Micross

Journal of Microelectronics and Electronic Packaging
(ISSN # 1551-4897)

Editor-in-Chief:
Jianbiao "John" Pan, Ph.D.
California Polytechnic State University

jmep@imaps.org

Information For Authors

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Editorial objectives and scopes

Journal of Microelectronics and Electronic Packaging is a publication of the International Microelectronics Assembly and Packaging Society (IMAPS) and is dedicated to publishing peer-reviewed papers in research, development, and the application relating to all aspects of microelectronics packaging, interconnect and assembly technologies. This journal covers materials, processes, reliability, design, systems, and applications in microelectronics assembly and packaging technologies of the present and future including 3D integration, Ceramic Interconnect, Soldering, Flip Chip, Wire Bonding, Encapsulation, RF and microwaves, MEMS, Photonics, Power/High Temperature Electronics, Printed Electronics, LED packaging, and Medical Electronics.

The journal will publish papers describing both new and A paper presented at a conference or published in a conference proceedings will be considered for this journal. Short technical notes that clearly pertain to the journal’s mission will also be considered for publication.

The Journal of Microelectronics and Electronic Packaging is published quarterly in print and online by the International Microelectronics Assembly and Packaging Society (IMAPS). The technical content of the articles is the sole responsibility of the authors and the articles do not necessarily reflect the views of the editors or the publisher.

Procedure for Submission:

All submission must be in electronic format, MS WORD format, and should be submitted via IMAPS new peer review software, Scholastica. E-mail to jmep@imaps.org. After a manuscript is peer reviewed and accepted, both Microsoft Word format and PDF format of the paper are required. Tables, graphs, and photographs should be embedded in the body of the paper. The transfer of copyright form must be filled out and submitted to jmep@imaps.org before the paper will be published.

Submit to Journal of Microelectronics and Electronic Packaging

 

AGREEMENT FOR TRANSFER OF COPYRIGHT

Author's submitting papers for review and publication must complete this form and send it with the manuscript. If the submitted paper has been prepared as a "work for hire" for an employer, this form must be signed by the employer.

Download Transfer of Copyright Form
(PDF File)

 
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