The International Journal of

Microcircuits and Electronic Packaging

Volume 25, Number 3
Third Quarter, 2002

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Dr. Jerry Sergent

Regular Contributions

Application of Experimental Airflow Visualization Techniques to Aid the Numerical Modeling of Electronic Component Convective Heat Transfer
Valérie Eveloy, Peter Rodgers, and M. S. J. Hashmi

Semi-Analytical Model for Calculation of Induced Strains in Solder Joints of Underfilled Flip Chip Assemblies
Bart Vandevelde, Eric Beyne, Dirk Vandepitte, and Martine Baelmans

Experimental Research on the Heat Transfer and Flow Performance of a Composite Heat Sink
Yu Xiaoling, Wang Qianlong, Feng Quanke

New Approach to SMD Placement Optimization
Timo Liukkonen and Aulis Tuominen

  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems
  • Technic