IMAPS - JMEP 2nd Quarter 2011

Journal of Microelectronics
and Electronic Packaging
(ISSN # 1551-4897)

Volume 8, Number 2
Second Quarter 2011
download pdf of full Journal - 75mb

REGULAR CONTRIBUTIONS:
Thin Film on LTCC for Connectivity and Conductivity J.A. Wolf, NNSA’s Kansas City Plant; K.A. Peterson, Sandia National Laboratories	43
X-Ray Inspection of LTCC Devices: Theory and Practice Krzysztof Zaraska, Janina Gaudyn, Adam Bienkowski, Monika Machnik, and Katarzyna Wojcik, Institute of Electron Technology Krakow Division; Marek Dohnalik, Oil and Gas Institute; Andrzej Czerwinski and Mariusz Płuska, Institute of Electron Technology	49
Electrophotographic Printing of RFID Antenna Coils on Cofired and Postfired Ceramics Dustin Buttner and Klaus Kruger, Helmut Schmidt University/University of the German Armed Forces; Beat Zobrist, Zobrist Engineering & Consulting; Andreas Schonberger and Dieter Jung, CTG-PrintTEC GmbH	58
Excimer Laser Ablation of High Aspect Ratio Microvias Using a Novel Sensitizer-Enhanced Photopolymer F. Sarwar, Z. Chen, J. Wu, D.C. Webster, and V.R. Marinov, North Dakota State University	66
Analysis and Optimization of Flow and Heat Transfer in a Liquid Cooling System for an LED Array Samhitha Poonacha, Basawaraj, Hemanth Kumar T.R. Seetharam, and K.N. Seetharamu, PES Institute of Technology	72
An Efficient Implementation of Polymer Viscoelastic Behavior Through a Pseudo Viscoelastic Model Sathyanarayanan Raghavan, Raphael. I. Okereke, and Suresh K. Sitaraman, Computer-Aided Simulation of Packaging Reliability (CASPaR) Lab The George W. Woodruff School of Mechanical Engineering	83