Honeywell

The International Journal of

Microcircuits and Electronic Packaging


Second Issue, 2001



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Editorial

Tough Act to Follow, by Jerry Sergent


Regular Contributions

"Reliability of 96.5Sn-3.5Ag Lead-Free Solder-Bumped Wafer Level Chip Scale Package (WLCSP) on Built-Up Microvia Printed Circuit Board" by John H. Lau and S. W. Ricky Lee

"Embedding a Passive Material Layer in Low Temperature Co-Fired Packaging", by Eric Twiname, G. L. Messing, and C. R. Randall

"Capabilities of a Flip Chip Defects Inspection Method by Using Laser Techniques", by Sheng Lui, Charles Ume, Achyuta Achari, and Juergen Gamalski

"An Analysis of Semiconductor Packages by X-Ray CT Instrument", by Tsumoru Takado, Hiroshi Arita, Yasuhide Ohno, Shuhei Ohnishi, and Akira Hirakimoto

"Effect of the Thickness of a Thermal Interface Material (Solder) on Heat Transfer Between Copper Surfaces", by Deborah D. L. Chung and Xiangcheng Luo"

"Flip Chip Joining on an FR-4 Substrate Using ACFs", by Anne Seppälä, Seppo Pienimaa, and Eero Ristolainen

"Analysis of Laser Bar Bonding Reliability on Different Substrates", by Tapani Alander, Pekka Heino, and Eero Ristolainen

"The Comparison of Properties of Electroless Ni- and Electroplated Ni-Solder Bumps", by Kwang-Llung Lin and Chao-Chyun Huang

 
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