| The International
Journal of
Microcircuits and Electronic Packaging
is no longer being published. It has been replaced by the
Journal
of Microelectronics
and Electronic Packaging
This Journal was a past publication of the International
Microelectronics And Packaging Society (IMAPS), dedicated
to publishing
peer-reviewed papers in microelectronics. The International
Journal of Microcircuits and Electronic Packaging was
published quarterly by the International Microelectronics
And Packaging Society (IMAPS) from 1998 - 2002. The
technical content of the articles was the sole responsibility
of the
authors
and the articles do not necessarily reflect the views of
the editors or the publisher. IMAPS-US
members receive complimentary access to these archives
with their membership.
In 2004, this
Journal was replaced by the Journal of Microelectronics
and Electronic Packaging.
View
the Archives |
