Micross

Journal of Microelectronics and Electronic Packaging
(ISSN # 1551-4897)

Editor-in-Chief:
Jianbiao "John" Pan, Ph.D.
California Polytechnic State University

jmep@imaps.org


2015 | 2014 | 2013 | 2012 | 2011 | 2010 | 2009 | 2008 | 2007 | 2006 | 2005 | 2004

Click on any issue below to view the index for that issue.
You can then click on each individual paper.
Journal papers are accessible by IMAPS members at no charge.
Non-members must subscribe or pay to download individual papers using IMAPSource (IMAPS Microelectronics Research Portal)


 

2015 - Volume 12

Number 4 - Fourth Issue 2015
The fourth issue (publishing in December), will feature 7 technical papers.

Number 3 - Third Issue 2015
The third issue (published in September), featuring 8 technical papers.

Number 2 - Second Issue 2015
The second issue (published in June), featuring 7 technical papers.

Number 1 - First Issue 2015
The first issue (published March), featuring 7 technical papers.

2014 - Volume 11

Number 4 - Fourth Issue 2014
The fourth issue (published December), featuring 6 technical papers.

Number 3 - Third Issue 2014
The third issue (published September), featuring 6 technical papers.

Number 2 - Second Issue 2014
The second issue (published June), featuring 6 technical papers.

Number 1 - First Issue 2014
The first issue of 2014 (published March), featuring 7 technical papers.

2013 - Volume 10

Number 4 - Fourth Issue 2013
The fourth issue of 2013, featuring 7 technical papers.

Number 3 - Third Issue 2013
The third issue of 2013 featuring 6 technical papers

Number 2 - Second Issue 2013
The second issue of 2013 featuring 6 technical papers

Number 1 - First Issue 2013
The first issue of 2013 featuring 6 technical papers

2012 - Volume 9

Number 4 - Fourth Issue 2012
The fourth issue of 2012 featuring 6 technical papers

Number 3 - Third Issue 2012
The third issue of 2012 featuring 6 technical papers

Number 2 - Second Issue 2012
The second issue of 2012 featuring 6 technical papers

Number 1 - First Issue 2012
The first issue of 2012 featuring 6 technical papers

2011 - Volume 8

Number 4 - Fourth Issue 2011
The final issue of 2011 featuring 6 technical papers.

Number 3 - Third Issue 2011
The third issue of 2011 featuring 6 technical papers.

Number 2 - Second Issue 2011
The second issue of 2011 featuring 6 technical papers.

Number 1 - First Issue 2011
The first issue of 2011 featuring 6 technical papers.

2010 - Volume 7

Number 4 - Fourth Issue 2010
The final issue of 2010 featuring 7 technical papers.

Number 3 - Third Issue 2010
The third issue of 2010 is a special edition of the Journal of Microelectronics and Electronic Packaging containing 11 of the best papers from the 2010 Device Packaging Conference that have been revised into journal form.

Number 2 - Second Issue 2010
The second issue of 2010 featuring 7 technical papers.

Number 1 - First Issue 2010
The first issue of 2010 featuring 8 technical papers.

2009 - Volume 6

Number 4 - Fourth Issue 2009
The fourth issue of 2009. Special Issue on "microactuators" featuring 8 technical papers and a Guest Editorial

Number 3 - Third Issue 2009
The third issue of 2009 featuring 6 technical papers

Number 2 - Second Issue 2009
The second issue of 2009 featuring 8 technical papers

Number 1 - First Issue 2009
The first issue of 2009 featuring 15 technical papers

2008 - Volume 5

Number 4 - Fourth Issue 2008
Welcome to the newest Associate Editor, Dr. Tae-Sung Oh, Professor at the Department of Materials Science and Engineering of Hongik University, Seoul, Korea.

Number 3 - Third Issue 2008
Welcome to the newest Associate Editor, Dr. Yanhong Tian, from the Harbin Institute of Technology in Harbin, China.

Number 2 - Second Issue 2008
Welcome to the newest member of the Editorial Board, Jens Müller, Ph.D., from the Ilmenau University of Technology in Germany.

Number 1 - First Issue 2008
With this 1st quarter 2008 issue, you will notice a comprehensive change in the formatting and style from what we have published in the past. We hope that you will find this format both pleasing to the eye and more pleasant to read.

2007 - Volume 4

Number 4 - Fourth Issue 2007
This issue features a Special Section on Packaging for Extreme Cold Environments with a Guest Editorial from Rajeshuni Ramesham of NASA's Jet Propulsion Laboratory. This Fourth Issue also includes three invited papers from the CICMT 2007 Conference as well as 1 regular contribution addressing Global-to-Local Modeling and Experiment Investigation of HFCBGA Board-Level Solder Joint Reliability.

Number 3 - Third Issue 2007
Featuring three invited papers from the CICMT 2007 Conference as well as 3 regular contributions addressing High Temperature Spin-on Adhesives..., Failure Analysis of Lead-Free Solder Joints..., and Design and Optimization of Piezoelectric Fans.

Number 2 - Second Issue 2007
Featuring one invited paper from IMAPS 2006, two invited papers from the CICMT 2007 Conference as well as 3 regular contributions addressing RGA Correlation, Lead-Free Solder Joints, and High Reliability Via.

Number 1 - First Issue, 2007
Featuring 6 regular contributions addressing Chip-to-Chip Communications,Epoxies, MEMS Devices for Biological Environments, Thermal Characterization of Stacked Multichip Package, LTCC, and PWB Warpage.

2006 - Volume 3

Number 4 - Fourth Issue, 2006
Featuring two invited papers from the CICMT 2006 Conference as well as 5 regular contributions addressing thermal issues, power loss, 3D packaging, thin films and FCBGA packages.

Number 3 - Third Issue, 2006
Welcome to the third quarterly issue of 2006. Regular readers will notice a different Editor's name with this issue.  Former Editor-in-Chief, Doug Bokil, relinquished the reins to focus on other priorities. I would like to welcome Fred Barlow as the new editor-in-chief of the JMEP. Dr. Barlow is currently an Associate Professor of Electrical Engineering at the University of Idaho and has been an active member of IMAPS since 1991. This change will take effect for the 4th quarter issue of 2006, and I trust that you will be pleased with the quality and content of future issues of the journal.

Number 2 - Second Issue, 2006
Welcome to the second issue of year 2006.
This issue consists of two sections; the first one contains five papers that were submitted directly and the second section contains one paper from the IMAPS Poland-2005 symposium. As is our policy all papers were reviewed by members of our Advisory Board.

Number 1 - First Issue, 2006
Welcome to the first quarterly issue of year 2006. This issue consists of two sections; the first one contains two papers from IMAPS-2005 that were awarded "Best Paper" classification, and the second section contains four papers from the IMAPS-Bruges-2005, Belgium, symposium. As is our policy all papers were reviewed by members of our Advisory Board.

2005 - Volume 2

Number 4 - Fourth Issue, 2005
Welcome to the fourth quarterly issue of year 2005.

It is difficult for me to imagine that I have had the fabulous challenge and opportunity of being the EIC of JMEP for the past two years - time flies when you are having fun!

It is our pleasure to introduce to you three new Associate Editors who have joined our Editorial board. (1) Prof. K N Seetharamu, M S Ramaiah School of Advance Studies, Bangalore, India, (2) Dr. Andrzej Dziedzic, Wroclaw University of Technology, Poland and (3) Mr. Ziliang Wang, Professor of Electronics Packaging with Nanjing Electronic Devices Institute, PRC.

In this issue we have two issues on MEMS applications, one on thermal analysis, and one on non-destructive testing, two on general aspects of plastic packaging and one that revisits Au-Sn intermetallic - something that I first encountered when we were developing Au thermo-sonic wire bonding at RCA during the late 1970s!...

Number 3 - Third Issue, 2005
The JMEP has become global in character, in the sense that the authors contributing papers to the JMEP are now from many countries around our globe as shown below in alphabetical order:

Australia, Austria, Belgium, Canada, Finland, Germany, Hong Kong, India, Ireland, Italy, Japan, Malaysia, Netherlands, P.R. China, Poland, Singapore, Spain, Taiwan and USA.

In keeping with this aspect of globalization our referees are now from the USA, UK and Singapore. Shortly, we plan to add referees from Europe, Japan, India and other countries...

Number 2 - Second Issue, 2005
Thermal management issues continue to motivate us to design better heat-sinks. Papers one through three offer several possible solutions to designing heat-sinks for ever shrinking sizes of electronic products. Paper four deals with the thermal stresses faced by bimaterial structures. Rapid curing of polymer dielectrics using microwave processing is covered in paper five. In paper six, photoimageable thick film inks are used to print line widths of 30 µm and spaces of 100 µm - that is progress.

Number 1 - First Issue, 2005
Welcome to the first issue of year 2005. In this issue, in addition to the "Regular Contributors" and "Best Paper - IMAPS Symposia", we have the privilege of adding a separate section for the "Best Paper - 28th International Conference, IMAPS Poland". This issue echoes and exemplifies what Bruce Romenesko, the current IMAPS President, has written in Advancing Microelectronics, "A word is in order about our increasingly intertwined society".

2004 - Volume 1

Number 4 -- Fourth Issue, 2004
Happy Holidays! This issue covers transfer molding, laser processing, RF IC processing, high temperature components, power microelectronics, BGA and CSP packages, and thermal analysis.

Number 3 -- Third Issue, 2004 - ISSN Now Available
Seven of the nine papers cover a wide spectrum of cooling techniques, processing temperatures, etc.
Starting with this issue we are reintroducing a section titled "Invited Manuscript (Best Paper – IMAPS Symposia)" highlighting papers that have earned "Best of Symposium" or "Best of Session" awards at a recent IMAPS symposium.

Number 2 -- Second Issue, 2004
This issue covers topics from BCB to CSP, to thermal effects, to CBGA and sensors. What would we do without acronyms?!

Number 1 -- First Issue, 2004
Addresses the important and critical thermal characteristics that are associated with the design, testing and evaluation of microelectronics packaging.

 

View the archives of IMAPS past International Journal of Microcircuits and Electronic Packaging

 

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