IMAPS - JMEP 1st Quarter 2009

Journal of Microelectronics
and Electronic Packaging
(ISSN # 1551-4897)

Volume 6, Number 1
First Quarter 2009
download pdf of full Journal - 183mb

INVITED PAPER:
Silicon on Ceramics - A New Integration Concept for Silicon Devices to LTCC M. Fischer and H. Bartsch de Torres, Institute for Micro- and Nanotechnologies; B. Pawlowski, HITK; R. Gade, Institute for Micro- and Nanotechnologies; S. Barth, HITK; M. Mach, M. Stubenrauch, M. Hoffmann and J. Mu¨ ller, Institute for Micro- and Nanotechnologies	1
Combined Manufacture Methods for High Density LTCC Substrates: Thick Film Screen Printing, Ink Jet, Postfiring Thin Film Processes, and Laser-Drilled Fine Vias A. Albertsen and K. Koiwai, KOA Europe GmbH; K. Kobayashi, T. Oguchi and K. Aruga, KOA Corporation Monozukuri Initiative	6
Enhancement of Fine Line Print Resolution due to Coating of Screen Fabrics D. Schwanke and J. Pohlner, Micro Systems Engineering GmbH; A. Wonisch and T. Kraft, Fraunhofer-Institut fur Werkstoffmechanik (IWM); J. Geng, Plasma Electronic GmbH	13
Validation of Alternative RoHS Compliant Au Pastes for the DuPont LTCC 951 System B. Mussler and D. Schwanke, Micro Systems Engineering GmbH	20
Ceramic Microwave Circuits for Satellite Communication R. Kulke, G. Mollenbeck, C. Gunner and P. Uhlig, IMST GmbH; K.H. Drue, S. Humbla, J. Muller, R. Stephan, D. Stopel, J.F. Trabert, G. Vogt and M.A. Hein, TU-Ilmenau; A. Molke, T. Baras and A.F. Jacob, TU-Hamburg-Harburg; D. Schwanke and J. Pohlner, MSE GmbH; A. Schwarz and G. Reppe, RHe Microsystems GmbH	27
Hermetic Package for Optical MEMS F. Seigneur, Y. Fournier, T. Maeder, P. Ryser and J. Jacot, EPFL, IMT, LPM	32
Multi-Layer Ceramic Packaging for High Frequency Mixed-Signal VLSI ASICS L. Dove, Agilent Technologies, Inc.	38
Miniaturized Embossed Low Resistance Fine Line Coils in LTCC R. Perrone, TU Ilmenau Functionalised Peripherics Group; H. Bartsch de Torres and M. Hoffmann, TU Ilmenau Institute for Micro- and Nanotechnologies; M. Mach and J. Mu¨ller, TU Ilmenau Functionalised Peripherics Group	42
LTCC-Modules with Integrated Ferrite Layers - Strategies for Material Development and Co-Sintering C. Glitzky, T. Rabe, M. Eberstein and W.A. Schiller, Federal Institute for Material Research and Testing (BAM); J. Topfer, University of Applied Sciences Jena; S. Barth, Hermsdorfer Institut fur Technische Keramik e.V.; A. Kipka, W.C. Heraeus GmbH	49
Effects of Silver Paste Application on Embedded Channels in Low Temperature Co-fired Ceramics D.L. Kellis, A.J. Moll and D.G. Plumlee, Boise State University	54
REGULAR CONTRIBUTIONS:
Reliability Assessment and Failure Analysis of G-Helix, a Free-Standing Compliant Off-Chip Interconnect K. Kacker and S.K. Sitaraman, Georgia Institute of Technology	59
Silver-Indium Transient Liquid Phase Sintering for High Temperature Die Attachment P.O. Quintero, University of Puerto Rico; F.P. McCluskey, University of Maryland	66
A Feasibility Study of Lead Free Solders for Level 1 Packaging Applications V. Chidambaram, J. Hald and J. Hattel, Technical University of Denmark	75
The Impact of Glass-to-Resin Ratio and Sample Construction on the CTE of a High Temperature Laminate J. Kuczynski, IBM Corporation; S. Bertling, Park Electrochemical Corporation	83
The Effect of Ultrasonic Frequency on Gold Wire Bondability and Reliability J. Pan and M-N. Le, Cal Poly State University; C.V. Pham, Teledyne Microelectronics	89