Advanced
Technology Workshop on
Packaging & Assembly
of Power LEDs
Download a pdf of the program
EARLY-BIRD REGISTRATION AND HOTEL DEADLINES:
AUGUST 18
, 2006
Dinah's Garden Hotel
Palo Alto, California USA
September 13-15, 2006
(Colocated with the ATW
on Thermal Management)
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Program Committee:
Barbara Landini, FlipChip International
Anwar Mohammed, EoPlex Technologies, Inc.
Doug Hopkins, University of Buffalo
Patrick Durand, Future Electronics
Samuel Graham, Georgia Institute of Technology
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Register | PDF of Program | Hotel | Transportation
Two Workshops - One Location
Register for both ATWs and Save!
Thermal Management: September 10 - 13, 2006
www.imaps.org/thermal
LEDs (Light Emitting Diodes): September 13 - 15, 2006
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Tuesday, September 12
Registration: 4:30 pm – 6:00 pm
Opening Reception: 5:30 pm – 6:00 pm
Wednesday, September 13
Registration: 7:30 am – 7:00 pm
Lunch: 12:15 pm – 1:30 pm
Opening Remarks: 1:45 pm – 2:00 pm
Frank Wall, General Co-Chair
Session 1: Market Drivers and Emerging Issues
2:00 pm – 5:40 pm
Chair: Frank Wall, Philips Lumileds Lighting LLC
Determining Usable Light from High-Power LEDs
Patrick Durand, Future Electronics
Integrating Thermal Characterization with Optometric/Radiometric Measurements for Power LEDs
Yan Zhang, Gabor Farkas, Andras Poppe, Andy Manning, Flomerics Inc.
Break: 3:30 pm – 4:00 pm
Efficient Illumination Design with LEDs
Mark Kaminski, Michael Frate, Breault Research Organization
IMAPS Global Business Council Roadmapping for Packaging Materials: The Roadmapping Purpose and Process
David L. Saums, DS&A LLC
Reception: 5:00 pm – 5:30 pm
Dinner: 5:30 pm – 7:00 pm
Thursday, September 14
Registration: 7:00 am – 5:30 pm
Continental Breakfast: 7:00 am – 8:00 am
Session 2: Substrates and Heat Spreading Materials I
8:00 am – 9:30 am
Chair: Barbara Landini, FlipChip International
Thermal Management Considerations in the Design of High Power LED Products
Henrick Zabawski, Rich Giardina, Heatron, Inc.
Employment of “ALOX” – Aluminum Based Substrate Technology for High Brightness LED (HBL) Packaging
Uri Mirsky, Shimon Neftin, Lev Furer, Micro Components Ltd. (MCL)
Improved Thermal Performance with Polyimide Based Laminate Substrates
Daniel Amey, Gary Briney, David Sutton, DuPont Electronic Technologies
Break: 9:30 am – 10:00 am
Session 3: Power Conversion and Control
10:00 am – 12:00 pm
Chair: Patrick Durand, Future Electronics
Consideration of Semiconductor Technologies and Packaging Options for Cost-Performance Optimization of Simple Power LED Electrical Drive Solutions
Neil Chadderton, Zetex Semiconductors Inc.
Cypress PSoC: Giving Designers the Flexibility and Configurability to Handle Unique Situations in the Volatile LED Marketplace
Gavin Hesse, Patrick Prendergast, Cypress Semiconductor
The Art of Driving High Power LEDs
Neeraj Lal, Chris Richardson, Craig Varga, National Semiconductor
Lunch: 12:00 pm – 1:30 pm
Session 4: Active Cooling
1:30 pm – 3:00 pm
Chair: Anwar Mohammed, EoPlex Technologies, Inc.
Liquid Cooling Enables High-Brightness LED Performance in Projection Applications
Fred Rebarber, Girish Uphadhya, Peng Zhou, Cooligy, Inc. Division of Emerson Network Power
High Heat Flux Dissipation Technologies
Nelson J. Gernert, Mark North, Kevin Wert, Thermacore, Inc.
Embedded Thermoelectric Coolers for Cooling of High Heat Flux LEDs
P. Crocco, Robert Conner, Randal Alley, David Koester, Nextreme Thermal Solutions, Inc.
Break: 3:00 pm – 3:30 pm
Session 5: Substrates and Heat Spreading Materials II
3:30 pm – 5:00 pm
Chair: David Saums, DS&A LLC
All New NRK’s Metal Base CCL for LED
Hiroshi Onodera, Nippon Rika Kogyosho Co., Ltd.
Thermal Modeling of a Refractory Metal Substrate with Improved Thermal Conductivity
Jonathan Margalit, Dincer Bozkaya, Baerbel Kloss, Jonathan Tuck, H.C.Starck Inc.
Optimized Heat Transfer and Homogeneous Color Converting for Ultra High Brightness LED Package
Rafael C. Jordan, Jörg Bauer, Hermann Oppermann, Fraunhofer IZM
Reception: 5:00 pm – 5:30 pm
Dinner: 5:30 pm – 7:00 pm
Friday, September 15
Registration: 7:00 am – 12:00 pm
Continental Breakfast: 7:00 am – 8:00 am
Session 6: Manufacturing Concepts
8:00 am – 10:00 am
Chair: Barbara Landini, FlipChip International
Design and Thermal Performance of a High Power LED Assembly Process
Roy Harvey, Ray Dietz, Diemat, Inc.; Justin Kolbe, The Bergquist Company
High Volume Print Forming for Manufacturing Semiconductor Modules and Packages that Require High Thermal Performance
Philip Rogren, EoPlex Technologies, Inc.
How Temperature Effects Transmission of Silicone Encapsulants
Randall Elgin, Bill Riegler, Rob Thomaier, NuSil Technology LLC
Active Solder: A Route to Higher Thermal Performance
Randall Redd, S-Bond Technologies LLC
Break: 10:00 am – 10:30 am
Session 7: Substrates and Heat Spreading Materials III
10:30 am – 12:00 pm
Chair: Frank Wall, Philips Lumileds Lighting LLC
Designing a Circuit Board Thermal Solution for High Power LEDs using a zSPREADER™ Natural Graphite Heat Spreader
Matt Getz, Advanced Energy Technology Inc.
Temperature Assessment on Natural Convection Assisted High Power LED Array Mounted on Multi Layer Ceramic Metal Package
Jung Kyu Park, Tae Hong Lee, Ki Pyo Hong, Sung Yeol Park, Byeung Gyu Chang, Sun Goo Lee, Samsung Electro-Mechanics
High Performance Ceramic Packaging Solutions for High Brightness LEDs
Steven Gauthier, Kyocera America, Inc.
Workshop Closing Remarks: 12:00 pm
Frank Wall, General Co-Chair
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