The International Journal of

Microcircuits and Electronic Packaging

Fourth Issue, 2001

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by Dr. Jerry E. Sergent

Guest Editorial
by Dr. Jennie S. Hwang

Regular Contributions

"Lead-Free Trends and Requirements and the Need for Global Cooperation" by Kay Nimmo

"The Role of Wetting Ability of Lead-Free Alloys" by Dr. Jennie S. Hwang, Kai Hwa Chu, and Vincent Kho

"Pb-Free Solder Development and Intermetallic Compound Layer Growth in High-Reliability Hybrid Microelectronics" by Paul T. Vianco

"Performance of QFP Lead-Free Solder Joints Under Dynamic Mechanical Loading" by Minna Arra, Dong Ji Xie, and Donkai Shangguan

"Advanced Materials Considerations for Lead-Free Electronics Assembly" by Karl Seelig and David Surasky

"Thermomechanical Response of Anisotropically Conducting Film" by Yung Neng Cheng, Shyong Lee, and Fyong Yuan Huang

" Downward Trimming of Polymer Thick Film Resistors Through High Voltage Pulses" by Y. Srinivisa Rao and M. Satyam

" Comparison of Mechanical Reliability of Three Underfill Materials for Flip Chip Bumps on High Tg PCB for Automotive Applications" by G. Fabbri and C. Sartori

  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems
  • Technic