Journal of Microelectronics and Electronic Packaging
(ISSN # 1551-4897)

Jianbiao "John" Pan, Ph.D., CQE, CRE
Professor, Industrial & Manufacturing Engineering
California Polytechnic State University

This archival Journal is a publication of the International Microelectronics Assembly and Packaging Society (IMAPS) and is dedicated to publishing peer-reviewed papers in microelectronics, multichip module technologies, electronic packaging, electronic materials, surface mount and other related technologies, interconnections, RF and microwaves, wireless communications, manufacturing, design, test, and reliability.

The Journal of Microelectronics and Electronic Packaging is published quarterly by the International Microelectronics Assembly and Packaging Society (IMAPS). The technical content of the articles is the sole responsibility of the authors and the articles do not necessarily reflect the views of the editors or the publisher

IMAPS members receive complimentary access to the online Journal with their membership as detailed below. Members may download individual papers based on the details of their membership level at no additional cost, unless they have exceeded theiir maximum annual downloads. Non-members must subscribe as outlined below. Both members and nonmembers may pay download fees to gain access to individual papers through IMAPSource (IMAPS On-line Microelectronics Portal).


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JMEP Editorial Board

Jianbiao "John" Pan, Ph.D.
California Polytechnic State University

Associate Editors:
Charles Brown (USA)
Cal-Comp USA

Liangyu Chen, Ph.D. (USA)
Ohio Aerospace Institute/NASA Glenn Research Center

Andrzej Dziedzic, Ph.D. (Poland)
Wroclaw University of Technology

Aicha Elshabini, Ph.D. (USA)
University of Alaska at Anchorage

Yu “Gary” Gu, Ph.D. (USA)
Qorvo, Inc.

Gopal C. Jha (USA)
Avago Technologies

Yufeng Jin, Ph.D. (China)
Peking University

Bruce Kim, Ph.D. (USA)
City College of New York

Yeong Kim, Ph.D. (Korea)
Inha University

Sangril Lee, Ph.D. (USA)

Thomas Marinis, Ph.D. (USA)
Draper Laboratory

Jens Müller, Ph.D. (Germany)
Ilmenau University of Technology

Ivan Ndip, Ph.D. (Germany)
Fraunhofer IZM

Bruce Romenesko, Ph.D. (USA)
Johns Hopkins University/APL

Yanhong Tian, Ph.D. (China)
Harbin Institute of Technology

Gangqiang (Victor) Wang, Ph.D. (USA)
EmiSense Technologies, LLC

Yiliang Wu, Ph.D. (USA)
TE Connectivity




  • Amkor
  • ASE
  • Canon
  • EMD Performance Materials
  • GaN Systems
  • Honeywell
  • Indium
  • Isola Group
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Plexus
  • Qualcomm
  • Quik-Pak
  • Specialty Coating Systems