Honeywell

The International Journal of

Microcircuits and Electronic Packaging


Third Issue, 2001



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Editorial
by Dr. Jerry E. Sergent

Regular Contributions

Regular Contributions"High-Density, Low-Loss MOS Capacitors for Integrated RF Decoupling" by F. Roozeboom, R.J.G. Elfrink, Th.G.S.M. Rijks, J.F.C.M. Verhoeven, A. Kemmeren, and J.E.A.M. van den Meerakker

"A New Closed-Form Expression for Capacitance Per Unit Length of VLSI Interconnects" by B. Nauwelaers, H. Ymeri, Karen Maex, D. De roest, and S. Vandenberghe

"Distributed Inductance and Resistance Per Unit Length Formulas for VLSI Interconnects" by B. Nauwelaers, H. Ymeri, Karen Maex, D. De roest, and S. Vandenberghe

"Effect of Underfill on Flip-Chip Solder Bumps: An Experimental Study by Microscopic Moire' Interferometry" by S. Cho and B. Han

"Outgassing Species In Optoelectronic Packages" by Philipp wh Schuessler and Daniel J. Rossit

"Reliability of Eutectic Sn-Pb Solder Bumps and Flip Chip Assemblies" by Xingjia Huang, Christine Kallmayer, Rolf Aschenbrenner, and S.-W. Ricky Lee

"Influence of Alumina Overlay on the Performance of Thin and Thick Film Microstrip Band Pass Filter" by Sunit Rane and Vijaya Puri

"Fine Pitch Probing and Wirebonding and Reliability of Aluminum Capped Copper Bond Pads" by Tu-Anh Tran and Lois Yong

"Reliability and Processability of Sn/Ag/Cu Solder Bumped Flip Chip Components on Organic High Density Substrates" by Minja Penttila and Kauppi Kujala

 
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