Honeywell

The International Journal of

Microcircuits and Electronic Packaging


Second Issue, 2000



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Editorial Board and Executive Council

Editorial

Regular Contributions

"The Effects of the Bondpad and Solder Sphere Sizes on the Ball-Shear Strength of fpBGA Packages" by S. H. K. Lee, N. Fan, J. S. Wu, L. T. Weng, and W. W. M. Siu

"Extension of the Waveguides Taperisation Technique to Broadband Microwave Power Measurements in Planar Circuits" by A. Daulle, P. Xavier, and J. Richard

"Variable Frequency Microwave Curing of 3, 3’, 4, 4’ -Biphenyltetracarboxylic Acid Dianydride/P-Phenylenediamine (BPDA/PPD)" by K. D. Farnsworth, R. N. Manepalli, S. A. Bidstrup Allen, and P. A. Kohl

"Comparison of Paraeletric and Ferroelectric Materials For Applications as Dielectrics in Thin film Integrated Capacitors" by Richard Ulrich, Len Schaper, David Nelms, and Matt Leftwich

"Role of Shock Response Spectrum in Electronic Product Suspension Design" by Suresh Goyal, Edward K. Buratynski, and Gary W. Elko

"Thick Film Piezoresistive Ink: Application to Pressure Sensors" by M-H Lefort, V. Djafari, B. Jouffrey, and Ch. Savary

"GaAs MMICs Using BCB Thin Film Layers for Automotive Radar and Wireless Communication Application" by Yuji Iseki, Eiji Takagi, Naoka Ono, Junko Onomura, Keiichi Yamaguchi, Minoru Amano, Masayki Sugiura, Hiroshi Yamada, Yasushi Shizuki, Takashi Togasaki, Kazuhito Higuchi, and Kazuki Tateyama

"Liquid Cooled LTCC Substrates For High Power Applications" by Torsten Thelemann, Heiko Thust, Gernot Bischoff, and Torsten Kirchner

 

Invited Papers on Thermal Stress Modeling

"Thermal Stress Modeling in Microelectronics and Photonics Packaging, and The Application of the Probabilistic Approach: Review and Extension" by E. Suhir

"Nonlinear Thermal Stress and Flow Modeling in Various Electronic Packages" by R. Panneer Selvam and A. Elshabini

 
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