip System in Package (FCSiP) S.H. Kim, NEC Electronics America; C. Kakegawa, H. Tabuchi, NEC Electronics Corporation; H. Park, NEC Electronics America	180