Microcircuits and Electronic Packaging
Fourth Issue, 1999
"On the Life Prediction and
Accelerated Testing of Solder Joints"
"Fabrication of a High Density MCM-D For a Pixel Detector System Using a BCB/Cu/PbSn Technology" by M. Topper, L. Dietrich, G. Engelmann, S. Fehlberg, P. Gerlach, J. Wolf, O. Ehrmann, K. H. Becks, and H. Reichl. 305
"Thermal analysis of a Power Amplifier Module with Experimental Calibration" by Gary K. Mui, John Lawrence, and Chao-pin Yeh.
"Modeling A Low Cost Wafer Bumping Technique For Flip Chip Application" by Tennyson A. Nguty and Ndy. N. Ekere.
"A Study of Underfill Dispensing Process" by Y. C. Chia, S. H. Lim, K. S. Chian, S. Yi, and W. T. Chen.
"Thermo-Mechanical Design of Microelectronic Packages Through Design-of-Simulations Methodology" by M. N. Variyam and S. K. Sitaraman.
"Thermal Stress Induced
Failures in Adhesive Flip Chip Joints"
"Characteristics and Reliability of No-Flow Underfills For Solder Bumped Flip Chip Assemblies" by John H. Lau, Chris Chang, and Chih-Chiang Chen.
"Ceramic BGA Reliability
Versus Board Side Solder Volume"
"Analyzing Thick Film Multilayer Defects By Using Acoustic Micro Imaging" by G. Harsanyi, J. E. Semmens, S. R. Martell, L. Percsi, and E. Toth.
"The Effect of Polyimide Passivation on The Electromigration in Sputtered Copper Films" by Jiann-Shan Jiang and Bi-Shiou Chiou.
"Pre-Develop Bake End Point Stabilization with Photo-BCB Polymers" by D. Scheck, M. Dibbs, S. Cummings, and P. Garrou.
"MCM-D/C Yield Improvements
Through Effective Diagnostics"
"Generation of Testability of High Density/Speed ATM MCM and Its Library Appraisal Using BCB Thin Film Substrate" by Jun-Hwan Woo, Seung-Gon Kim, Sung-Gun Ji, and Sung-Wan Lim. 418
"Partitioning of Water Between Voids and The Polymer Matrix in A Molding Compound By Proton NMR" by D. L. VanderHart, M. A. Schen, and G. T. Davis.
"A New 16x16 ATM Switching Multichip Module With High Performance" by Youngmin Lee, Dong-Eun Chung, Sang-Pok Lee, Chul-Won Ju, J. H. Na, Seong-Su Park, and Min Kyu Song. 440
"Biaxial Strength, Strength-Size-Scaling, and Fatigue Resistance of Alumina and Aluminum Nitride Substrates" by A. A. Wereszczak, T. P. Kirkland, K. Breder, H. T. Lin, and M. J. Andrews.