Honeywell

The International Journal of

Microcircuits and Electronic Packaging


First Issue, 2001



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Editorial

Change in the Editorial Board, a new Editor-in-Chief by A. Elshabini


Regular Contributions

"Nonlinear Fracture Mechanics Analysis of Wafer Level Chip Schale Package Solder Joints with Cracks" by John H. Lau, Stephen H. Pan, and Chris Chang

"Creep Behaviors of Flip Chip on Board with 96.5 Sn-3.5 Ag and 100 In Lead-Free Solder Joints" by John H. Lau and Stephen H. Pan

"Al-Cu Metal Bond Pad Corrosion During Wafer Saw" by Joseph Fauty, Steve Strouse, Jay Yoder, Carlos Acuna, and Philip Evard

"ACES Characterization of Surface Micromachined Microfluidic Devices" by Ryszard J. Pryputniewicz, Paul Galambos, Gordon C. Brown, Cosme Furlong, and Emily J. Pryputniewicz

"Design Considerations for Multilevel Spiral Inductors in RFICs" by R. D. Lutz, V. K. Tripathi, and A. Weisshaar

"On LAP Process Tolerances and Their Impace on Cost and RF Performance" by Michael Scheffler, Didier Cottet, Gerhard Troster, Philippe Poyer, and Gerard Tessier

"Solder Extrusions and Underfill Delaminations: a Remarkable Flip Chip Qualification Experience" by Alfredo Genovese, Fulvio Fontana, Mario Cesana, Saverioo Miliani, and Ermanno Pirovano

"IC Component Sockets: Applications and Challenges" by Weifeng Liu and Michael Pecht

"A Comparison of Fin Geometrics for Heatsinks in Laminar Forced Convection: Part I - Round, Elliptical, and Plate Fins in Staggered and Inline Configurations" by Denpong Soodphakdee, Masud Behnia, and David Copeland

"A Comparison of Fin Geometrics for Heatsinks in Laminar Forced Convection: Part II - Optimization of Staggered Plate Fin Heatsink"
by Denpong Soodphakdee, Masud Behnia, and David Copeland

"Thermal Resistance Measurements and Thermal Transient Analysis of Power Chip Slug-Up and Slug-Down Mounted on HDI Substrate" by Claudio Sartori

 
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