Journal of Microelectronics and Electronic Packaging
(ISSN # 1551-4897)

Jianbiao "John" Pan, Ph.D., CQE, CRE
Professor, Industrial & Manufacturing Engineering
California Polytechnic State University

This archival Journal is a publication of the International Microelectronics And Packaging Society (IMAPS) and is dedicated to publishing peer-reviewed papers in microelectronics, multichip module technologies, electronic packaging, electronic materials, surface mount and other related technologies, interconnections, RF and microwaves, wireless communications, manufacturing, design, test, and reliability.

The Journal of Microelectronics and Electronic Packaging is published quarterly by the International Microelectronics And Packaging Society (IMAPS). The technical content of the articles is the sole responsibility of the authors and the articles do not necessarily reflect the views of the editors or the publisher

IMAPS members receive complimentary access to the On-line Journal with their membership. Members may download full issues or individual papers at no additional cost. Non-members must subscribe as outlined below, or pay download fees to gain access to individual papers through iKnow (IMAPS On-line Library).

In addition, members and non-members alike can also opt to subscribe to a printed copy and/or a CD-Rom version of JMEP, for an additional annual fee as structured below:

2015 Member Subscription: 4 Printed Editions -- $75
2015 Non-member/Library Subscription: 4 Printed Editions -- $175

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JMEP Editorial Board

Jianbiao "John" Pan, Ph.D.
California Polytechnic State University

Associate Editors:
Charles Brown
Mercury Systems

Liangyu Chen, Ph.D.
Ohio Aerospace Institute/NASA Glenn Research Center

Andrzej Dziedzic, Ph.D. (Poland)
Wroclaw University of Technology

Aicha Elshabini, Ph.D.
University of Idaho

Yu “Gary” Gu, Ph.D.
Qorvo, Inc.

Gopal C. Jha
Avago Technologies

Yufeng Jin, Ph.D.
Peking University

Bruce Kim, Ph.D.
City College of New York

Yeong Kim, Ph.D.
Inha University

Woon-Seong Kwon, Ph.D.

Thomas Marinis, Ph.D.
Draper Laboratory

Jens Müller, Ph.D.
Ilmenau University of Technology

Ivan Ndip, Ph.D.
Fraunhofer IZM

Bruce Romenesko, Ph.D.
Johns Hopkins University/APL

Yanhong Tian, Ph.D.
Harbin Institute of Technology

Gangqiang (Victor) Wang, Ph.D.
Emisense Technologies, LLC

Yiliang Wu, Ph.D.
TE Connectivity




  • Amkor
  • ASE
  • Canon
  • Fastech Synergy Philippines
  • GaN Systems
  • Honeywell
  • Indium
  • Isola Group
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • NEO Tech
  • Palomar
  • Plexus
  • Qualcomm
  • Specialty Coating Systems