Overview of Fatigue Failure of Pb-Free Solder Joints in CSP/BGA/Flip-Chip Applications
S.M. Chinen, Raytheon Space and Airborne Systems; M.T. Siniawski, Loyola Marymount University

Vertical Arrays of Copper Nanotube Grown on Silicon Substrate by CMOS Compatible Electrochemical Process for IC
Packaging Applications
D. Choi and F. Khalid, University of Idaho; V. Fucsko, University of Idaho; E.H. Yang, Stevens Institute of Technology; J-R. Park, University of Massachusetts; Y-K. Kim, Korea University

Effects of Die Attachment Induced Stress on the Reliability of a Packaged MEMS Device
C.B. O’Neal, The Institute for Micromanufacturing, Louisiana Tech University; A.P. Malshe, W.F. Schmidt, M.H. Gordon and W.D. Brown, High Density Electronics Center (HiDEC), University of Arkansas; W.F. Schmidt and W.D. Brown, Emeritus

Two-Dimensional Mapping of the Mechanical Properties of Pb-Free Solders for Reliability Optimization
V. Marques, C. Johnston and P.S. Grant, Oxford University