The International Journal of

Microcircuits and Electronic Packaging

Volume 25, Number 2
Second Quarter, 2002

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Dr. Jerry Sergent

Regular Contributions

Test Support Processors Applied to High Performance Circuits
Q. Zhou and D.C. Keezer

Failure Mechanisms in High Power Optical Device Packaging: Semiconductor Laser Diodes – A Case Study
Ajit R. Dhamdhere, Ajay P. Malshe, S. N. Yedave, W. F. Schmidt, W. D. Brown, and JohnMorales

Drop Testing of Microvia Circuit Board Constructions
Leonard Barrett, Euijun Kim, and Suresh Goyal

STAMPEDE – Standard Techniques for Acoustic Microscopy for Plastic Encapsulated Devices
J. Barton, D. Vanderstraeten, Gust Schols, T. Howard, and P. Groeneveld

Corrected Paper

A Thermomechanical Model for Warpage Prediction of Microelectronic Packages
Eric Egan, Gerard Kelly, Tom O’Donovan, and Michael Peter Kennedy

  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems
  • Technic