IMAPS - JMEP 2nd Quarter 2009

Journal of Microelectronics
and Electronic Packaging
(ISSN # 1551-4897)

Volume 6, Number 2
Second Quarter 2009
download pdf of full Journal - 107mb

INVITED PAPER:
Split-Post and Split-Cylinder Resonator Techniques: A Comparison of Complex Permittivity Measurement of Dielectric Substrates M.D. Janezic, National Institute of Standards and Technology; J. Krupka, Warsaw University of Technology	97
Mixed LTCC and LTTT Technology for Microplasma Generator Fabrication R.K. Yamamoto, Faculdade de Tecnologia de Sao Paulo (FATEC-SP), Universidade de Sao Paulo (LSI-USP); M.R. Gongora-Rubio, Instituto de Pesquisas Tecnologicas do Estado de Sao Paulo (IPT); R.S. Pessoa, Instituto Tecnologico de Aeronautica (ITA-CTA); M.R. Cunha, Instituto de Pesquisas Tecnologicas do Estado de Sao Paulo (IPT); H.S. Maciel, Instituto Tecnologico de Aeronautica (ITA-CTA)	101
Fabrication and Testing of an LTCC Microfluidic Serial Dilution Device M.R. da Cunha, M.R. Gongora-Rubio, I.D. Alvim and M.I. Re, Institute for Technological Research of the State of Sao Paulo	108
Response Predicting LTCC Firing Shrinkage: A Response Surface Analysis Study M. Girardi, G. Barner, C. Lopez, B. Duncan and L. Zawicki, Honeywell Federal Manufacturing & Technologies	114
REGULAR CONTRIBUTIONS:
IMC Growth Mechanisms of SAC305 Lead-Free Solder on Different Surface Finishes and Their Effects on Solder Joint Reliability of FCBGA Packages S.H. Kim, Packaging Engineering Group; H. Tabuchi and C. Kakegawa, Packaging Engineering Group, NEC Electronics Corporation; H. Park, Packaging Engineering Group	119
Qualification Testing of Engineering Camera and Platinum Resistance Thermometer (PRT) Sensors for MSL Project Under Extreme Temperatures to Assess Reliability and to Enhance Mission Assurance R. Ramesham, J.N. Maki and G.C. Cucullu, California Institute of Technology	125
Solder Joint Reliability on 3-D MID LCP Substrates M. Arra, Perlos Oy; E.J. Paakkonen, Tampere University of Technology; I. Harkonen, Perlos Oy	135
Chip on Board Packaging and Thermal Solutions for a 100 W Large Monolithic LED J.G. Liu, D. Xiong and P. Panaccione, Luminus Devices Inc.	143